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A surface-modified water-absorbent resin powder is produced continuously with high productivity in a state where the particle diameter distribution is narrow and where the properties are high by a process comprising a polymerizing step, a drying step, a pulverizing step, a classifying step, and a su

A surface-modified water-absorbent resin powder is produced continuously with high productivity in a state where the particle diameter distribution is narrow and where the properties are high by a process comprising a polymerizing step, a drying step, a pulverizing step, a classifying step, and a surface-modifying step, and further, conveying steps of connecting them, wherein the conveying steps include at least two hoppers for storing the water-absorbent resin powder. A powder surface detector used favorably for this process includes a float hung down by a hanging line.

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A surface-modified water-absorbent resin powder is produced continuously with high productivity in a state where the particle diameter distribution is narrow and where the properties are high by a process comprising a polymerizing step, a drying step, a pulverizing step, a classifying step, and a su

A surface-modified water-absorbent resin powder is produced continuously with high productivity in a state where the particle diameter distribution is narrow and where the properties are high by a process comprising a polymerizing step, a drying step, a pulverizing step, a classifying step, and a surface-modifying step, and further, conveying steps of connecting them, wherein the conveying steps include at least two hoppers for storing the water-absorbent resin powder. A powder surface detector used favorably for this process includes a float hung down by a hanging line. ound comprises a tin sulfonate.6. The electroplating solution of claim 1 wherein the bismuth compound comprises a bismuth sulfonate.7. The electroplating solution of claim 1 wherein the tin compound comprises a tin sulfonate and the bismuth compound comprises a bismuth sulfonate.8. The electroplating solution of claim 1 wherein the sulfonic acid electrolyte comprises a soluble alkane or alkanol sulfonic acid containing 1-5 carbon atoms.9. The electroplating solution of claim 1 wherein the sulfonic acid comprises methanesulfonic acid.