초록 ▼

A heat sink for integrated circuits is limited substantially to heat transfer fins on one or more heat pipe tubes, the tube(s) functioning as a base for the heat sink. The heat pipe tube has a flattened oval cross section and can snap-fit in openings through the fins. The tube is exposed on one side

A heat sink for integrated circuits is limited substantially to heat transfer fins on one or more heat pipe tubes, the tube(s) functioning as a base for the heat sink. The heat pipe tube has a flattened oval cross section and can snap-fit in openings through the fins. The tube is exposed on one side of the heat sink for contact with the heat generating circuit. The fins can be flat or irregular and can have a collar engaging the heat pipe tube. In one example, the heat pipe tube runs perpendicular to vertical fins along the bottom of a standing fin stack. In another embodiment two U-shaped heat pipe tubes carry a layered stack, the bottom of the U-shapes being presented under the lowermost in the stack. A clamp urges the heat sink against the heat source.

대표청구항 ▼

A heat sink for integrated circuits is limited substantially to heat transfer fins on one or more heat pipe tubes, the tube(s) functioning as a base for the heat sink. The heat pipe tube has a flattened oval cross section and can snap-fit in openings through the fins. The tube is exposed on one side

A heat sink for integrated circuits is limited substantially to heat transfer fins on one or more heat pipe tubes, the tube(s) functioning as a base for the heat sink. The heat pipe tube has a flattened oval cross section and can snap-fit in openings through the fins. The tube is exposed on one side of the heat sink for contact with the heat generating circuit. The fins can be flat or irregular and can have a collar engaging the heat pipe tube. In one example, the heat pipe tube runs perpendicular to vertical fins along the bottom of a standing fin stack. In another embodiment two U-shaped heat pipe tubes carry a layered stack, the bottom of the U-shapes being presented under the lowermost in the stack. A clamp urges the heat sink against the heat source. , "Laser beam characterization with use of second order moments: an overview", in Diode Pumped Solid State (DPSS) Lasers: Applications and Issues, OSA TOPS vol. 17, M.W. Dowley, Ed., OSA, Washington, DC, pp. 200-207, 1998. Nemes et al., "Measurement of all ten second-order moments of an astigmatic beam by the use of rotating simple astigmatic (anamorphic) optics", J. Opt. Soc. Am. A 11, 2257-2264 (1994). Nemes et al., "The ten physical parameters associated with a full general astigmatic beam: a Gauss-Schell-model", in Proceedings of the 4-th Int. Workshop on Laser Beams and Optics Characterization, A. Giesen and M. Morin, Eds., VDI Technologiezentrum, Munich, 1997 pp. 92-105. Nemes, "Synthesis of general astigmatic optical systems, the detwisting procedure, and the beam quality factors for general astigmatic laser beams", in Proc. 2-nd Int. Workshop on Laser Beam Characterization, H. Weber et al. Eds., Berlin, 1994, pp. 93-104. Serna et al., "Complete spatial characterization of a pulsed doughnut-type beam by use of spherical optics and a cylindrical lens", J. Opt. Soc. Am. A, 18 (7), 1726-1733 (2001). Siegman, "New developments in laser resonators", SPIE Proc. vol. 1224, pp. 2-14 (1990). Wang et al., "General linear optical coordinate transformations", J. Opt. Soc. Am. A/vol. 17, No. 10/Oct. 2000, pp. 1864-1869.