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Pressure transducer 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01L-007/08
출원번호 US-0570493 (2000-05-12)
발명자 / 주소
  • Mullenborn, Matthias
  • Scheel, Peter
  • Rombach, Pirmin
출원인 / 주소
  • Sonionmems A/S
대리인 / 주소
    Harness, Dickey & Pierce, P.L.C.
인용정보 피인용 횟수 : 59  인용 특허 : 7

초록

The present invention relates to compact solid state silicon-based condenser microphone systems suitable for batch production. The combination of the different elements forming the microphone system is easier and more economical to manufacture compared to any other system disclosed in prior art. In

대표청구항

The present invention relates to compact solid state silicon-based condenser microphone systems suitable for batch production. The combination of the different elements forming the microphone system is easier and more economical to manufacture compared to any other system disclosed in prior art. In

이 특허에 인용된 특허 (7)

  1. Bernstein Jonathan J. (Medfield MA), Acoustic transducer with improved low frequency response.
  2. Sparks Douglas Ray ; Baney William J ; Staller Steven Edward ; Chilcott Dan Wesley ; Siekkinen James Werstler, All-silicon capacitive pressure sensor.
  3. Hietanen Jarmo,FIX ; Rusanen Outi,FIX, Attachment of a micromechanical microphone.
  4. Sooriakumar Kathirgamasundaram ; Koch Daniel J. ; Goldman Kenneth G., Capacitive microphone and method therefor.
  5. O'Boyle John, Micro-electronic assembly including a flip-chip mounted micro-device and method.
  6. Rombach Pirmin,DKX ; Mullenborn Matthias,DKX ; Hansen Ole,DKX ; Heschel Matthias,DKX ; Bouwstra Siebe,DKX ; Amskov Gravad Maja,DKX ; Hvims Henrik Laurids,DKX, Solid state silicon-based condenser microphone.
  7. Wilson David T. (Billerica MA) Tancrell Roger H. (Cambridge MA), Transducer.

이 특허를 인용한 특허 (59)

  1. Conti, Sebastiano; Vigna, Benedetto; Cortese, Mario Francesco, Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof.
  2. Conti, Sebastiano; Vigna, Benedetto; Cortese, Mario Francesco, Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof.
  3. Conti, Sebastiano; Vigna, Benedetto; Cortese, Mario Francesco, Assembly of a capacitive acoustic transducer of the microelectromechanical type and package thereof.
  4. Ho, Tzong-Che; Chen, Lung-Tai; Lee, Yao-Jung; Huang, Chao-Ta; Pan, Li-Chi; Hsieh, Yu-Sheng, Capacitive transducer and fabrication method.
  5. Chen, Jien-Ming; Huang, Chin-Wen; Wang, Chin-Hung; Lee, Hsin-Li, Capacitive transducer manufacturing method, and multi-function device.
  6. Tajima,Toshifumi; Nishiguchi,Toshiyuki; Saito,Nobuo; Morita,Akira, Chip microphone and method of making same.
  7. Krüger, Hans; Stelzl, Alois, Component arrangement provided with a carrier substrate.
  8. Leidl, Anton; Pahl, Wolfgang; Wolff, Ulrich, Electrical module comprising a MEMS microphone.
  9. Yen, Kai-Hsiang; Chen, Jen-Yi; Sung, Po-Hsun, Electro-acoustic sensing device.
  10. Bauer, Christian; Krueger, Hans; Stelzl, Alois, Encapsulated electrical component and production method.
  11. Krueger,Hans; Portmann,J��rgen; Nicolaus,Karl; Feiertag,Gregor; Stelzl,Alois, Encapsulated electronic component and production method.
  12. Weigold, Jason W.; Martin, John R.; Brosnihan, Timothy J., Integrated microphone.
  13. Johari-Galle, Houri; Judy, Michael W., MEMS device with stress relief structures.
  14. Zhou, Tiansheng, MEMS micromirror and micromirror array.
  15. Leidl, Anton; Pahl, Wolfgang; Wolff, Ulrich, MEMS microphone.
  16. Pahl, Wolfgang, MEMS microphone, production method and method for installing.
  17. Zhou, Tiansheng, MEMS optical device.
  18. Leidl, Anton; Krueger, Hans; Stelzl, Alois; Pahl, Wolfgang; Seitz, Stefan, MEMS package and method for the production thereof.
  19. Pahl, Wolfgang; Leidl, Anton; Seitz, Stefan; Krueger, Hans; Stelzl, Alois, MEMS package and method for the production thereof.
  20. Kaanta, Bradley C.; Jia, Kemiao, Mechanically isolated MEMS device.
  21. Pahl, Wolfgang, Method for applying a structured coating to a component.
  22. Silverbrook, Kia; Mallinson, Samuel George, Method of fabricating a integrated pressure sensor.
  23. Schubert, Paul C., Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby.
  24. Shubert, Paul C., Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby.
  25. Johannsen, Ib; Larsen, Niels Bent; Mullenborn, Matthias; Rombach, Pirmin Hermann Otto, Method of providing a hydrophobic layer and condenser microphone having such a layer.
  26. Schrank, Franz; Schrems, Martin, Micro electro mechanical system (MEMS) microphone having a thin-film construction.
  27. Zhou, Tiansheng, Micro-electro-mechanical systems micromirrors and micromirror arrays.
  28. Tsai, Cheng-Wei; Lee, Chien-Hsing; Liou, Jhyy-Cheng, Microelectromechanical system (MEMS) microphone with protection film and MEMS microphonechips at wafer level.
  29. Martin, John R.; Brosnihan, Timothy J.; Core, Craig; Nunan, Thomas Kieran; Weigold, Jason; Zhang, Xin, Micromachined microphone and multisensor and method for producing same.
  30. Ehrenpfordt, Ricardo; Bruendel, Mathias; Gerlach, Andre; Leinenbach, Christina; Knies, Sonja; Feyh, Ando; Scholz, Ulrike, Micromechanical functional apparatus, particularly a loudspeaker apparatus, and appropriate method of manufacture.
  31. Schrank, Franz, Microphone arrangement and method for production thereof.
  32. Van Halteren, Aart Zeger; Rombach, Pirmin; Jørgensen, Martin Bondo, Microphone assembly.
  33. Harney, Kieran P.; Sengupta, Dipak; Moss, Brian; Guery, Alain V., Microphone module with sound pipe.
  34. Yang, Jicheng; Goida, Thomas M., Microphone system with offset apertures.
  35. Weigold, Jason W., Microphone with irregular diaphragm.
  36. Silverbrook, Kia; Mallinson, Samuel George, Miniature pressure sensor assembly.
  37. Zhou, Tiansheng, Monolithic capacitive transducer.
  38. Ghidoni, Marco Omar; Brioschi, Roberto, Multi-chamber transducer module, apparatus including the multi-chamber transducer module and method of manufacturing the multi-chamber transducer module.
  39. Weigold, Jason W.; Harney, Kieran P., Multi-microphone system.
  40. Harney, Kieran P.; Weigold, Jason; Elko, Gary, Multiple microphone system.
  41. Huang, Chao-Ta; Chien, Hsin-Tang, Package and packaging assembly of microelectromechanical system microphone.
  42. Bolognia, David; Harney, Kieran P., Packaged microphone with frame having die mounting concavity.
  43. Logan,Elizabeth A.; Ray,Curtis A., Packaging of hybrid integrated circuits.
  44. Bentley, Ian; Bradley, Alistair D., Pressure sense die pad layout and method for direct wire bonding to programmable compensation integrated circuit die.
  45. Wade, Richard; Bentley, Ian, Pressure sensor.
  46. Weigold, Jason W., Process of forming a microphone using support member.
  47. Weigold,Jason W., Process of forming a microphone using support member.
  48. Zhou, Tiansheng, Rotational type of MEMS electrostatic actuator.
  49. Cook, James; Becke, Craig S.; Speldrich, Jamie, Sensor assembly.
  50. Bentley, Ian; Bradley, Alistair David; Cook, Jim, Sensor package assembly having an unconstrained sense die.
  51. Zhang, Xin; Judy, Michael W.; Molnar, George M.; Needham, Christopher; Jia, Kemiao, Stress isolation platform for MEMS devices.
  52. Zhang, Xin; Judy, Michael; Chau, Kevin H. L.; Kuan, Nelson; Spooner, Timothy; Paydenkar, Chetan; Farrell, Peter, Stress mitigation in packaged microchips.
  53. Combi, Chantal; Vigna, Benedetto; Ziglioli, Federico Giovanni; Baldo, Lorenzo; Magugliani, Manuela; Lasalandra, Ernesto; Riva, Caterina, Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device.
  54. Combi, Chantal; Vigna, Benedetto; Ziglioli, Federico Giovanni; Baldo, Lorenzo; Magugliani, Manuela; Lasalandra, Ernesto; Riva, Caterina, Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device.
  55. Weigold, Jason W., Support apparatus for microphone diaphragm.
  56. Elian, Klaus; Theuss, Horst; Mueller, Thomas, Surface mountable microphone package, a microphone arrangement, a mobile phone and a method for recording microphone signals.
  57. Ravnkilde, Jan Tue; Giesen, Marcel; Rasmussen, Kurt; Ginnerup, Morten; Rombach, Pirmin Hermann Otto; Pahl, Wolfgang; Leidl, Anton; Schober, Armin; Portmann, Jürgen, Top-port MEMS microphone and method of manufacturing the same.
  58. Bolognia, David; Harney, Kieran P., Transducer with enlarged back volume.
  59. Zhu, Xu; Ciferno, Raymond A., Ultrathin form factor MEMS microphones and microspeakers.
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