$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Tin whisker-free printed circuit board 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-001/09
출원번호 US-0002714 (2001-11-01)
발명자 / 주소
  • Bokisa, George S.
  • Bishop, Craig V.
  • Kochilla, John R.
출원인 / 주소
  • Atotech Deutschland GmbH
대리인 / 주소
    Renner, Otto, Boisselle & Sklar, LLP
인용정보 피인용 횟수 : 18  인용 특허 : 23

초록

A printed circuit board including electrical circuitry formed on an outer surface of the printed circuit board, the circuitry comprising copper or a copper alloy; a final finish on the circuitry, the final finish including a coating of tin on the copper or copper alloy circuitry; and an alloy cap la

대표청구항

A printed circuit board including electrical circuitry formed on an outer surface of the printed circuit board, the circuitry comprising copper or a copper alloy; a final finish on the circuitry, the final finish including a coating of tin on the copper or copper alloy circuitry; and an alloy cap la

이 특허에 인용된 특허 (23)

  1. Bokisa George S. (North Olmsted OH) Willis William J. (North Royalton OH), Aqueous electroless plating solutions.
  2. Nishimura Shigefumi (Yawata JPX) Fukuda Masao (Takatsuki JPX) Shimizu Yoshiji (Higashiosaka JPX), Bath for immersion plating tin-lead alloys.
  3. Shih Wei-Yan ; Wilson Arthur ; Subido Willmar, Bonding pads for integrated circuits having copper interconnect metallization.
  4. Dodd John R. (Wilmington) Arduengo ; III Anthony J. (Wilmington) King Randal D. (Wilmington DE) Vitale Americus C. (West Chester PA), Complexing agent for displacement tin plating.
  5. Wilson Harold P. (Huron OH), Electrodeposited eutectic tin-bismuth alloy on a conductive substrate.
  6. Mandich Nenad V. (Homewood IL) Krulik Gerald A. (El Toro CA) Singh Rajwant (Fullerton CA), Electroless silver plating composition.
  7. Davis ; Thomas Francis, Electroless tin and tin-lead alloy plating baths.
  8. Davis Thomas F. (Harrisburg PA), Electroless tin and tin-lead alloy plating baths.
  9. Davis Thomas F. (Harrisburg PA), Electroless tin and tin-lead alloy plating baths.
  10. Nakayama Hiroshi (Tokyo JPX) Suzuki Keijiro (Tokyo JPX) Miyata Susumu (Tokyo JPX), Film carrier having tin and indium plated layers.
  11. Melton Cynthia M. (Bolingbrook IL) Growney Alicia (Barrington IL) Fuerhaupter Harry (Lombard IL), Immersion plating of tin-bismuth solder.
  12. Tanimoto Morimasa,JPX ; Suzuki Satoshi,JPX ; Matsuda Akira,JPX ; Sugie Kinya,JPX, Lead material for electronic part, lead and semiconductor device using the same.
  13. Ferrier Donald ; Yakobson Eric, Method for enhancing the solderability of a surface.
  14. Ferrier Donald ; Yakobson Eric, Method for enhancing the solderability of a surface.
  15. Mehta Mahendra C. (Palm Beach Gardens FL), Molded circuit board.
  16. Andrew McIntosh Soutar GB; Peter Thomas McGrath, Printed circuit board manufacture.
  17. Wacker Thomas P. (Schenectady NY) Eichelberger Charles W. (Schenectady NY) Wojnarowski Robert J. (Ballston Lake NY), Self-shielding multi-layer circuit boards.
  18. Kohl Paul A. (Chatham NJ), Solder plating process.
  19. Kosuga Izumi (Tokyo JPX) Fuse Kenichi (Tokyo JPX) Fukunaga Takao (Tokyo JPX) Shiroishi Hirokazu (Tokyo JPX) Kohno Masanao (Kakogawa JPX) Irie Hisao (Takasago JPX), Solder-coated printed circuit board and method of manufacturing the same.
  20. Shimauchi Hidenori (Takatsuki JPX) Suzuki Keijiro (Tokyo JPX), Tin whisker-free tin or tin alloy plated article and coating technique thereof.
  21. Holtzman Abraham M. (Bat Yam ILX) Relis Joseph (Ramat Gan ILX), Use of immersion tin and tin alloys as a bonding medium for multilayer circuits.
  22. Holtzman Abraham M. (Bat Yam ILX) Relis Joseph (Ramat Gan ILX), Use of immersion tin coating as etch resist.
  23. Kadija Igor V. (Cheshire CT) Fister Julius C. (Hamden CT) Winter Joseph (New Haven CT) Parthasarathi Arvind (Hamden CT), Whisker resistant tin coatings and baths and methods for making such coatings.

이 특허를 인용한 특허 (18)

  1. Li, Xueping; Li, Yunjun; Laxton, Peter B.; Roundhill, David Max; Arimura, Hidetoshi, Additives and modifiers for solvent- and water-based metallic conductive inks.
  2. Yaniv, Zvi; Jiang, Nan; Novak, James P.; Fink, Richard L., Applying optical energy to nanoparticles to produce a specified nanostructure.
  3. Yaniv, Zvi; Yang, Mohshi; Laxton, Peter B., Buffer layer for sintering.
  4. Yaniv, Zvi; Yang, Mohshi; Laxton, Peter B., Buffer layer to enhance photo and/or laser sintering.
  5. Abys, Joseph A.; Li, Jingye; Kudrak, Jr., Edward J.; Xu, Chen, Composite coatings for whisker reduction.
  6. Abys, Joseph A.; Li, Jingye; Kudrak, Jr., Edward J.; Xu, Chen, Composite coatings for whisker reduction.
  7. Tsuji, Takayuki; Horikoshi, Toshiyuki; Ito, Masato, Conductor for flexible substrate and fabrication method of same, and flexible substrate using same.
  8. Nye, Aurora Marie Fojas; Du, Jerry G.; Andre, Robert C., Electroless nickel alloy plating bath and process for depositing thereof.
  9. Yau, Yung-Herng; Wang, Xingping; Wang, Cai; Farrell, Robert; Ye, Pingping; Kudrak, Jr., Edward J.; Wengenroth, Karl F.; Abys, Joseph A., Immersion tin silver plating in electronics manufacture.
  10. Li, Yunjun; Roundhill, David Max; Li, Xueping; Laxton, Peter B.; Arimura, Hidetoshi; Yaniv, Zvi, Metallic ink.
  11. Li, Yunjun; Roundhill, David Max; Yang, Mohshi; Pavlovsky, Igor; Fink, Richard Lee; Yaniv, Zvi, Metallic ink.
  12. Walter, Andreas, Method for manufacture of wire bondable and solderable surfaces on noble metal electrodes.
  13. Mathew, Varughese; Acosta, Eddie; Chatterjee, Ritwik; Garcia, Sam S., Micropad for bonding and a method therefor.
  14. Mathew, Varughese; Acosta, Eddie; Chatterjee, Ritwik; Garcia, Sam S., Micropad formation for a semiconductor.
  15. Rateiczak, Mitja; Schlarb, Andreas; Reul, Bernhard; Ziegler, Stefan, Pane having electrical connecting element.
  16. Li, Yunjun; Roundhill, David Max; Yang, Mohshi; Pavlovsky, Igor; Fink, Richard Lee; Yaniv, Zvi, Photo-curing process for metallic inks.
  17. Abed, Ovadia; Ginsberg, Valerie Kaye; Novak, James P., Photosintering of micron-sized copper particles.
  18. Feinstein, Louis H., Techniques for direct encasement of circuit board structures.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로