초록 ▼

A diesel engine injection timing signal interceptor module comprised of a micro-controller-based control module and interface circuitry that intercepts engine speed and position signals from engine sensors and produces output signals which are shifted in time (advanced or retarded) relative to the s

A diesel engine injection timing signal interceptor module comprised of a micro-controller-based control module and interface circuitry that intercepts engine speed and position signals from engine sensors and produces output signals which are shifted in time (advanced or retarded) relative to the sensor signals. By controlling the amount of time shift, the interceptor manipulates fuel injection timing. Use of the interceptor module provides the ability to reduce NOx emissions while achieving acceptable fuel consumption, without having to change the engine's sensors, electronic controller or fuel injectors.

대표청구항 ▼

A diesel engine injection timing signal interceptor module comprised of a micro-controller-based control module and interface circuitry that intercepts engine speed and position signals from engine sensors and produces output signals which are shifted in time (advanced or retarded) relative to the s

A diesel engine injection timing signal interceptor module comprised of a micro-controller-based control module and interface circuitry that intercepts engine speed and position signals from engine sensors and produces output signals which are shifted in time (advanced or retarded) relative to the sensor signals. By controlling the amount of time shift, the interceptor manipulates fuel injection timing. Use of the interceptor module provides the ability to reduce NOx emissions while achieving acceptable fuel consumption, without having to change the engine's sensors, electronic controller or fuel injectors. s for designing a cleaning-apparatus line configuration as claimed in claim 9, wherein in the step of determining the adhesion surface density, the adhesion surface density is determined bywhen ion or molecule species of an element derived from the material are dissolved in the etchant at various given concentrations, determining a surface density of the material adhering to the wafer after immersing the wafer in the etchant at each of the given concentrations for a given period to determine a correlation between the given concentration and the adhesion surface density on the wafer; anddetermining a surface density of the material adhering to the wafer after immersing the wafer in the etchant at the estimated dissolution concentration for a given period on the basis of the correlation.