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Aluminum-comprising target/backing plate structures 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-001/20
  • B23K-020/00
  • C23C-014/00
출원번호 US-0524131 (2000-03-10)
발명자 / 주소
  • Kim, Jaeyeon
출원인 / 주소
  • Honeywell International Inc.
대리인 / 주소
    Wells St. John P.S.
인용정보 피인용 횟수 : 0  인용 특허 : 48

초록 ▼

The invention includes an aluminum-comprising physical vapor deposition target bonded to an aluminum-comprising backing plate to a bond strength of greater than 10,000 pounds/in2. The invention also includes a method of bonding a first aluminum-comprising mass to a second aluminum-comprising mass. T

대표청구항 ▼

1. A target/backing plate structure comprising an aluminum-comprising physical vapor deposition target bonded to an aluminum-comprising backing plate to a bond strength of greater than 10,500 lbs/in2; wherein the target comprises at least 99.95% aluminum; and wherein the backing plate comprises alum

이 특허에 인용된 특허 (48)

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  3. Okabe Shinji (Saitama JPX) Iwasa Takashi (Saitama JPX) Irie Takushi (Saitama JPX) Furukawa Yuichi (Tochigi JPX) Iwai Ichiro (Tochigi JPX), Aluminum weldment and method of welding aluminum workpieces.
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  4. Brisken Axel F., Apparatus and methods for ultrasonically enhanced intraluminal therapy.
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  5. Mittal Faquir C. (Audubon PA), Apparatus for cooling integrated circuit chips.
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  7. Dumont Christian M. (Bornheim DEX) Schmitz Norberg W. (Euskirchem DEX) Quaderer Hans (Schaan LIX), Composite aluminum plate for physical coating processes and methods for producing composite aluminum plate and target.
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  8. Ewing ; Jr. Joseph H. (Lake Park FL) Safai Saed (Vernon CT), Composite thermal insulation structure.
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  11. Beier Anthony F. ; Kardokus Janine K. ; Strothers Susan D., Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same.
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  24. Koon Robert W. ; Steelman Thomas E., Method for single filament transverse reinforcement in composite prepreg material.
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  25. Edgington Robert E. (120 S. Genesse Bellaire MI 49615), Method for soldering aluminum.
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  26. Mueller John J. (Hilliard OH) Stellrecht David E. (Columbus OH), Method of bonding a sputter target-backing plate assembly assemblies produced thereby.
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  27. Gilman Paul S. ; Kulkarni Shailesh ; Blanchet Jean Pierre,FRX, Method of bonding a sputtering target to a backing plate.
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  28. Ohashi Osamu (Sayama JPX) Sasabe Ken (Tokorozawa JPX), Method of diffusion bonding of aluminum or alumina ceramics.
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  29. Cartossi Nando (Novara IT), Method of heat and pressure bonding of plates of heat conductive metal onto stainless steel surfaces.
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  32. Stellrecht David E. (Columbus OH), Method of welding sputtering target/backing plate assemblies.
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  33. Shah, Ritesh P.; Steele, David E.; Turner, William R.; Beier, Anthony F.; Kardokus, Janine K.; Strothers, Susan D., Ni-plated target diffusion bonded to a backing plate and method of making same.
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  34. Quon William (Alhambra CA) Tanzer Herbert J. (Topanga CA), Phase change cooling of semiconductor power modules.
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  42. Ohhashi Tateo (Kitaibaraka JPX) Fukuyo Hideaki (Kitaibaraka JPX) Sawamura Ichiroh (Kitaibaraka JPX) Nakamura Kenichirou (Kitaibaraka JPX) Fukushima Atsushi (Kitaibaraka JPX) Nagasawa Masaru (Kitaibar, Sputtering target assembly having solid-phase bonded interface.
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  43. Shimomuki Hitoshi,JPX ; Sasaki Fumio,JPX ; Shimizu Eiichi,JPX, Sputtering target assembly production method.
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  44. Dunlop John A. (Veradale WA) Yuan Jun (Santa Clara CA) Kardokus Janine K. (Otis Orchards WA) Emigh Roger A. (Post Falls ID), Sputtering target with ultra-fine, oriented grains and method of making same.
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  45. Masuda Kaoru,JPX ; Taniguchi Shigeru,JPX ; Hiraki Akitoshi,JPX, Sputtering titanium target assembly and producing method thereof.
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  46. Ghosh Amit K. (Thousand Oaks CA) Hamilton C. Howard (Thousand Oaks CA) Paton Neil E. (Allison Park PA), Structural metal matrix composite and method for making same.
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  47. Lee James C. K. (Los Altos Hills CA) Amdahl Gene M. (Atherton CA) Beck Richard (Cupertino CA) Lee Chune (San Francisco CA) Hu Edward (Sunnyvale CA), System for detachably mounting semiconductors on conductor substrate.
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  48. Browne James M. (21 Pillon Reef Pleasant Hill CA 94523), Thermally conductive joining film.
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