IPC분류정보
국가/구분 |
United States(US) Patent
등록
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국제특허분류(IPC7판) |
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출원번호 |
US-0160363
(2002-05-31)
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발명자
/ 주소 |
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출원인 / 주소 |
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대리인 / 주소 |
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인용정보 |
피인용 횟수 :
11 인용 특허 :
7 |
초록
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Derivative aircraft and methods for their manufacture. In one embodiment, a derivative aircraft having a derivative wing is derived from a baseline aircraft having a baseline wing. In one aspect of this embodiment, the baseline wing can include an outboard wing portion and an inboard wing portion, t
Derivative aircraft and methods for their manufacture. In one embodiment, a derivative aircraft having a derivative wing is derived from a baseline aircraft having a baseline wing. In one aspect of this embodiment, the baseline wing can include an outboard wing portion and an inboard wing portion, the inboard wing portion having a forward inboard wing portion and an aft inboard wing portion. In a further aspect of this embodiment, the derivative wing can include a wing insert having a spanwise wing insert portion and a chordwise wing insert portion, the chordwise wing insert portion of the wing insert being interposed between the forward inboard wing portion and the aft inboard wing portion of the baseline wing, and the spanwise wing insert portion being interposed between the outboard wing portion and the forward and aft inboard wing portions of the baseline wing.
대표청구항
▼
Derivative aircraft and methods for their manufacture. In one embodiment, a derivative aircraft having a derivative wing is derived from a baseline aircraft having a baseline wing. In one aspect of this embodiment, the baseline wing can include an outboard wing portion and an inboard wing portion, t
Derivative aircraft and methods for their manufacture. In one embodiment, a derivative aircraft having a derivative wing is derived from a baseline aircraft having a baseline wing. In one aspect of this embodiment, the baseline wing can include an outboard wing portion and an inboard wing portion, the inboard wing portion having a forward inboard wing portion and an aft inboard wing portion. In a further aspect of this embodiment, the derivative wing can include a wing insert having a spanwise wing insert portion and a chordwise wing insert portion, the chordwise wing insert portion of the wing insert being interposed between the forward inboard wing portion and the aft inboard wing portion of the baseline wing, and the spanwise wing insert portion being interposed between the outboard wing portion and the forward and aft inboard wing portions of the baseline wing. , 20010200, Hardin et al., 716/004; US-6209120, 20010300, Kurshan et al., 716/005; US-6247165, 20010600, Wohl et al., 716/005; US-6292916, 20010900, Abramovici et al., 714/736; US-6301687, 20011000, Jain et al., 716/003; US-6308299, 20011000, Burch et al., 716/004; US-6321186, 20011100, Yuan et al., 703/015; US-6339837, 20020100, Li, 716/005; US-6341367, 20020100, Downing, 716/016 equency circuit implementations.19. A computer program product, comprising: a computer usable storage medium having computer readable code for designing an electrical circuit, such computer readable code comprising:computer readable code for:obtaining a parameter relating to said circuit to be implemented in a production domain including an integrated circuit element;obtaining said parameter relating to said circuit to be implemented in a prototype domain including a surface mounted circuit element;mapping said parameters between said production and prototype domain implementations;and using said mapping to select said integrated and surface mounted circuit elements to produce said electrical circuit, wherein said selected integrated and surface mounted circuit elements behave in substantially the same way in said production and prototype domain implementations with respect to said mapped parameters.20. A method of designing a circuit in production and prototype domains comprising: obtaining for said production domain at least one parameter relating to a production domain circuit substrate for supporting at least one circuit element;deriving, responsive to said at least one production domain parameters, at least one parameter relating to transmission media associated with the production domain circuit substrate;obtaining for said prototype domain said at least one parameter relating to a prototype domain circuit substrate for supporting at least one circuit element;deriving, responsive to said at least one production domain parameters, at least one parameter relating to transmission media associated the prototype domain circuit substrate; andderiving, responsive to said substrate and transmission media parameters for said production and prototype domains, interchangeable implementations in said production and prototype domains for said at least one circuit element, and models of the interchangeable implementations in said production and prototype domains, wherein a characteristic of one of the models matches a corresponding characteristic of another of said models over a desired frequency range.21. The method of claim 20 wherein said circuit substrates in said production and prototype domains are circuit boards.22. The method of claim 20 wherein said circuit substrates in said production and prototype domains are printed wiring boards.23. The method of claim 20 wherein said circuit substrate in said production and prototype domains are silicon substrates.24. The method of claim 20 wherein said circuit substrates in said production and prototype domains are low temperature co-fired ceramic.25. The method of claim 20 wherein said production domain circuit substrate is a substrate having multiple layers.26. The method of claim 25 wherein a layer of said production domain circuit substrate has a microvia layer.27. The method of claim 20 wherein said implementations are high frequency implementations.28. The method of claim 20 further comprising matching a primary characteristic of one of said models with a corresponding primary characteristic of another of said models over said desired frequency range.29. The method of claim 20 further comprising matching primary and secondary characteristics of one of said models with, respectively, corresponding primary and secondary characteristics of another of said models over said desired frequency range.30. A computer program product, comprising: a computer usable storage medium having computer readable code for designing a circuit in production and prototype domains, such computer readable code comprising:computer readable code for:obtaining for said production domain at least one parameter relating to a production domain circuit substrate for supporting at least one circuit element;deriving, responsive to said at least one production domain parameters, at least one parameter relating to transmission media associated with the production domain circuit substrate;obtaining for said prototype domain said at least one parameter relating to a prototype domain circuit substrate for supporting at least one circuit element;deriving, responsive to said at least one production domain parameters, at least one parameter relating to transmission media associated the prototype domain circuit substrate; andderiving, responsive to said substrate and transmission media parameters for said production and prototype domains, interchangeable implementations in said production and prototype domains for said at least one circuit element, and models of the interchangeable implementations in said production and prototype domains, wherein a characteristic of one of the models matches a corresponding characteristic of another of said models over a desired frequency range.31. Interchangeable circuit implementations, comprising: a circuit implementation in a production domain, including a circuit element and a model of thereof;a circuit implementation in a prototype domain, including a circuit element and a model thereof;wherein a characteristic of one of said models matches a corresponding characteristic of another of said models over a desired frequency range.32. The interchangeable circuit implementations of claim 31 wherein said circuit element in the production domain is an integrated circuit element, and wherein said circuit element in the prototype domain is a surface mounted element.33. The interchangeable circuit implementations of claim 31 wherein said circuit elements are resistors.34. The interchangeable circuit implementations of claim 31 wherein said circuit elements are capacitors.35. The interchangeable circuit implementations of claim 31 wherein said circuit elements are inductors.36. The interchangeable circuit implementations of claim 31 wherein said circuit implementations are tangibly embodied on human readable media.37. The interchangeable circuit implementations of claim 31 wherein said circuit implementations are tangibly embodied on audible media.38. The interchangeable implementations of claim 31 wherein said circuit implementations are tangibly embodied on processor readable media.39. The interchangeable circuit implementations of claim 31 wherein said circuit implementations are tangibly embodied as physical circuitry.40. A method for designing an electrical circuit, comprising: mapping parameters between production and prototype implementations of said electrical circuit in which said production implementation includes an integrated circuit element and said prototype implementation includes a surface mounted circuit element;and using results of said mapping to establish values of said integrated and surface mounted circuit elements so that said selected integrated and surface mounted circuit elements behave in substantially the same way in said production and prototype implementations with respect to said mapped parameters.41. The method of claim 40 wherein said integrated and surface mounted circuit elements are passive elements.42. The method of claim 40 wherein said circuit in at least one of said domains is a circuit board.43. The method of claim 40 wherein said circuit in at least one of said domains is a printed wiring board.44. The method of claim 40 wherein said circuit in at least one of said domains is silicon.45. The method of claim 40 wherein said circuit in at least one of said domains is low temperature co-fired ceramic.46. The method of claim 40 wherein said circuit in at least one of said domains comprises a circuit board having multiple layers.47. The method of claim 46 wherein one of said multiple layers contains microvias.48. The method of claim 40 further comprising deriving models of implementations in said production and prototype domains using said mapping.49. The method of cl aim 40 wherein said obtaining said parameters in said production and prototype domains comprises obtaining primary and secondary characteristics of said integrated and surface mounted elements in said production and prototype domains.50. The method of claim 40 wherein said obtaining said parameters in said production and prototype domains comprises obtaining primary and secondary characteristics of said circuit in said production and prototype domains.51. The method of claim 40 wherein said integrated and surface mounted circuit elements are embodied on processor readable media.52. The method of claim 40 wherein said integrated and surface mounted circuit elements are embodied as physical circuitry.53. The method of claim 40 wherein said obtaining said parameters for said integrated and surface mounted elements for said production and prototype domains comprises obtaining a parameter relating to substrates for respectively supporting said integrated and surface mounted circuit elements.54. The method of claim 53 wherein said obtaining said parameters for said integrated and surface mounted elements for said production and prototype domains comprises obtaining a parameter relating to a transmission media associated with said respective substrates for supporting said integrated and surface mounted circuit elements.55. The method of claim 40 wherein said circuit in said production domain comprises a multi-layer circuit board and said circuit in said prototype domain comprises a single layer circuit board.56. The method of claim 40 wherein the circuit elements are embodied on audible media.57. The method of claim 40 wherein said circuit implementations are high frequency circuit implementations.58. A production implantation of an electrical circuit having at least some integrated components having at least some parameters substantially the same as parameters of a prototype implementation of said electrical circuit having at least some surface mounted components, made by the process comprising: mapping said parameters between said production and prototype implementations;and using results of said mapping to establish values of said integrated and surface mounted circuit components whereby said selected integrated and surface mounted circuit components behave in substantially the same way in said production and prototype implementations with respect to said mapped parameters.59. The production implantation of claim 58 wherein said integrated and surface mounted components are passive components.60. The production implantation of claim 58 at least one of said implementations comprises a circuit board.61. The production implantation of claim 58 wherein at least one of said implementations comprises a printed wiring board.62. The production implantation of claim 58 wherein at least one of said implementations comprises a silicon substrate.63. The production implantation of claim 58 wherein at least one of said implementations comprises a low temperature co-fired ceramic substrate.64. The production implantation of claim 58 wherein at least one of said implementations comprises a circuit board having multiple layers.65. The production implantation of claim 64 wherein one of said multiple layers contains microvias.66. The production implantation of claim 58 further comprising deriving models of said implementations using said mapping.67. The production implantation of claim 58 wherein said parameters comprise primary and secondary characteristics of said integrated and surface mounted components.68. The production implantation of claim 58 wherein said parameters comprise primary and secondary characteristics of said circuit in said implementations.69. The production implantation of claim 58 wherein said integrated and surface mounted circuit components are embodied on processor or readable media.70. The production implantation of claim 58 wherein said integrated and surface mounted circuit components a
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