Inline monitoring of pad loading for CuCMP and developing an endpoint technique for cleaning
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
C23F-001/00
H01L-021/306
출원번호
US-0973854
(2001-10-09)
발명자
/ 주소
Chopra, Dinesh
Meikle, Scott
출원인 / 주소
Micron Technology, Inc.
대리인 / 주소
Knobbe, Martens, Olson & Bear, LLP
인용정보
피인용 횟수 :
7인용 특허 :
2
초록▼
A system of cleaning a CMP pad used for removing copper from a substrate, the system comprising an abrasive cleaning pad, a cleaning solution delivery system that delivers a cleaning solution, an analyzing system that monitors the characteristics of the cleaning solution optically and chemically, an
A system of cleaning a CMP pad used for removing copper from a substrate, the system comprising an abrasive cleaning pad, a cleaning solution delivery system that delivers a cleaning solution, an analyzing system that monitors the characteristics of the cleaning solution optically and chemically, and a carriage that allows the analyzing system to monitor the cleaning solution at a plurality of locations on the CMP pad. The use of the abrasive cleaning pad and the cleaning solution removes contaminants from the CMP pad, and the contaminants are dissolved in the cleaning solution. By measuring the concentration of contaminants in the cleaning solution, the condition of the CMP pad can be monitored. To measure the concentration of the contaminants, changes in the refractive index and absorption of light in the cleaning solution are measured, wherein the refractive index and absorption depend on the concentration of the contaminants. The concentration of the contaminants in the cleaning solution is also measured chemically. Knowing the actual condition of the CMP pad during the cleaning process allows for improved condition of the CMP pad.
대표청구항▼
A system of cleaning a CMP pad used for removing copper from a substrate, the system comprising an abrasive cleaning pad, a cleaning solution delivery system that delivers a cleaning solution, an analyzing system that monitors the characteristics of the cleaning solution optically and chemically, an
A system of cleaning a CMP pad used for removing copper from a substrate, the system comprising an abrasive cleaning pad, a cleaning solution delivery system that delivers a cleaning solution, an analyzing system that monitors the characteristics of the cleaning solution optically and chemically, and a carriage that allows the analyzing system to monitor the cleaning solution at a plurality of locations on the CMP pad. The use of the abrasive cleaning pad and the cleaning solution removes contaminants from the CMP pad, and the contaminants are dissolved in the cleaning solution. By measuring the concentration of contaminants in the cleaning solution, the condition of the CMP pad can be monitored. To measure the concentration of the contaminants, changes in the refractive index and absorption of light in the cleaning solution are measured, wherein the refractive index and absorption depend on the concentration of the contaminants. The concentration of the contaminants in the cleaning solution is also measured chemically. Knowing the actual condition of the CMP pad during the cleaning process allows for improved condition of the CMP pad. e floor, wherein said base of said stand comprises a first member; wherein said first member of said base is slender; wherein said first member of said base is elongated; wherein said first member of said base is rectangular-parallelepiped-shaped; and wherein said first member of said base is for resting on the floor, wherein said first member of said base has a lowermost surface; wherein said first member of said base has a pair of side surfaces; wherein said first member of said base has a height; wherein said first member of said base has an uppermost surface; wherein said lowermost surface of said first member of said base is horizontally-oriented; wherein said lowermost surface of said first member of said base is for resting on the floor; wherein said pair of side surfaces of said first member of said base are vertically-oriented; wherein said pair of side surfaces of said first member of said base extend upwardly from said lowermost surface of said first member of said base; and wherein said uppermost surface of said first member of said base is horizontally-oriented, wherein one side surface of said first member of said base has a pair of terminal ends; wherein said one side surface of said first member of said base has a center; and wherein said center of said one side surface of said first member of said base is located midway between said pair of terminal ends of said one side surface of said first member of said base, wherein said first member of said base has a groove; and wherein said groove in said first member of said base is disposed in said center of said one side surface of said first member of said base, wherein said groove in said first member of said base is vertically-oriented; wherein said groove in said first member of said base is rectangular-parallelepiped-shaped; and wherein said groove in said first member of said base has a width, wherein said top surface of said first member of said base has a pair of terminal ends; wherein said too surface of said first member of said base has a center; and wherein said center of said top surface of said first member of said base is located midway between said pair of terminal ends of said first member of said base, wherein said first member of said base has a tongue; and wherein said tongue on said first member of said base extends upwardly from said center of said top surface of said first member of said base, wherein said tongue on said first member of said base extends horizontally from flush with said groove in said first member of said base, to short of the other side surface of said first member of said base. 2. The device as defined in claim 1, wherein said base of said stand is T-shaped.3. The device as defined in claim 1, wherein said groove in said first member of said base extends vertically from, and opens into, said lowermost surface of said first member of said base, to, and opens into, said uppermost surface of said first member of said base; and wherein said groove in said first member of said base extends horizontally to midway between said pair of side surface of said first member of said base. 4. The device as defined in claim 1, wherein said tongue on said first member of said base is vertically-oriented; wherein said tongue on said first member of said base is rectangular-parallelepiped-shaped; wherein said tongue on said first member of said base has a width; wherein said tongue on said first member of said base has a height; and wherein said tongue on said first member of said base has a depth. 5. The device as defined in claim 1, wherein said width of said tongue on said first member of said base is equal to said width of said groove in said first member of said base.6. The device as defined in claim 1 wherein said base of said stand comprises a second member; wherein said second member of said base is slender; wherein said second member of said base is e
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이 특허에 인용된 특허 (2)
Chen Lai-Juh,TWX, Chemical-mechanical polish (CMP) pad conditioner.
Subramanian, Ramkumar; Avanzino, Steven C.; Rangarajan, Bharath; Singh, Bhanwar, Copper oxide monitoring by scatterometry/ellipsometry during nitride or BLOK removal in damascene process.
Jae, Man-Ho; Kim, Min-Gyu, Method and apparatus for polishing a substrate while washing a polishing pad of the apparatus with at least one free-flowing vertical stream of liquid.
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