초록 ▼

Foamed material composed of water and limestone or other mineral dust suspended in a pregenerated foam is applied to the surface of a mine. Dry limestone dust or mineral dust is blended with pregenerated foam or foam generated in situ to produce a mass of foamed material that is highly vesicular but

Foamed material composed of water and limestone or other mineral dust suspended in a pregenerated foam is applied to the surface of a mine. Dry limestone dust or mineral dust is blended with pregenerated foam or foam generated in situ to produce a mass of foamed material that is highly vesicular but that is cohesive enough to be sprayed as a foamed mass against mine wall surfaces and ceilings. The foamed material is applied with a spray device that allows it to adhere to the surfaces of the mine. In another embodiment a dry powder formulation containing limestone dust, dry powder foaming agent and an additive that promotes the production of gas which effervesces upon contact with water can be used. The dry powder formulation can be applied by mixing it with water during application or by applying it to a wet surface. The foamed material can be built to a thickness suitable for the prevention and suppression of fires caused by the ignition of coal dust and methane gas. Once applied, the low water content of the foamed material permits evaporation of the water, resulting in a dry mass of fine, poorly-cohesive, vesicular material that dusts readily.

대표청구항 ▼

Foamed material composed of water and limestone or other mineral dust suspended in a pregenerated foam is applied to the surface of a mine. Dry limestone dust or mineral dust is blended with pregenerated foam or foam generated in situ to produce a mass of foamed material that is highly vesicular but

Foamed material composed of water and limestone or other mineral dust suspended in a pregenerated foam is applied to the surface of a mine. Dry limestone dust or mineral dust is blended with pregenerated foam or foam generated in situ to produce a mass of foamed material that is highly vesicular but that is cohesive enough to be sprayed as a foamed mass against mine wall surfaces and ceilings. The foamed material is applied with a spray device that allows it to adhere to the surfaces of the mine. In another embodiment a dry powder formulation containing limestone dust, dry powder foaming agent and an additive that promotes the production of gas which effervesces upon contact with water can be used. The dry powder formulation can be applied by mixing it with water during application or by applying it to a wet surface. The foamed material can be built to a thickness suitable for the prevention and suppression of fires caused by the ignition of coal dust and methane gas. Once applied, the low water content of the foamed material permits evaporation of the water, resulting in a dry mass of fine, poorly-cohesive, vesicular material that dusts readily. ion Technique Results", International SEMATECH (6 pages) No date. Morikawa, Y., et al., "100nm-alt.PSM Structure Discussion for ArF Lithography", Dai-Nippon Printing Co., Ltd. (15 pages) No date. Ozaki, T., et al., "A 0.15um KrF Lithography for 1Gb DRAM Product Using Highly Printable Patterns and Thin Resist Process", Toshiba Corporation (2 pages) No date. Rhyins, P., et al., "Characterization of Quartz Etched PSM Masks for KrF Lithography at the 100nm Node", Photronics, Inc., MIT Lincoln Lab, ARCH Chemicals, Finle Technologies, KLATencor Corp. (10 pages) No date. Rosenbluth, A., et al., "Optimum Mask and Source Patterns to Print a Given Shape", IBM (17 pages) No date. Schmidt, R., et al., "Impact of Coma on CD Control for Multiphase PSM Designs", AMD, ASML (10 pages) No date. Sewell, H., et al., "An Evaluation of the Dual Exposure Technique", SVG Lithography Systems Inc. (11 pages) No date. Spence, C., et al., "Optimization of Phase-Shift Mask Designs Including Defocus Effects", AMD, Princeton University, Vecor Technologies Inc. (8 pages) No date. Suzuki, A., et al., "Multilevel Imaging System Realizing k1=-.3 Lithography", Canon Inc. (13 pages) No date. Vandenberghe, G., et al., "(Sub-)100nm Gate Patterning Using 248nm Alternating PSM", IMEC, Mentor Graphics (9 pages) No date. Fritze, M., et al., "100-nm Node Lithography with KrF?", MIT Lincoln Lab, Numberical Technologies, Photronics, Arch Chemicals (14 pages) No date. Fukuda, H., et al., "Patterning of Random Interconnect Using Double Exposure of Strong-Type PSMs", Hitachi Central Research Lab (8 pages) No date. Ferguson, R., et al., "Pattern-Dependent Correction