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In a socket to test semiconductor die, a recessed socket contact that avoids pinching the die contacts is diclosed. The socket contacts allow for smaller socket holes and, allow denser contact spacing. A variety of embodiments are presented that are suitable for use depending on the spacing between

In a socket to test semiconductor die, a recessed socket contact that avoids pinching the die contacts is diclosed. The socket contacts allow for smaller socket holes and, allow denser contact spacing. A variety of embodiments are presented that are suitable for use depending on the spacing between the conducters. For more closely spaced conductors, the body of the socket contact comprises a head, a spring coupled to the head, and a shaft coupled to the spring. No outer shell is needed for the spring, as the nonconductive sides of the socket hole serve that function. For conductors spaced further apart, the body of the socket contact comprises a metal shaft having an aperture. Compression causes the shaft to close around the slit, thereby decreasing the amount of lateral buckling. For even more densly spaced contacts, semiconductor fabrication techniques are used to construct a dense array of contacts.

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In a socket to test semiconductor die, a recessed socket contact that avoids pinching the die contacts is diclosed. The socket contacts allow for smaller socket holes and, allow denser contact spacing. A variety of embodiments are presented that are suitable for use depending on the spacing between

In a socket to test semiconductor die, a recessed socket contact that avoids pinching the die contacts is diclosed. The socket contacts allow for smaller socket holes and, allow denser contact spacing. A variety of embodiments are presented that are suitable for use depending on the spacing between the conducters. For more closely spaced conductors, the body of the socket contact comprises a head, a spring coupled to the head, and a shaft coupled to the spring. No outer shell is needed for the spring, as the nonconductive sides of the socket hole serve that function. For conductors spaced further apart, the body of the socket contact comprises a metal shaft having an aperture. Compression causes the shaft to close around the slit, thereby decreasing the amount of lateral buckling. For even more densly spaced contacts, semiconductor fabrication techniques are used to construct a dense array of contacts. an inner circumferential surface of the third through hole of the coupling member in order to install the corresponding plate spring members inside the third through hole of the coupling member, wherein the plurality of slots are installed in opposition to each other.6. The suction head of claim 5, wherein the number of the slots installed in opposition to each other is at least two and the number of plate spring members formed inside the third through hole of the coupling member is identical to the number of slots.7. The suction head of claim 1, wherein each plate spring member further comprises a shim configured to control an elastic force or to control an initial position of the nozzle.8. The suction head of claim 1, wherein the holder has a plurality of latching members formed at predetermined positions so that the nozzle installed at the coupling member cannot be removed, the latching members being inserted into slots formed at an inner circumferential surface of the third through hole of the coupling member.9. The suction head of claim 1, wherein the fixing member comprises a bolt.10. The suction head of claim 1, wherein one end of the inside of the first through hole is configured to be mounted to a hollow shaft using the fixing member.