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This invention provides a novel application of a semiconductor light emitting element or light emitting chip preferably disposed on the underside surface of a clear or translucent substrate. In addition connecting wires leading from said element to the perimeter of the substrate connecting to contac

This invention provides a novel application of a semiconductor light emitting element or light emitting chip preferably disposed on the underside surface of a clear or translucent substrate. In addition connecting wires leading from said element to the perimeter of the substrate connecting to contact pads leading to a circuit board. The conductors are deposited on the substrate using thin film technology. Preferably the light emitting element is packaged in a flip chip having connecting bumps only on one side.

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1. A method of illuminating a device having a dial comprising the steps of: providing a substrate sufficiently large to cover a substantial portion of said dial; depositing on said substrate a plurality of conductors using thin film techniques; mounting on said substrate a light emitting ele

1. A method of illuminating a device having a dial comprising the steps of: providing a substrate sufficiently large to cover a substantial portion of said dial; depositing on said substrate a plurality of conductors using thin film techniques; mounting on said substrate a light emitting element so that said light emitting element is electrically coupled to said conductors; and mounting said substrate over said dial with said light emitting element oriented to provide radiation toward said dial. 2. The method of claim 1 wherein said substrate is a transparent glass.3. The method of claim 1 wherein said step of depositing said conductors includes depositing a layer of Cr on a glass, depositing a layer of Ni on the Cr and depositing a layer of Au on the Ni.4. The method of claim 3 further comprising depositing a layer of a protective resin on the Au.5. The method of claim 1 further comprising providing the light emitting element on a flip chip package having connecting bumps on one surface and connecting said bumps to said conductors.6. The method of claim 1 wherein said light emitting elements are lensless so that their light is not concentrated.7. The method of claim 1 further comprising arranging the light emitting elements in groupings of three on said substrate.8. The method of claim 7 wherein each grouping includes a red, a green and a blue element.9. A method of making an illuminating device comprising the steps of: providing a transparent substrate; depositing on said substrate a plurality of conductors using thin film techniques; and mounting on said substrate a light emitting element so that said light emitting element is electrically coupled to said conductors, said conductors providing power to said light emitting element; wherein during said step of depositing includes depositing a layer of Cr on transparent glass, depositing a layer of Ni on the Cr and depositing a layer of a conductive metal on the Ni, said layers extending between said light emitting element and an edge of said substrate. 10. The method of claim 9 wherein said conductive metal is selected from the group consisting of Au, Ag and Cu.11. The method of claim 9 further comprising depositing a layer of a protective resin on the conductive metal.