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Fluid-cooled heat sink with turbulence-enhancing support pins 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-007/00
출원번호 US-0464080 (1999-12-16)
발명자 / 주소
  • Cannell, Michael J.
  • Cooley, Roger
  • Garman, Richard W.
  • Green, Geoffrey
  • Harrison, Peter N.
  • Walters, Joseph D.
출원인 / 주소
  • The United States of America as represented by the Secretary of the Navy
대리인 / 주소
    Kaiser, Howard
인용정보 피인용 횟수 : 131  인용 특허 : 18

초록

A pin array is connectively disposed between a surface region of a heat sink and a surface region of an entity to be cooled. Cooling fluid flows between the heat sink's surface region and the entity's surface region, the fluid flowing adjacent each surface region and through the space occupied by th

대표청구항

A pin array is connectively disposed between a surface region of a heat sink and a surface region of an entity to be cooled. Cooling fluid flows between the heat sink's surface region and the entity's surface region, the fluid flowing adjacent each surface region and through the space occupied by th

이 특허에 인용된 특허 (18)

  1. Agonafer Dereje (Poughkeepsie NY) Anderson Timothy M. (Poughkeepsie NY) Chrysler Gregory M. (Poughkeepsie NY) Chao-fan Chu Richard (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY) Vader David T. , Convertible cooling module for air or water cooling of electronic circuit components.
  2. Agonafer Dereje (Poughkeepsie NY) Anderson Timothy M. (Poughkeepsie NY) Chrysler Gregory M. (Poughkeepsie NY) Chu Richard C. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY) Vader David T. (Mecha, Convertible heat exchanger for air or water cooling of electronic circuit components and the like.
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  6. Steffen James E. (Woodbury MN) Grannis Vaughn B. (Inver Grove Heights MN) Schroder Frank S. (Afton MN), Heat exchanger.
  7. Reichard Jeffrey A. (Menomonee Falls WI), Heat sink for electrical circuit components.
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