Port door removal and wafer handling robotic system
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B65G-049/07
B25J-015/00
출원번호
US-0998115
(1997-12-24)
발명자
/ 주소
Bonora, Anthony C.
Fosnight, William J.
Martin, Raymond S.
출원인 / 주소
Asyst Technologies, Inc.
대리인 / 주소
O'Melveny & Myers LLP
인용정보
피인용 횟수 :
12인용 특허 :
13
초록▼
An I/O minienvirornent including a port door within an I/O port, and a system for removing the port door and pod door coupled thereto, and setting down the pod and port doors at a convenient location within the I/O minienvironment. After wafer processing has been completed and the wafers have been t
An I/O minienvirornent including a port door within an I/O port, and a system for removing the port door and pod door coupled thereto, and setting down the pod and port doors at a convenient location within the I/O minienvironment. After wafer processing has been completed and the wafers have been transferred back through the I/O port to the SMEF pod, the system may retrieve the port and pod doors, and return the port door to their sealing positions within the I/O port and cassette, respectively. In a preferred embodiment, the system for gripping and transporting the port and pod doors may be located on the back end of the end effector of the wafer handling robot within the I/O minienvironment. The back end of the end effector is the end of the end effector opposite that used to transport the wafers and/or cassette.
대표청구항▼
An I/O minienvirornent including a port door within an I/O port, and a system for removing the port door and pod door coupled thereto, and setting down the pod and port doors at a convenient location within the I/O minienvironment. After wafer processing has been completed and the wafers have been t
An I/O minienvirornent including a port door within an I/O port, and a system for removing the port door and pod door coupled thereto, and setting down the pod and port doors at a convenient location within the I/O minienvironment. After wafer processing has been completed and the wafers have been transferred back through the I/O port to the SMEF pod, the system may retrieve the port and pod doors, and return the port door to their sealing positions within the I/O port and cassette, respectively. In a preferred embodiment, the system for gripping and transporting the port and pod doors may be located on the back end of the end effector of the wafer handling robot within the I/O minienvironment. The back end of the end effector is the end of the end effector opposite that used to transport the wafers and/or cassette. is the stop member. 5. The product stocking device of claim 1, wherein the second section further includes a head. 6. The product stocking device of claim 1, wherein the coupling portion is disposed on the first section. 7. The product stocking device of claim 1, wherein the coupling portion is disposed on the stop member. 8. A method of packaging a multiplicity of display packages, each display package having a display aperture, the method comprising: threading a stocking device, having a first section, a second section, a stop member, and a coupling portion, through the display aperture of a plurality of display packages; and coupling the second section of the stocking device to the coupling portion, thereby retaining the plurality of display packages on the first section. 9. A product stocking device for retaining a plurality of display packages comprising: a first section having a proximal and distal end, the first section including a stop member, wherein a profile of the first section includes a shaft and a set of flanges and corresponds to the shape of a euro-style mounting hole; a second section having a proximal and a distal end, wherein the second section is coupled to the first section; a coupling portion adapted to receive the second section; and the second section engages with the coupling portion to retain the plurality of display packages on the first section between the stop member and the second section. 10. A product stocking device retaining at least one display package comprising: a first section having a proximal end, a distal end, and a stop member disposed near the distal end, and an elongate shaft portion extending from the proximal to the distal end; a second section having a proximal end and a distal end, wherein the proximal end of the second section is coupled to the proximal end of the first section; and a coupling portion disposed near the distal end of the first section adapted to receive at least a portion of the second section, wherein the second section engages with the coupling portion thereby retaining the at least one display package between the proximal and distal ends of the first section. 11. The product stocking device of claim 10, wherein the coupling portion is disposed on the first section. 12. A system for packaging a multiplicity of display packages in a shipping container, each display package having a display aperture, the system comprising: at least one stocking device having a first section and a second section, the first section having an elongate shaft portion, and the second section being threadable through the display aperture in the plurality of display packages; the at least one stocking device having a coupling portion disposed on one of the first and second sections; the second section of the at least one stocking device being adapted to engage with the coupling portion, thereby retaining the plurality of display packages on the elongate shaft of the first section. 13. The packaging system of claim 12, wherein the display packages each include an aperture having a profile, and wherein a cross-section of the first section corresponds to the shape of the profile of the apertures. 14. A method of packaging a multiplicity of display packages, each display package having a display aperture, the method comprising: threading a stocking device, having a first section, a second section, a stop member, and a coupling portion, through the display aperture of a plurality of display packages; coupling the second section of the stocking device to the coupling portion, thereby retaining the plurality of display packages on the first section; and placing the plurality of display packages being retained by the stocking device into a container. 15. The method of claim 14, further including aligning a profile of the display aperture with a profile of the first section. 16. A method of shipping a multiplicity of display packages, each display package havi
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이 특허에 인용된 특허 (13)
Takahashi Tetsuo (Akita JPX) Miyauchi Eisaku (Akita JPX) Miyajima Toshihiko (Saku JPX) Watanabe Hideaki (Akita JPX), Apparatus for clean transfer of objects.
Hecht Lewis C. (Vestal NY) Sulger ; deceased Merritt P. (late of Brackney PA by Ellen Sulger ; executrix) Thiele Ernst E. (Endicott NY) Pierson Mark V. (Binghamton NY) Williams Lawrence E. (Binghamto, Dockable interface airlock between process enclosure and interprocess transfer container.
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