초록 ▼

An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate. A plurality of substrate bonding pads a

An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate. A plurality of substrate bonding pads are positioned on the substrate adjacent the integrated circuit die. A decoupling capacitor assembly is mounted on each integrated circuit die and includes a capacitor carrier secured onto the exposed surface of the integrated circuit die and a decoupling capacitor carried by the capacitor carrier. A wire bond extends from the decoupling capacitor assembly to a die pad and from a die pad to a substrate bonding pad.

대표청구항 ▼

1. An integrated circuit chip module comprising: a substrate; an integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate; a plurality of substrate bonding pads positioned on the substrate adjacent the integrated circuit die; and a

1. An integrated circuit chip module comprising: a substrate; an integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate; a plurality of substrate bonding pads positioned on the substrate adjacent the integrated circuit die; and a decoupling capacitor assembly mounted on each integrated circuit die, said decoupling capacitor assembly comprising a capacitor carrier secured onto the exposed surface of the integrated circuit die, and a decoupling capacitor carried by the capacitor carrier; and a wire bond extending from the decoupling capacitor assembly to a die pad and from a die pad to a substrate bonding pad. 2. An integrated circuit chip module according to claim 1, and further comprising a plurality of decoupling capacitor assemblies mounted on said integrated circuit die. 3. An integrated circuit chip module according to claim 1, and further comprising an adhesive securing said decoupling capacitor to said capacitor carrier. 4. An integrated circuit chip module according to claim 1, and further comprising an adhesive securing said capacitor carrier to said integrated circuit die. 5. An integrated circuit chip module according to claim 1, wherein said capacitor carrier is formed from an aluminum nitride substrate. 6. An integrated circuit chip module according to claim 1, wherein a wire bond extends from said decoupling capacitor to a logic pin of said integrated circuit die. 7. An integrated circuit chip module according to claim 2, wherein said plurality of decoupling capacitors are mounted in series along said integrated circuit die. 8. An integrated circuit chip module according to claim 5, wherein said aluminum nitride substrate ranges in thickness from about 5 mil to about 50 mil. 9. A multi-chip module comprising: a ceramic substrate; a plurality of integrated circuit die mounted on the ceramic substrate, each integrated circuit die including die pads and an exposed surface opposite from the ceramic substrate; a plurality of substrate bonding pads mounted on the substrate adjacent the plurality of integrated circuit die; and a plurality of decoupling capacitor assemblies positioned on each integrated circuit die, each decoupling capacitor assembly comprising an aluminum nitride capacitor carrier secured onto the exposed surface of the integrated circuit die, and a decoupling capacitor carried by the capacitor carrier; and at least one wire bond extending from each decoupling capacitor assembly to a logic pin and from a logic pin to a substrate bonding pad. 10. A multi-chip module according to claim 9, wherein said ceramic substrate is formed from a plurality of green tape layers. 11. A multi-chip module according to claim 9, wherein a wire bond extends from said capacitor to a logic pin of said integrated circuit die. 12. A multi-chip module according to claim 9, wherein said aluminum nitride substrate ranges in thickness from about 5 mil to about 50 mil. 13. A multi-chip module according to claim 9, wherein said plurality of decoupling capacitors are mounted in series along said integrated circuit die. 14. A multi-chip module according to claim 9, and further comprising an adhesive securing said decoupling capacitor to said capacitor carrier. 15. A multi-chip module according to claim 9, and further comprising an adhesive securing said decoupling capacitor assembly to said integrated circuit die. 16. A multi-chip module according to claim 9, wherein said plurality of decoupling capacitors are mounted in series along said integrated circuit die.