초록 ▼

An inclinable creeper including a carriaged framework supporting a bed, the bed including an inclinable portion and a mechanism for raising the inclinable portion upon actuation of a lever, for securing the inclinable portion when the lever is not actuated, and for allowing the inclinable portion to

An inclinable creeper including a carriaged framework supporting a bed, the bed including an inclinable portion and a mechanism for raising the inclinable portion upon actuation of a lever, for securing the inclinable portion when the lever is not actuated, and for allowing the inclinable portion to be forcibly lowered when the lever is actuated.

대표청구항 ▼

An inclinable creeper including a carriaged framework supporting a bed, the bed including an inclinable portion and a mechanism for raising the inclinable portion upon actuation of a lever, for securing the inclinable portion when the lever is not actuated, and for allowing the inclinable portion to

An inclinable creeper including a carriaged framework supporting a bed, the bed including an inclinable portion and a mechanism for raising the inclinable portion upon actuation of a lever, for securing the inclinable portion when the lever is not actuated, and for allowing the inclinable portion to be forcibly lowered when the lever is actuated. n the first SPC includes a dielectric layer having a dielectric material that is platable, wherein the first SPC further includes a cylindrical segment of a dielectric material that is nonplatable, and wherein the cylindrical segment extends through a total thickness of the first SPC; and a first through hole through the substrate, wherein the cylindrical segment circumscribes a portion of the first through hole, wherein a metal plating on a wall of the first through hole: is plated to the first laminate, is plated to the second laminate, is not plated to the first SPC, and is not continuous from the first laminate to the second laminate, and wherein no portion of the cylindrical segment extends above or below the dielectric layer. 10. An electrical structure, comprising: a substrate including a first selective plate core (SPC) sandwiched between a first laminate and a second laminate, wherein the first laminate includes a dielectric layer, wherein the second laminate includes a dielectric layer, wherein the first SPC includes a dielectric layer having a dielectric material that is platable, wherein the first SPC further includes a cylindrical segment of a dielectric material that is nonplatable, and wherein the cylindrical segment extends through a total thickness of the first SPC; and a first through hole through the substrate, wherein the cylindrical segment circumscribes a portion of the first through hole, wherein a metal plating on a wall of the first through hole: is plated to the first laminate, is plated to the second laminate, is not plated to the first SPC, and is not continuous from the first laminate to the second laminate, wherein the cylindrical segment has a first exterior surface whose normal is oriented in a first direction parallel to the first through hole, wherein the dielectric layer has a first exterior surface whose normal is oriented in said first direction, and wherein the first exterior surface of the cylindrical segment is coplanar with the first exterior surface of the dielectric layer. 11. The electrical structure of claim 10, wherein the cylindrical segment has a second exterior surface whose normal is oriented in a second direction opposite the first direction, wherein the dielectric layer has a second exterior surface whose normal is oriented in said second direction, and wherein the second exterior surface of the cylindrical segment is coplanar with the second exterior surface of the dielectric layer.