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Heat sink/heat spreader structures and methods of manufacture 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-035/34
  • H01L-023/34
  • H01L-021/50
  • H01L-021/46
  • F25B-021/02
출원번호 US-0927331 (2001-08-10)
발명자 / 주소
  • Macris, Chris
대리인 / 주소
    Jensen & Puntigam, P.S.
인용정보 피인용 횟수 : 27  인용 특허 : 17

초록

A heat sink/heat spreader structure utilizing thermoelectric effects to efficiently transport thermal energy from a variety of heat sources including integrated circuits and other electronic components. A method for manufacturing the heat sink/spreader is also disclosed.

대표청구항

A heat sink/heat spreader structure utilizing thermoelectric effects to efficiently transport thermal energy from a variety of heat sources including integrated circuits and other electronic components. A method for manufacturing the heat sink/spreader is also disclosed. module and the designated p

이 특허에 인용된 특허 (17)

  1. Stein Karl-Ulrich (Munich DEX) Herbst Heiner (Haar DEX) Widmann Dietrich (Unterhaching DEX), Arrangement with several thermal elements in series connection.
  2. Newman Robert ; Lee Chu-Chung, Ball grid array package having thermoelectric cooler.
  3. Groover Richard L. (Santa Clara CA) Shu William K. (Sunnyvale CA) Lee Sang S. (Sunnyvale CA) Fujimoto George (Santa Clara CA), Electrically and thermally enhanced package using a separate silicon substrate.
  4. Buynoski Matthew, Heat removal from SOI devices by using metal substrates.
  5. Shiu Shou-Yi,TWX ; Fang Yu-Ping,TWX ; Lui Hon-Hung,TWX, Integrated thermoelectric cooler formed on the backside of a substrate.
  6. Wu Leon Li-Heng, Method for manufacturing a package structure having a heat spreader for integrated circuit chips.
  7. Adelman Lonnie W., Microelectronic thermoelectric device and systems incorporating such device.
  8. Kato Takashi (Sagamihara JPX), Multi-layer semiconductor device.
  9. Chi Cheng-Chung John,TWX ; Huebener Rudolf Peter,DEX ; Tsuei Chang Chyi, On-chip Peltier cooling devices on a micromachined membrane structure.
  10. Nowak Edward D., Polysilicon pillar heat sinks for semiconductor on insulator circuits.
  11. Nowak Edward D., Polysilicon pillar heat sinks for semiconductor on insulator circuits.
  12. Farnworth Warren M. (Nampa ID), Process for manufacturing semiconductor device structures cooled by Peltier junctions and electrical interconnect assemb.
  13. Sakuma ; Isamu ; Yonezu ; Hiroo ; Nishida ; Katsuhiko ; Kamejima ; Taibu n ; Yuasa ; Tonao ; Ueno ; Masayasu ; Uji ; Toshio ; Nannichi ; Yasuo ; Ha yashi ; Izuo, Semiconductor laser device equipped with a silicon heat sink.
  14. Hsia Yukun (Santa Ana CA), Silicon substrate multichip assembly.
  15. Assaderaghi Fariborz ; Hsu Louis Lu-Chen ; Mandelman Jack Allan, Silicon-on-insulator structure for electrostatic discharge protection and improved heat dissipation.
  16. Iwata Yuji,JPX ; Sasa Noriyasu,JPX, Thermoelectric cooling module and method for manufacturing the same.
  17. Buist Richard J. (1802 Clover Trail Richardson TX 75081), Thermoelectric heat pump/power source device.

이 특허를 인용한 특허 (27)

  1. Christy, Alexander C., Apparatus for dissipating thermal energy generated by current flow in semiconductor circuits.
  2. Christy, Alexander C., Arrangement for dissipating thermal energy generated by a light emitting diode.
  3. Lofy, John, Climate controlled seating assembly with sensors.
  4. Lofy, John, Condensation and humidity sensors for thermoelectric devices.
  5. Lofy, John D., Condensation and humidity sensors for thermoelectric devices.
  6. Chrysler, Gregory M.; Maveety, James G., Die having a via filled with a heat-dissipating material.
  7. Brykalski, Michael J.; Terech, John; Petrovski, Dusko, Environmentally-conditioned bed.
  8. Brykalski, Michael J.; Terech, John; Petrovski, Dusko, Environmentally-conditioned bed.
  9. Christy, Alexander C., Flexible thermal energy dissipating and light emitting diode mounting arrangement.
  10. Petrovski, Dusko, Heating and cooling systems for seating assemblies.
  11. Bernstein, Kerry; Sri-Jayantha, Sri M., In-plane silicon heat spreader and method therefor.
  12. Gambino, Jeffrey P.; Graf, Richard S.; Mandal, Sudeep, Integrated circuit cooling using embedded peltier micro-vias in substrate.
  13. Gambino, Jeffrey P.; Graf, Richard S.; Mandal, Sudeep, Integrated circuit cooling using embedded peltier micro-vias in substrate.
  14. Flower,Graham McRae, Integrated circuit device for driving a laser diode with reduced heat transfer and method for fabricating the device.
  15. Feng, Kai Di; Joseph, Alvin Jose; Papae, Donald J.; Wei, Xiaojin, Local area semiconductor cooling system.
  16. Chau,David S.; Chrysler,Gregory M., Localized microelectronic cooling.
  17. Petrovski, Dusko; Zheng, Sihai; Maass, Michael, Method and system for controlling an operation of a thermoelectric device.
  18. Chrysler, Gregory M.; Maveety, James G., Micro-chimney and thermosiphon die-level cooling.
  19. Phan, Khoi A.; Rangarajan, Bharath; Singh, Bhanwar, Mitigating heat in an integrated circuit.
  20. Brykalski, Michael; Marquette, David, Moisture abatement in heating operation of climate controlled systems.
  21. Adar,Eliezer; Gotlib,Vladimir, Semiconductor cooling system and process for manufacturing the same.
  22. Murayama, Kei; Higashi, Mitsutoshi; Sakaguchi, Hideaki; Koike, Hiroko, Semiconductor device having a carbon fiber reinforced resin as a heat radiation plate having a concave portion.
  23. Jewram, Radesh; Misra, Sanjay, Thermally and electrically conductive interconnect structures.
  24. Petrovski, Dusko, Thermoelectric device.
  25. Petrovski, Dusko; Zheng, Sihai; Maass, Michael, Thermoelectric device controls and methods.
  26. Inaba, Masahiko; Clark, Jay Christopher; Comiskey, Brian, Thermoelectric device with internal sensor.
  27. Steinman, Adam Joseph; Bunyak, Kenneth James; Orlando, Bruno Antonio, Vehicle headliner assembly for zonal comfort.
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