초록 ▼

A modular personal computer of the present invention includes inlet and outlet openings for a cooling air flow, which are provided on a side portion of a housing disposed opposite to a desktop connection device, with the openings being spaced from each other across a central processing unit, and air

A modular personal computer of the present invention includes inlet and outlet openings for a cooling air flow, which are provided on a side portion of a housing disposed opposite to a desktop connection device, with the openings being spaced from each other across a central processing unit, and air passages extending between the inlet and outlet openings in an overlapping manner. Static pressure near the outlet opening is reduced by a diffuser. Air inside the modular personal computer is drawn out through the outlet opening to create negative pressure inside the modular personal computer, so that the cooling air flow is introduced from the inlet opening.

대표청구항 ▼

A modular personal computer of the present invention includes inlet and outlet openings for a cooling air flow, which are provided on a side portion of a housing disposed opposite to a desktop connection device, with the openings being spaced from each other across a central processing unit, and air

A modular personal computer of the present invention includes inlet and outlet openings for a cooling air flow, which are provided on a side portion of a housing disposed opposite to a desktop connection device, with the openings being spaced from each other across a central processing unit, and air passages extending between the inlet and outlet openings in an overlapping manner. Static pressure near the outlet opening is reduced by a diffuser. Air inside the modular personal computer is drawn out through the outlet opening to create negative pressure inside the modular personal computer, so that the cooling air flow is introduced from the inlet opening. in the differences in electrostatic capacitances of the unit capacitors depend on the dielectric constants of the dielectric layers in the unit capacitors. 9. The multi-layer capacitor of claim 2, wherein the differences in electrostatic capacitances of the unit capacitors depend on the thicknesses of the dielectric layers in the unit capacitors. 10. The multilayer capacitor of claim 2, wherein the differences in electrostatic capacitances of the unit capacitors depend on the dielectric constants and the thicknesses of the dielectric layers in the unit capacitors. 11. The multi-layer capacitor of claim 3, wherein the differences in electrostatic capacitances of the unit capacitors depend on the dielectric constants of the dielectric layers in the unit capacitors. 12. The multi-layer-capacitor of claim 3, wherein the differences in electrostatic capacitances of the unit capacitors depend on the thicknesses of the dielectric layers in the unit capacitors. 13. The multi-layer capacitor of claim 3, wherein the differences in electrostatic capacitances of the unit capacitors depend on the dielectric constants and the thicknesses of the dielectric layers in the unit capacitors. 14. The multi-layer capacitor of claim 4, wherein the differences in electrostatic capacitances of the unit capacitors depend on the dielectric constants of the dielectric layers in the unit capacitors. 15. The multi-layer capacitor of claim 4, wherein the differences in electrostatic capacitances of the unit capacitors depend on the thicknesses of the dielectric layers in the unit capacitors. 16. The multi-layer capacitor of claim 4, wherein the differences in electrostatic capacitances of the unit capacitors depend on the dielectric constants and the thicknesses of the dielectric layers in the unit capacitors. 17. A method for manufacturing a multi-layer capacitor comprising the steps of: preparing green sheets; forming internal electrode layers on the green sheets; laminating and pressing the green sheets with the internal electrode layers formed thereon to thereby provide an unsintered stack of vertically stacked unit capacitors, the stack having two opposite end surfaces; sintering the unsintered stack; and forming external electrodes on the two opposite end surfaces, wherein the pressure employed in pressing the green sheets forming the unit capacitor located at a center of the stack is higher than those employed in pressing the green sheets forming the unit capacitors located at a top end and a bottom end of the stack. 18. The method of claim 17, wherein the pressing pressures monotonously increase from the bottom end to the center of the stack, and then monotonously decrease from the center to the top end of the stack during the laminating and pressing step. 19. A method for manufacturing a multi-layer capacitor comprising the steps of: preparing green sheets; forming internal electrode layers on the green sheets; laminating and compressing the green sheets with the internal electrode layers formed thereon to thereby provide an unsintered stack of vertically stacked unit capacitors, the stack having two opposite end surfaces; sintering the unsintered stack; and forming external electrodes on the two opposite end surfaces, wherein the dielectric constant of the green sheet forming the unit capacitor located at a center of the stack is higher than those of the green sheets forming the unit capacitors located at a top end and a bottom end of the stacks. 20. The method of claim 19, wherein the dielectric constants of the green sheets forming the unit capacitors monotonously increase from the ends to the center of the stack.