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Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B23K-035/38
  • B23K-001/20
  • B23K-031/02
  • F27D-011/00
출원번호 US-0970802 (2001-10-05)
우선권정보 JP-0010423 (2001-01-18); JP-0067615 (2001-03-09); JP-0172960 (2001-06-07)
발명자 / 주소
  • Matsuki, Hirohisa
  • Matsui, Hiroyuki
  • Yoshida, Eiji
  • Ohno, Takao
  • Otake, Koki
  • Mizutani, Akiyo
  • Miyajima, Motoshu
  • Mizukoshi, Masataka
  • Watanabe, Eiji
출원인 / 주소
  • Fujitsu Limited
대리인 / 주소
    Armstrong, Kratz, Quintos, Hanson & Brooks, LLP
인용정보 피인용 횟수 : 10  인용 특허 : 24

초록

There is provided a chamber open to the outside through openings through which a solder-adhered object is passed and the chamber having a heating/melting area, a carrying mechanism for carrying the solder-adhered object into the heating/melting area, a formic-acid supplying means for supplying a for

대표청구항

There is provided a chamber open to the outside through openings through which a solder-adhered object is passed and the chamber having a heating/melting area, a carrying mechanism for carrying the solder-adhered object into the heating/melting area, a formic-acid supplying means for supplying a for

이 특허에 인용된 특허 (24)

  1. Freedman Gary M. (Stow MA), Atmospheric pressure gaseous-flux-assisted laser reflow soldering.
  2. Watanabe Yoshitsugu (Tanashi JPX) Koenuma Katsutoshi (Higashimurayama JPX), Automatic mounting apparatus for chip components.
  3. May Gordon M. (Cedar Springs MI), Circuit board assembly.
  4. Rehm Johannes,DEX, Circuit board heating apparatus.
  5. Randall L. Rich ; Shean R. Dalton, Compact reflow and cleaning apparatus.
  6. Tusset Vittorino (Oupeye BEX) Hancart Jules (Jupille BEX) Paulus Philippe (Liege BEX), Continuous treatment of steel sheet.
  7. Mittag Michael T. (New Haven VT), Gas curtain additives and zoned tunnel for soldering.
  8. Sindzingre Thierry (Cachan FRX) Mellul Sylvie (L\Hay Les Roses FRX) Duchateau Eric (Versailles FRX), Method and apparatus for dry process fluxing.
  9. Bickford Harry R. (Ossining NY) Horton Raymond R. (Dover Plains NY) Novan Ismail C. (Peekskill NY) Palmer Michael J. (Waldon NY) Zyzo John C. (Waterbury CT), Method and apparatus for fluxless solder bonding.
  10. Morris John R. (Princeton Junction NJ), Method and apparatus for soldering articles.
  11. Kuwabara Mitsuo,JPX, Method for joining members at ordinary temperature.
  12. Gaynes Michael Anthony ; Pierson Mark Vincent, Method of making components with solder balls.
  13. Hirohisa Matsuki JP; Fumihiko Taniguchi JP; Kunio Kodama JP; Eiji Watanabe JP; Masataka Mizukoshi JP; Hiroyuki Matsui JP, Method of manufacturing solder bumps and solder joints using formic acid.
  14. Dittman Eberhard S. (Granby CAX) Saraiya Mukund K. (Endwell NY), Optical module with fluxless laser reflow soldered joints.
  15. Liedke Volker (Elsenfeld/Eichelsbach) Grasmann Karl H. (Stadprozelten) Albrecht Hans-Jurgen (Berlin) Wittrich Harald (Berlin) John Wilfred (Berlin) Scheel Wolfgang (Berlin DEX), Procedure for processing joints to be soldered.
  16. Nitto Hajime (Kitakyushu JPX) Naitoh Hiromitsu (Kitakyushu JPX), Process for continuously annealing a cold-rolled low carbon steel strip.
  17. Hampel Josef (Breitenfurt ATX), Process of continuously electrodepositing on strip metal on one or both sides.
  18. Deambrosio Carlos A. (LaPrairie CAX) Gileta John (Chateauguay CAX), Shield gas wave soldering.
  19. Brady Michael F. (Morrisville PA) Deshmukh Rajan D. (Yardley PA), Solder self-alignment methods.
  20. Hohnerlein Ernst (Ringstrasse 7 6983 Kreuzwertheim DEX), Soldering apparatus.
  21. Tobiyama Yoichi (Chiba JPX) Kato Chiaki (Chiba JPX) Morito Nobuyuki (Chiba JPX) Umino Shigeru (Chiba JPX), Surface treated steel strip with minimal plating defects and method for making.
  22. Elliott Donald A. (Brossard CAX) Power Vivian G. (Lambert CAX), Tunnel for fluxless soldering.
  23. Kazaoka Kenichi (Nagoya JPX) Yamada Yukifumi (Toyota JPX), Vertically adjustable seat for vehicles.
  24. Hagerty Lawrence J. (Stamford CT) Nowotarski Mark S. (Stamford CT) Diamantopoulous David A. (Ringwood NJ), Wave soldering in a protective atmosphere enclosure over a solder pot.

이 특허를 인용한 특허 (10)

  1. Dong, Chun Christine; McDermott, Wayne Thomas; Patrick, Richard E.; Schwarz, Alexander, Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation.
  2. Dong, Chun Christine; McDermott, Wayne Thomas; Patrick, Richard E.; Schwarz, Alexander, Apparatus for removal of surface oxides via fluxless technique involving electron attachment and remote ion generation.
  3. Akutagawa, Yoshito; Matsui, Hiroyuki; Makino, Yutaka, Forming method of electrode and manufacturing method of semiconductor device.
  4. Yang, Tae-Hoon; Lee, Ki-Yong; Seo, Jin-Wook; Park, Byoung-Keon, Heat treatment apparatus and heat treatment method using the same.
  5. Leicht, Helmut W., Process and device for soldering in the vapor phase.
  6. Hsu, Ching-Jen, Process for welding electrical connectors and welding device thereof.
  7. Zhang,Jian; Lee,Chunghsin, Serial thermal processor arrangement.
  8. Wurzbacher,Ray R.; Walchli,Stephen B., System and method for decapsulating an encapsulated object.
  9. Jin,Yonggang; Yong,Shelley; Chua,Puay Gek; Shin,Won Sun, System for fabricating an integrated circuit package on a printed circuit board.
  10. de Ridder, Chris G. M.; Boonstra, Klaas P.; Oosterlaken, Theodorus G. M.; Ravenhorst, Barend J. T., Wafer processing apparatus with heated, rotating substrate support.
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