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PC board having clustered blind vias 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-001/11
  • H01R-012/04
출원번호 US-0060308 (1998-04-14)
발명자 / 주소
  • Henson, Roy
출원인 / 주소
  • FormFactor, Inc.
대리인 / 주소
    Sterne, Kessler, Goldstein & Fox, PLLC
인용정보 피인용 횟수 : 68  인용 특허 : 30

초록

A multilayer printed circuit board having clustered blind vias in power layers to facilitate the routing of signal traces in signal layers. A portion of the blind vias in the power layers are grouped together to form a cluster of blind vias. Corresponding signal routing channels are provided in the

대표청구항

A multilayer printed circuit board having clustered blind vias in power layers to facilitate the routing of signal traces in signal layers. A portion of the blind vias in the power layers are grouped together to form a cluster of blind vias. Corresponding signal routing channels are provided in the

이 특허에 인용된 특허 (30)

  1. Small Gary L. (Los Gatos CA), Adaptable wafer probe assembly for testing ICs with different power/ground bond pad configurations.
  2. Horiuchi Michio (Nagano JPX) Harayama Yoichi (Nagano JPX) Hayashi Koishiro (Nagano JPX), Aluminum nitride circuit board and method of producing same.
  3. Malladi Deviprasad (Campbell CA) Hanson Lee Frederick (Cupertino CA) Kahahane Jean (Redwood City CA), Apparatus for testing flip chip or wire bond integrated circuits.
  4. Pasiecznik ; Jr. John (Malibu CA), Apparatus for testing integrated circuits.
  5. Crane ; Jr. Stanford W. (Boca Raton FL) Portuondo Maria M. (Delray Beach FL), Apparatus having inner layers supporting surface-mount components.
  6. Pedder David John,GBX, Bare die testing.
  7. Hubacher Eric M. (Austin TX), Bumped semiconductor device and method for probing the same.
  8. Khandros Igor Y. ; Eldridge Benjamin N. ; Mathieu Gaetan L. ; Dozier Thomas H. ; Smith William D., Contact carriers (tiles) for populating larger substrates with spring contacts.
  9. Herandez Jorge M. (1920 E. Jarvis Mesa AZ 85202) Simpson Scott S. (Senexet Rd. Woodstock CT 06281) Hyslop Michael S. (4147 W. Victoria La. Chandler AZ 85226), Device for interconnecting integrated circuit packages to circuit boards.
  10. Khandros Igor Y. ; Mathieu Gaetan L., Flexible contact structure with an electrically conductive shell.
  11. Chang Chi S. (Endicott) Hoffarth Joseph G. (Binghamton) Markovich Voya R. (Endwell) Snyder Keith A. (Vestal) Wiley John P. (Vestal NY), High density circuit board and method of making same.
  12. Bross Arthur (Poughkeepsie NY) Walsh Thomas J. (Poughkeepsie NY), High density probe.
  13. Whann Welton B. (San Diego CA) Elizondo Paul M. (Escondido CA), High density probe card.
  14. Shepherd Lloyd T. (Eau Claire WI) August Melvin C. (Chippewa Falls WI) Kruchowski James N. (Eau Claire WI), High power, high density interconnect apparatus for integrated circuits.
  15. Ito Kenji (Tokyo JPX), MCM manufactured by using thin film multilevel interconnection technique.
  16. Eldridge Benjamin N. ; Grube Gary W. ; Khandros Igor Y. ; Mathieu Gaetan L., Making discrete power connections to a space transformer of a probe card assembly.
  17. Bhatt Anilkumar Chinuprasad ; Glatzel Donald Herman ; Moring Allen F. ; Markovich Voya Rista ; Papathomas Kostas ; Russell David John, Manufacturing circuit board assemblies having filled vias.
  18. Schroeder Jack A. (Scottsdale AZ) Winkler Ernel R. (Mesa AZ), Metallization and bonding means and method for VLSI packages.
  19. Lum Thomas F. (Austin TX) Wenzel James F. (Austin TX), Method for probing a semiconductor wafer.
  20. Frankeny Jerome A. (Taylor TX) Frankeny Richard F. (Austin TX) Imken Ronald L. (Round Rock TX) Vanderlee Keith A. (Austin TX), Method of making laminar stackable circuit board structure.
  21. Khandros Igor Y. (Peekskil NY), Method of manufacturing electrical contacts, using a sacrificial member.
  22. Chen Paul T. H. (St. Paul MN), Multilayer printed circuit board with domain partitioning.
  23. Steigerwald Todd W. ; Jones Leroy, Printed circuit board (PCB) including channeled capacitive plane structure.
  24. Chobot Ivan I. (Whitby NY CAX) Covert John A. (Binghamton NY) Haight Randy L. (Waverly NY) Mansfield Keith D. (New Milford PA) Miller Donald W. (Newark Valley NY) Neira Reinaldo A. (Endicott NY) Petr, Printed circuit board or card thermal mass design.
  25. Kamikawa Yoshinori,JPX, Printed wiring board.
  26. Higgins H. Dan (323 E. Redfield Chandler AZ 85225), Probe card apparatus.
  27. Maniwa Ryo (Tokyo JPX) Ohnuki Hidebumi (Tokyo JPX), Process for manufacturing printed wiring boards.
  28. Banerjee Koushik (Chandler AZ) Mallik Debendra (Chandler AZ) Seth Ashok (Chandler AZ), Structure of a thermally and electrically enhanced plastic ball grid array package.
  29. Beaman Brian S. (Hyde Park NY) Doany Fuad E. (Katonah NY) Fogel Keith E. (Bardonia NY) Hedrick ; Jr. James L. (Oakland CA) Lauro Paul A. (Nanuet NY) Norcott Maurice H. (Valley Cottage NY) Ritsko John, Three dimensional high performance interconnection package.
  30. Cray Seymour R. (Chippewa Falls WI) Krajewski Nicholas J. (Elk Mound WI), Three dimensionally interconnected module assembly.

이 특허를 인용한 특허 (68)

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  2. Strid,Eric; Gleason,K. Reed, Active wafer probe.
  3. Morgan,Thomas O.; Jackson,James D.; Roth,Weston C., Apparatuses and methods to route line to line.
  4. Strid, Eric; Campbell, Richard, Calibration structures for differential signal probing.
  5. Muench,Thomas, Circuit carrier and production thereof.
  6. Campbell, Richard; Strid, Eric W.; Andrews, Mike, Differential signal probe with integral balun.
  7. Strid, Eric; Campbell, Richard, Differential signal probing system.
  8. Campbell, Richard L.; Andrews, Michael, Differential waveguide probe.
  9. Burcham, Terry; McCann, Peter; Jones, Rod, Double sided probing structures.
  10. Burcham,Terry; McCann,Peter; Jones,Rod, Double sided probing structures.
  11. Saravis, Darren, Fluid dispenser.
  12. Chan,Benson; Lauffer,John M., High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same.
  13. Andrews, Peter; Hess, David; New, Robert, Interface for testing semiconductors.
  14. Tervo,Paul A.; Cowan,Clarence E., Low-current pogo probe card.
  15. Tervo,Paul A.; Cowan,Clarence E., Low-current pogo probe card.
  16. Schwindt,Randy J., Low-current probe card.
  17. Gleason, K. Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing method using improved contact.
  18. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing method using improved contact.
  19. Gleason, K. Reed; Smith, Kenneth R.; Bayne, Mike, Membrane probing structure with laterally scrubbing contacts.
  20. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth; Lesher, Timothy; Koxxy, Martin, Membrane probing system.
  21. Gleason,Reed; Bayne,Michael A.; Smith,Kenneth; Lesher,Timothy; Koxxy,Martin, Membrane probing system.
  22. Gleason,Reed; Bayne,Michael A.; Smith,Kenneth; Lesher,Timothy; Koxxy,Martin, Membrane probing system.
  23. Smith,Kenneth; Gleason,Reed, Membrane probing system.
  24. Smith,Kenneth; Gleason,Reed, Membrane probing system.
  25. Tervo,Paul A.; Smith,Kenneth R.; Cowan,Clarence E.; Dauphinais,Mike P.; Koxxy,Martin J., Membrane probing system.
  26. Tervo,Paul A.; Smith,Kenneth R.; Cowan,Clarence E.; Dauphinais,Mike P.; Koxxy,Martin J., Membrane probing system.
  27. Gleason, K. Reed; Smith, Kenneth R.; Bayne, Mike, Membrane probing system with local contact scrub.
  28. Gleason,K. Reed; Smith,Kenneth R.; Bayne,Mike, Membrane probing system with local contact scrub.
  29. Gleason,Reed; Bayne,Michael A.; Smith,Kenneth, Method for constructing a membrane probe using a depression.
  30. Hayden, Leonard; Martin, John; Andrews, Mike, Method of assembling a wafer probe.
  31. Gleason, Reed; Bayne, Michael A.; Smith, Kenneth, Method of constructing a membrane probe.
  32. Smith, Kenneth R., Method of replacing an existing contact of a wafer probing assembly.
  33. Strid,Eric; Campbell,Richard, On-wafer test structures for differential signals.
  34. Tervo,Paul A.; Cowan,Clarence E., POGO probe card for low current measurements.
  35. Ji, Joon-Su; Hwang, In-Seok; Lee, Doo-Seon; Kim, Byoung-Joo; Ro, Young-Kyo; Lee, Ho-Yeol, Probe card.
  36. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  37. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  38. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  39. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  40. Hayden,Leonard; Rumbaugh,Scott; Andrews,Mike, Probe for combined signals.
  41. Campbell,Richard L.; Andrews,Michael; Bui,Lynh, Probe for high frequency signals.
  42. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Probe for testing a device under test.
  43. Smith, Kenneth; Jolley, Michael; Van Syckel, Victoria, Probe head having a membrane suspended probe.
  44. Smith,Kenneth; Jolley,Michael; Van Syckel,Victoria, Probe head having a membrane suspended probe.
  45. Schwindt,Randy, Probe holder for testing of a test device.
  46. Smith, Kenneth R.; Hayward, Roger, Probing apparatus with impedance optimized interface.
  47. Smith, Kenneth R., Replaceable coupon for a probing apparatus.
  48. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for high-frequency testing of a device under test.
  49. Gleason, K. Reed; Lesher, Tim; Strid, Eric W.; Andrews, Mike; Martin, John; Dunklee, John; Hayden, Leonard; Safwat, Amr M. E., Shielded probe for testing a device under test.
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  54. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for testing a device under test.
  55. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe for testing a device under test.
  56. Gleason,K. Reed; Lesher,Tim; Strid,Eric W.; Andrews,Mike; Martin,John; Dunklee,John; Hayden,Leonard; Safwat,Amr M. E., Shielded probe with low contact resistance for testing a device under test.
  57. Andrews, Peter; Hess, David, System for testing semiconductors.
  58. Wyrzykowska,Aneta; Kwong,Herman; Difilippo,Luigi, Technique for improving power and ground flooding.
  59. Campbell, Richard, Test structure and probe for differential signals.
  60. Campbell,Richard, Test structure and probe for differential signals.
  61. Hsu, Ming-Cheng, Universal probe card PCB design.
  62. Pfeil, Charles L.; Potts, Henry, Use of breakouts in printed circuit board designs.
  63. Hayden, Leonard; Martin, John; Andrews, Mike, Wafer probe.
  64. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
  65. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
  66. Hayden,Leonard; Martin,John; Andrews,Mike, Wafer probe.
  67. Campbell, Richard, Wideband active-passive differential signal probe.
  68. Horiuchi, Michio; Tokutake, Yasue; Matsuda, Yuichi, Wiring substrate and semiconductor apparatus including the wiring substrate.
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