Active thermal management of semiconductor devices
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F25B-021/02
F25B-023/12
출원번호
US-0382450
(2003-03-06)
발명자
/ 주소
Law, Jonathan Michael
Harley, Nigel Henry
출원인 / 주소
Texas Instruments Incorporated
대리인 / 주소
Frederick J. Telecky, Jr.
인용정보
피인용 횟수 :
45인용 특허 :
10
초록▼
The present invention facilitates semiconductor cooling by combining a semiconductor die and a thermoelectric cooler into a single, integrated package or system. The thermoelectric cooler is controllably operated so as to dissipate thermal energy generated by the semiconductor die. Active thermal ma
The present invention facilitates semiconductor cooling by combining a semiconductor die and a thermoelectric cooler into a single, integrated package or system. The thermoelectric cooler is controllably operated so as to dissipate thermal energy generated by the semiconductor die. Active thermal management of the package is performed by a controller, which monitors temperature(s) of the semiconductor die and increases or adjusts cooling such that desired performance levels can be obtained. The invention can also thermally manage one or more regions of a semiconductor die and can thermally manage a plurality of semiconductor dies.
대표청구항▼
The present invention facilitates semiconductor cooling by combining a semiconductor die and a thermoelectric cooler into a single, integrated package or system. The thermoelectric cooler is controllably operated so as to dissipate thermal energy generated by the semiconductor die. Active thermal ma
The present invention facilitates semiconductor cooling by combining a semiconductor die and a thermoelectric cooler into a single, integrated package or system. The thermoelectric cooler is controllably operated so as to dissipate thermal energy generated by the semiconductor die. Active thermal management of the package is performed by a controller, which monitors temperature(s) of the semiconductor die and increases or adjusts cooling such that desired performance levels can be obtained. The invention can also thermally manage one or more regions of a semiconductor die and can thermally manage a plurality of semiconductor dies. pled to rotate with the input shaft to input a second portion of the energy from the power source into the fluid contained in the interior region of the outer housing, the first turbine being positioned between the first and second pumps, the first and second pumps being coupled to the housing, the first and second pumps including a plurality of radially extending input blades coupled to the housing, and a second turbine positioned in the interior region of the outer housing in a position spaced apart from the first turbine, the second turbine being positioned to receive energy from the fluid contained in the interior region of the outer housing and to transmit said received energy to the output shaft, the second pump being positioned between the first and second turbines, the fluid following a fluid flow path having a first end defined by a first end surface and a second end defined by a second end surface, the first end surface being configured to rotate relative to the second end surface. 2. The transmission apparatus of claim 1, wherein the input blades have a pitch that is variable. 3. The transmission apparatus of claim 1, wherein the first and second turbines includes a plurality of radially extending output blades configured to rotate with the output shaft. 4. The transmission apparatus of claim 3, wherein the output blades have a pitch that is variable. 5. The transmission apparatus of claim 1, wherein the first and second pumps are axially spaced apart. 6. A transmission apparatus configured to transmit energy from a power source to a work unit, the transmission apparatus comprising an outer housing defining an interior region containing a fluid, an input shaft configured to rotate about a first axis of rotation, the input shaft being coupled to the power source to receive energy therefrom, an output shaft configured to rotate about a second axis of rotation, the output shaft being coupled to the work unit to transmit energy thereto, a first pump positioned in the interior region of the outer housing, the first pump being coupled to rotate with the input shaft to input a first portion of the energy from the power source into the fluid contained in the interior region of the outer housing, a first turbine positioned in the interior region of the outer housing, the first turbine being positioned to receive energy from the fluid contained in the interior region of the outer housing and to transmit said received energy to the output shaft, a second pump positioned in the interior region of the outer housing in a position spaced apart from the first pump, the second pump being coupled to rotate with the input shaft to input a second portion of the energy from the power source into the fluid contained in the interior region of the outer housing, the first turbine being positioned between the first and second pumps, a second turbine positioned in the interior region of the outer housing in a position spaced apart from the first turbine, the second turbine being positioned to receive energy from the fluid contained in the interior region of the outer housing and to transmit said received energy to the output shaft, the second pump being positioned between the first and second turbines, the fluid following a fluid flow path having a first end defined by a first end surface and a second end defined by a second end surface, the first end surface being configured to rotate relative to the second end surface, and an inner housing coupling the first and second turbines to the output shaft. 7. The transmission apparatus of claim 6, wherein the inner and outer housing cooperate to define an outer passage therebetween, the inner housing defines an inner passage, the first and second pumps input energy into the fluid to cause the fluid to flow through the inner and outer passages, the first and second turbines remove energy from the fluid and transfer said energy to the output shaft. 8. A transmission apparatus comprisi
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이 특허에 인용된 특허 (10)
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Mansuria Mohanlal S. (Coral Springs FL) Mosley Joseph M. (Boca Raton FL) Musa Richard D. (Boca Raton FL) Tuozzolo Vito J. (Boca Raton FL), Thermoelectric cooling via electrical connections.
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Prasher, Ravi, Cooling an integrated circuit die with coolant flow in a microchannel and a thin film thermoelectric cooling device in the microchannel.
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