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A method for forming a thermally isolating gas turbine housing from the significantly high temperatures associated with the combustion gases flowing through the housing. A floating liner is positioned within the turbine housing with an outer baffle arranged about the floating liner and an inner baff

A method for forming a thermally isolating gas turbine housing from the significantly high temperatures associated with the combustion gases flowing through the housing. A floating liner is positioned within the turbine housing with an outer baffle arranged about the floating liner and an inner baffle arranged within the floating liner. The inner and outer baffles are welled or brazed to the floating liner assembly to form a unitary assembly creating a single, continuous cooling passageway within the housing for collecting heat from adjacent the surfaces of the floating liner and expelling the heat into the combustion exhaust stream.

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A method for forming a thermally isolating gas turbine housing from the significantly high temperatures associated with the combustion gases flowing through the housing. A floating liner is positioned within the turbine housing with an outer baffle arranged about the floating liner and an inner baff

A method for forming a thermally isolating gas turbine housing from the significantly high temperatures associated with the combustion gases flowing through the housing. A floating liner is positioned within the turbine housing with an outer baffle arranged about the floating liner and an inner baffle arranged within the floating liner. The inner and outer baffles are welled or brazed to the floating liner assembly to form a unitary assembly creating a single, continuous cooling passageway within the housing for collecting heat from adjacent the surfaces of the floating liner and expelling the heat into the combustion exhaust stream. pressing means presses DUT to the electrode board and maintains electrical and mechanical contact between the DUT terminals and the electrode groups. The DUT guide means hold the DUT while moving so that the relative position of the DUT to the electrode board is changed and the DUT moves between a plurality of specific positions. The electrode board has multiple electrode groups arranged corresponding to terminals of the DUT. The DUT is connected to test circuits corresponding to each of these electrode groups so that terminals of the DUT are connected to the corresponding test circuit when the DUT is placed at multiple specific positions on the above-mentioned electrode board. By means of this structure, the inductance error component of the electrodes can be extensively removed, while facilitating switching between testings of each element of a three-terminal device. Furthermore, by making the surface region of each electrode that can contact DUT a curved surface, such as a cylindrical shape or spherical shape, slight elastic deformation will occur at the region that contacts the DUT. As a result, strong surface pressure can be obtained with a relatively small load and contact resistance is stabilized. n the two electrically conductive layers of about fifty ohms. 3. The probe structure of claim 1, wherein the probe structure is about fifteen millimeters by about fifteen millimeters in size. 4. The probe structure of claim 1, wherein the electrically conductive layer comprises a metal plane. 5. The probe structure of claim 1, wherein the connector is a fifty ohm subminiature version A connector. 6. The probe structure of claim 1, wherein the non electrically conductive back side layer is formed of a solder mask material. 7. The probe structure of claim 1, wherein the non electrically conductive probe side layer is formed of a solder mask material. 8. The probe structure of claim 1, wherein the electrically conductive pins comprise cobra pins. 9. The probe structure of claim 1, wherein the electrically conductive pins comprise pogo pins. 10. The probe structure of claim 1, wherein the electrically conductive contacts on the non electrically conductive probe side layer are disposed at a pitch adapted for testing a ball grid array side of the package substrate. 11. The probe structure of claim 1, wherein the electrically conductive contacts on the non electrically conductive probe side layer are disposed at a pitch adapted for testing a solder on pad die side of the package substrate. 12. The probe structure of claim 1, wherein the electrically conductive contacts on the non electrically conductive probe side layer are disposed at a pitch of one of about eight tenths of millimeter, about one millimeter, and about one and twenty-seven hundredths of a millimeter. 13. A system for testing impedance of a package substrate using time domain reflectometry, the system comprising: a time domain reflectometry test station electrically connected to a probe structure, and the probe structure having, a connector for electrically connecting the probe structure to the time domain reflectometry tester, the connector having a signal conductor and a ground conductor, a layered substrate having, a non electrically conductive back side layer physically connected to the connector, a non electrically conductive probe side layer with electrically conductive contacts, including a centrally disposed signal electrical contact and surrounding ground electrical contacts, an electrically conductive layer disposed between the back side layer and the probe side layer, the electrically conductive layer electrically connected to the ground conductor of the connector, the electrically conductive layer also electrically connected to the ground electrical contacts of the probe side layer electrical contacts, and an electrically conductive via extending from the back side layer to the probe side layer, the electrically conductive via electrically connected to the signal conductor of the connector, the electrically conductive via also electrically connected to the centrally disposed signal electrical contact of the probe side layer electrical contacts, and the electrically conductive via not making electrical connection with the electrically conductive layer, and electrically conductive pins, a first of the electrically conductive pins electrically connected to the signal electrical contact, for making an electrical connection with an electrically conductive structure to be tested on the package substrate, and others of the electrically conductive pins electrically connected to the ground electrical contacts, for making electrical connections with electrically conductive structures on the package substrate that surround the electrically conductive structure to be tested on the package substrate. 14. The system of claim 13, further comprising an XYZ stage for moving the package substrate under the probe structure and thereby enabling the automated testing of multiple electrically conductive structures to be tested on the package substrate. 15. The system of claim 13, further comprising a pattern recognition system for aligning the electrically c