초록 ▼

The present invention is directed to a ventilating or cooling element for airflow cooling in a digital data processing apparatus, and it is particularly suited to such apparatus having a high circuit density, or mounted within a restricted chassis or housing, such as the housing of a web server, or

The present invention is directed to a ventilating or cooling element for airflow cooling in a digital data processing apparatus, and it is particularly suited to such apparatus having a high circuit density, or mounted within a restricted chassis or housing, such as the housing of a web server, or of a storage array device for a network server or web server. The cooling element includes a fan that is disposed at an angle to integrate its cooling air with general circulation or air flow through the chassis. The element may mount on a plate, such as the thermally conductive plate of a heat sink, that is adapted for coupling to the chassis and/or contacting a microprocessor chip, and a fan is disposed on the mounting plate at an angle to cool the plate or chip without creating obstructive cross wind. The mounting plate can be disposed within the middle portion of the chassis. The fan or cooling element can be angled so as to direct airflow towards at least a selected portion of the chassis, e.g. along a flow path to a chassis vent or opening, which may be in the rear portion. The mounting plate can also include one or more a thermally conductive heat dissipation members, such as fins or posts, and the fan may have a side-to-side tilt as well as an inclination with respect to the plane of the plate.

대표청구항 ▼

The present invention is directed to a ventilating or cooling element for airflow cooling in a digital data processing apparatus, and it is particularly suited to such apparatus having a high circuit density, or mounted within a restricted chassis or housing, such as the housing of a web server, or

The present invention is directed to a ventilating or cooling element for airflow cooling in a digital data processing apparatus, and it is particularly suited to such apparatus having a high circuit density, or mounted within a restricted chassis or housing, such as the housing of a web server, or of a storage array device for a network server or web server. The cooling element includes a fan that is disposed at an angle to integrate its cooling air with general circulation or air flow through the chassis. The element may mount on a plate, such as the thermally conductive plate of a heat sink, that is adapted for coupling to the chassis and/or contacting a microprocessor chip, and a fan is disposed on the mounting plate at an angle to cool the plate or chip without creating obstructive cross wind. The mounting plate can be disposed within the middle portion of the chassis. The fan or cooling element can be angled so as to direct airflow towards at least a selected portion of the chassis, e.g. along a flow path to a chassis vent or opening, which may be in the rear portion. The mounting plate can also include one or more a thermally conductive heat dissipation members, such as fins or posts, and the fan may have a side-to-side tilt as well as an inclination with respect to the plane of the plate. l air to said at least one heat exchanger. 4. An equipment enclosure in accordance with claim 1, wherein said equipment comprises at least one of telecommunications equipment, electronic equipment, and optical fiber equipment. 5. An equipment enclosure in accordance with claim 1, further comprising a lower compartment pneumatically isolated from said interior cavity. 6. An equipment enclosure in accordance with claim 5, wherein said lower compartment is adapted to receive at least one of equipment and battery. 7. An equipment enclosure in accordance with claim 4, wherein external ambient air is drawn from an environment external to said interior cavity, through said lower compartment, through said at least one heat exchanger, and back to said external environment. 8. An equipment enclosure comprising: an interior cavity formed within said enclosure; a plurality of equipment compartments positioned within said interior cavity, said plurality of equipment compartments configured to form at least one vertical stack of equipment compartments, each of said plurality of equipment compartments adapted to receive equipment, wherein said equipment comprises heat generating equipment; a lower compartment isolated from said interior cavity, said lower compartment adapted to receive at least one of a battery and equipment; at least one heat exchanger for cooling internal air circulating within said equipment enclosure with external air provided by an external environment, said at least one heat exchanger located outside of said internal cavity, wherein airflow of said external air is isolated from airflow of internal air, each heat exchanger comprising: a first external opening for receiving external ambient air directly from said external environment and indirectly from said external environment through said lower compartment; a second external opening for providing external ambient air to said external environment; a first internal opening for providing internal air to said interior cavity, wherein said internal opening is positioned proximate a bottom of said interior cavity; and at least one air baffle, each one of said at least one air baffle being positioned between a respective pair of vertically adjacent equipment compartments, wherein said at least one baffle prevents said internal air from flowing vertically through adjacent equipment compartments.