초록 ▼

One embodiment comprises a substrate having a top surface for receiving a semiconductor die. According to a disclosed embodiment, an inductor is patterned on the top surface of the substrate. The inductor is easily accessible by connecting its first and second terminals to, respectively, a substrate

One embodiment comprises a substrate having a top surface for receiving a semiconductor die. According to a disclosed embodiment, an inductor is patterned on the top surface of the substrate. The inductor is easily accessible by connecting its first and second terminals to, respectively, a substrate signal bond pad and a semiconductor die signal bond pad. In another disclosed embodiment, an inductor is fabricated within the substrate. The inductor comprises via metal segments connecting interconnect metal segments on the top and bottom surfaces of the substrate. The first and second terminals of the inductor are easily accessible through first and second substrate signal bond pads. One embodiment comprises at least one via in the substrate. The at least one via provides an electrical connection between a signal bond pad of the semiconductor die and a printed circuit board attached to the bottom surface of the substrate.

대표청구항 ▼

One embodiment comprises a substrate having a top surface for receiving a semiconductor die. According to a disclosed embodiment, an inductor is patterned on the top surface of the substrate. The inductor is easily accessible by connecting its first and second terminals to, respectively, a substrate

One embodiment comprises a substrate having a top surface for receiving a semiconductor die. According to a disclosed embodiment, an inductor is patterned on the top surface of the substrate. The inductor is easily accessible by connecting its first and second terminals to, respectively, a substrate signal bond pad and a semiconductor die signal bond pad. In another disclosed embodiment, an inductor is fabricated within the substrate. The inductor comprises via metal segments connecting interconnect metal segments on the top and bottom surfaces of the substrate. The first and second terminals of the inductor are easily accessible through first and second substrate signal bond pads. One embodiment comprises at least one via in the substrate. The at least one via provides an electrical connection between a signal bond pad of the semiconductor die and a printed circuit board attached to the bottom surface of the substrate. g a hevein sequence in laticifers of rubber tree (Hevea brasiliensis), Proc. Natl. Acad. Sci, USA 87: 7633-7637 (1990). Anderson, D., et al., "Chlorophyll a/b-Binding Protein Gene Expression in Cotton," Plant Physiol. 102: 1047-1048 (1993). Umbeck, P., et al. Genetically Transformed Cotton (Gossypium Hirsutum L.) Plants, Bio/Technology 5:263-266 (1987). Blake, M. S., et al. "A Rapid, Sensitive Method for Detection of Alkaline Phosphatase-Conjugated Anti-antibody on Western Blots," Analytical Biochemistry 136:175-179 (1984). Singh, M. et al., "White's Standard Nutrient Solutions," Ann. Bot. 47:133-139 (1981). Raikhel, N. V., et al. "Characterization of a wheat germ agglutinin-like lectin from adult wheat plants," Planta 162:55-61 (1984). Lerner, D. R., et al. "Cloning and characterization of Root-Specific Barley Lectin," Plant Physiol. 91:124-129 (1989). Firoozabady, E., et al. "Transformation of cotton (Gossypium hirsutum L.) By Agrobacterium tumefaciens and regeneration of transgenic plants," Plant Molecular Biology 10: 105-116 (1987). Murashige, T. and Skoog, F. A Revised Medium for Rapid Growth and Bio Assays with Tobacco Tissue Cultures (1962) Physiol. Plant. 15:473497. Schroeder, M. R. and Raikhel, N. V. (1992) Protein Expr. Purif. 3:508-511. Rajguru, S. et al. "Assessment of Resistance of Cotton Transformed with Lectin Genes to Tobacco Budworm" 1998 Proceedings Beltwide Cotton Conferences, San Diego, California, USA Jan. 5-9, 1998. vol. I, (1998) PP490-491, Jan. 1998. Rajguru, S., et al. "Assessment of resistance of cotton transformed with lectin genes to tobacco budworm" Special Report--Arkansas Agricultural Experiment Station 1998 No. 188 pp. 95-98 1998. Willem F. Broekaert et al. "A Chitin-Binding Lectin from Stinging Nettle Rhizomes with Antifungal Properties" Science, vol. 245, Sep. 8, 1989 pp. 1100-1102. Paul R. Burrows et al. Plant-Derived Enzyme Inhibitors and Lectins for Resistance against Plant-Parasitic Nematodes in Transgenic Crops, Pestic. Sci. Feb. 1998 vol. 52, No. 2, pp 176-183. W. J. Peumans et al. "Lectins as Plant Defense Proteins" Plant Physiol. 1995 109:347-352. Zhou, G., et al. "Introduction of Exogenous DNA into Cotton Embryos" Methods In Enzymology, vol. 101, pp 433-481. Chemical Abstracts, vol. 123, No. 21 1995, Abstract No. 281213 Lee, H. I. et al. "Prohevein is poorly processed but shows enhanced resistance to a chitin-binding fungus in transgenic tomato plants" Abstract & Braz. J. Med. Biol. Res. vol. 28, No. 7 1995, pp 743-750. Gatehouse, A. M. R. et al. "Identifying Proteins with Insecticidal Activity: Use of Encoding Genes to Produce Insect-Resistant Transgenic Crops" Pestic. Sci., vol. 52, No. 2, 1998, pp. 165-175.