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A semiconductor laser diode array including a plurality of laser diode bars, each carried by a submount and forming a subassembly. Each subassembly is separated by a flexible or compliant electrically conductive spacer. All connections within the array are by way of a non-fluxed solder, that may be

A semiconductor laser diode array including a plurality of laser diode bars, each carried by a submount and forming a subassembly. Each subassembly is separated by a flexible or compliant electrically conductive spacer. All connections within the array are by way of a non-fluxed solder, that may be hard and/or soft, reflowed in a non-oxidizing atmosphere in a simple mechanical stack fixture to create nearly void-free solder joints with relatively high thermal integrity and electrical conductivity. Flexible electrically conductive spacers are disposed between the subassemblies to eliminate tensile stress on the laser diode bars while providing electrical conductivity between subassemblies. The subassemblies are carried by a thermally conductive dielectric substrate, allowing waste heat generated from the bars to be conducted to a cooling device. The invention eliminates known failure modes in interconnections, minimizing tensile strength on the diode arrays, and increasing the useful life of the array.

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A semiconductor laser diode array including a plurality of laser diode bars, each carried by a submount and forming a subassembly. Each subassembly is separated by a flexible or compliant electrically conductive spacer. All connections within the array are by way of a non-fluxed solder, that may be

A semiconductor laser diode array including a plurality of laser diode bars, each carried by a submount and forming a subassembly. Each subassembly is separated by a flexible or compliant electrically conductive spacer. All connections within the array are by way of a non-fluxed solder, that may be hard and/or soft, reflowed in a non-oxidizing atmosphere in a simple mechanical stack fixture to create nearly void-free solder joints with relatively high thermal integrity and electrical conductivity. Flexible electrically conductive spacers are disposed between the subassemblies to eliminate tensile stress on the laser diode bars while providing electrical conductivity between subassemblies. The subassemblies are carried by a thermally conductive dielectric substrate, allowing waste heat generated from the bars to be conducted to a cooling device. The invention eliminates known failure modes in interconnections, minimizing tensile strength on the diode arrays, and increasing the useful life of the array. area enclosed by the X-shaped projections, the openings, and boundary of the pixel electrode has a planar shape of an equilateral trapezoid or of an acute angle, and except for the X-shaped projections of each pixel electrode, each pixel electrode is in direct contact with the insulating substrate. 12. The liquid crystal display panel of claim 11, wherein a long side of the equilateral trapezoid is convex. 13. The liquid crystal display panel of claim 11, wherein a long side of the equilateral trapezoid is curved. 14. The liquid crystal display panel of claim 11, further comprising: a plurality of X-shaped members located under the respective X-shaped projections; and an insulating layer between the pixel electrode and the X-shaped members, thereby causing the pixel electrode of the X-shaped projections to protrude. 15. The liquid crystal display panel of claim 14, wherein the insulating layer has a double-layered structure. 16. The liquid crystal display panel of claim 14, wherein the X-shaped members are made of metal. 17. The liquid crystal display panel of claim 16, wherein at least two of the X-shaped members are connected to each other.