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Method for forming an image sensor package with vision die in lens housing 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01J-005/02
출원번호 US-0896014 (2001-06-28)
발명자 / 주소
  • Glenn, Thomas P.
  • Webster, Steven
  • Hollaway, Roy Dale
출원인 / 주소
  • Amkor Technology, Inc.
대리인 / 주소
    Gunnison, McKay & Hodgson, L.L.P.
인용정보 피인용 횟수 : 92  인용 특허 : 17

초록 ▼

A method for forming an image sensor assembly includes forming a lead frame or Land Grid Array (LGA) integrally into a molded image sensor die package so that the lead frame or LGA is fully supported and structurally fortified by the molded image sensor die package. An image sensor die is then attac

대표청구항 ▼

A method for forming an image sensor assembly includes forming a lead frame or Land Grid Array (LGA) integrally into a molded image sensor die package so that the lead frame or LGA is fully supported and structurally fortified by the molded image sensor die package. An image sensor die is then attac

이 특허에 인용된 특허 (17)

  1. Xie Hong ; Brownell Michael, Apparatus for attaching a heat sink to the back side of a flip chip package.
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  2. Glenn, Thomas P.; Webster, Steven; Hollaway, Roy Dale, Flip chip image sensor package fabrication method.
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  3. Johnson Dean A., Image sensor assembly.
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  4. Johnson Dean A., Image sensor assembly and packaging method.
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  5. Ciccarelli Antonio S., Image sensor cover with integral light shield.
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  6. Stern Jonathan Michael ; Sapir Itzhak ; Hornback William B., Image sensor package with image plane reference.
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  7. Beaman Bryan A. ; Gerstenberger Julie K. ; Orlicki David M., Imager package substrate.
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  8. Herring Robert J. ; Neilson Andrew C. ; Manitakos Daniel L. ; Confer Charles L. ; Haded Kevin J. ; Bin-Nun Uri, Infrared video camera system with uncooled focal plane array and radiation shield.
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  9. Yoshida Setsuo,JPX ; Natsume Satoshi,JPX, Lens moving mechanism for finely moving a portion of an objective lens by rotating a holding member.
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  10. Thomas P. Glenn ; Steven Webster, Method of fabricating image sensor packages in an array.
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  11. Ozimek Edward J. ; Tarn Terry, Method of packaging image sensors.
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  12. Goel Atul, Optical device package including an aligned lens.
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  13. Daniels Dwight L. ; Fang Treliant ; Parmenter Athena M., Optical semiconductor component and method of manufacture.
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  14. Nakayama, Yoshinori; Nakayoshi, Hirokazu, Reduced thickness optical image pickup device with improved sealing and method of making same.
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  15. Fletcher Thomas A. (Freeport IL), Sealed focusing assembly for an industrial vision system.
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  16. Shoda Mashahiro,JPX ; Ishizuya Tohru,JPX, Thermal infrared camera.
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  17. Izumi Akiya (Mobara JPX) Takemoto Iwao (Mobara JPX) Sokei Hiroichi (Mobara JPX) Kodowaki Masahiko (Mobara JPX) Naito Takamasa (Mobara JPX) Kojima Hiroyoshi (Mobara JPX) Iguchi Atsumu (Mobara JPX) Yok, Video camera unit having an airtight mounting arrangement for an image sensor chip.
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  1. Raymond, Chris; Hummel, Steve, Apparatus and method for enhanced critical dimension scatterometry.
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  6. Shangguan, Dongkai; Tam, Samuel Waising, Camera module with premolded lens housing and method of manufacture.
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  7. Lin, Chun-Ting; Fu, Chiun-Lern; Chan, Te-Kuei; Ku, Jenn-Nan, Composite array camera lens module.
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  8. Sulfridge, Marc, Conductive interconnect structures and formation methods using supercritical fluids.
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