IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0002714
(2001-11-01)
|
발명자
/ 주소 |
- Bokisa, George S.
- Bishop, Craig V.
- Kochilla, John R.
|
출원인 / 주소 |
|
대리인 / 주소 |
Renner, Otto, Boisselle & Sklar, LLP
|
인용정보 |
피인용 횟수 :
18 인용 특허 :
23 |
초록
▼
A printed circuit board including electrical circuitry formed on an outer surface of the printed circuit board, the circuitry comprising copper or a copper alloy; a final finish on the circuitry, the final finish including a coating of tin on the copper or copper alloy circuitry; and an alloy cap la
A printed circuit board including electrical circuitry formed on an outer surface of the printed circuit board, the circuitry comprising copper or a copper alloy; a final finish on the circuitry, the final finish including a coating of tin on the copper or copper alloy circuitry; and an alloy cap layer on the tin coating, the alloy cap layer comprising at least two immersion-platable metals. The immersion platable metals in the alloy cap layer may be at least two metals selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium and cobalt. The circuitry remains whisker free and solderable.
대표청구항
▼
A printed circuit board including electrical circuitry formed on an outer surface of the printed circuit board, the circuitry comprising copper or a copper alloy; a final finish on the circuitry, the final finish including a coating of tin on the copper or copper alloy circuitry; and an alloy cap la
A printed circuit board including electrical circuitry formed on an outer surface of the printed circuit board, the circuitry comprising copper or a copper alloy; a final finish on the circuitry, the final finish including a coating of tin on the copper or copper alloy circuitry; and an alloy cap layer on the tin coating, the alloy cap layer comprising at least two immersion-platable metals. The immersion platable metals in the alloy cap layer may be at least two metals selected from tin, silver, bismuth, copper, nickel, lead, zinc, indium, palladium, platinum, gold, cadmium, ruthenium and cobalt. The circuitry remains whisker free and solderable. pol coding sequence comprises said nucleic acid. 7. The nucleic acid molecule of claim 1, wherein said nucleotide sequence is the sequence set forth in SEQ ID NO:62. 8. The nucleic acid molecule of claim 6, said nucleic acid further comprising a gag coding sequence and an env coding sequence, wherein adenine-thymidine-guanidine is the gag coding sequence start codon. 9. The plant of claim 3, which plant is selected from the group consisting of: soybean; maize; sugar cane; beet; tobacco; wheat; barley; poppy; rape; sunflower; alfalfa; sorghum; rose; carnation; gerbera; carrot; tomato; lettuce; chicory; pepper; melon; cabbage; oat; rye; cotton; flax; potato; pine; walnut; citrus; hemp; oak; nice; penmia; orchids; Arabidopsis; broccoli; cauliflower; brussel sprouts; onion; garlic; leek; squash; pumpkin; celery; pea; bean; strawberries; grapes; apples; pears; peaches; banana; palm; cocoa; cucumber; pineapple; apricot; plum; sugar beet; lawn grasses; maple; triticale; safflower; peanut; and olive. 10. The nucleic acid molecule of claim 4, wherein the agronomically-significant characteristic is selected from the group consisting of: male sterility; self-incompatibility; foreign organism resistance; improved biosynthetic pathways; environmental tolerance; photosynthetic pathways; and nutrient content. 11. The nucleic acid molecule of claim 4, wherein the agronomically-significant characteristic is selected from the group consisting of: fruit ripening; oil biosynthesis; pigment biosynthesis; seed formation; starch metabolism; salt tolerance; cold/frost tolerance; drought tolerance; tolerance to anaerobic conditions; protein content; carbohydrate content (including sugars and starches); amino acid content; and fatty acid content. 12. A transformed seed containing a recombinant construct comprising the nucleic acid of claim 5. 13. A transformed plant containing a recombinant construct comprising the nucleic acid of claim 5. 14. The nucleic acid molecule of claim 5, wherein a pol coding sequence comprises said nucleic acid. 15. The nucleic acid molecule of claim 14, said nucleic acid further comprising a gag coding sequence and an env coding sequence, wherein adenine-thymidine-guanidine is the gag coding sequence start codon.
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