초록 ▼

A rotary electromechanical device includes a first motor including a first stator and a first rotor, a second motor including a second stator and a second rotor, and variable power supplies for driving the respective motors independently of each other, The motors are arranged in series along the axi

A rotary electromechanical device includes a first motor including a first stator and a first rotor, a second motor including a second stator and a second rotor, and variable power supplies for driving the respective motors independently of each other, The motors are arranged in series along the axial direction of a rotary shaft. Magnetic poles of the same polarity of the rotors are located at uniform angular positions around the rotary shaft while magnetic poles of the stator of the motor and magnetic poles of the stator of the second motor are displaced from each other in the circumferential direction of the rotary shaft.

대표청구항 ▼

A rotary electromechanical device includes a first motor including a first stator and a first rotor, a second motor including a second stator and a second rotor, and variable power supplies for driving the respective motors independently of each other, The motors are arranged in series along the axi

A rotary electromechanical device includes a first motor including a first stator and a first rotor, a second motor including a second stator and a second rotor, and variable power supplies for driving the respective motors independently of each other, The motors are arranged in series along the axial direction of a rotary shaft. Magnetic poles of the same polarity of the rotors are located at uniform angular positions around the rotary shaft while magnetic poles of the stator of the motor and magnetic poles of the stator of the second motor are displaced from each other in the circumferential direction of the rotary shaft. ical communication with said additional via with said additional via resistance extending between said additional conductor and said second conductive layer and said input being in electrical communication with said additional conductor and having an input resistance component and an input impedance associated therewith, with said input impedance being defined by said input resistive component and said additional via resistance. 2. A circuit package, comprising: a dielectric substrate having a first surface and a conductive layer and a via extending therebetween, with a first conductor disposed on said first surface with said via placing said first conductor and said conductive layer in electrical communication; a driver circuit mounted to said substrate and including an input and an output, with said output being in electrical communication with said first conductor and having an output resistive component associated therewith, with said via having a resistive fill disposed therein, defining a via resistance connected between said first conductor and said conductive layer, said output having an output impedance being defined by said output resistive component and said via resistance; and wherein said substrate includes a plurality of said via, individual ones of a subgroup of said via in electrical communication and extending between said first surface and said conductive layer in parallel and have said resistive fill disposed therein to define said via resistance, with said via resistance being inversely proportional to a number of said plurality of vias in said subgroup. 3. A circuit package, comprising: a dielectric substrate having a first surface and a conductive layer and a via extending therebetween, with a first conductor disposed on said first surface with said via placing said first conductor and said conductive layer in electrical communication; a driver circuit mounted to said substrate and including an input and an output, with said output being in electrical communication with said first conductor and having an output resistive component associated therewith, with said via having a resistive fill disposed therein, defining a via resistance connected between said first conductor and and said conductive layer, said output having an output impedance being defined by said output resistive component and said via resistance; and wherein said output resistive component further includes an output resistance of said driver circuit having a magnitude in a range of 5 to 12 ohms, inclusive, with said via resistance having a magnitude in a range of 35 to 50 ohms, inclusive. 4. A circuit package, comprising: a dielectric substrate having a first surface and a conductive layer and a via extending therebetween, with a first conductor disposed on said first surface with said via placing said first conductor and said conductive layer in electrical communication; a driver circuit mounted to said substrate and including an input and an output, with said output being in electrical communication with said first conductor and having an output resistive component associated therewith, with said via having a resistive fill disposed therein, defining a via resistance connected between said first conductor and and said conductive layer, said output having an output impedance being defined by said output resistive component and said via resistance; and wherein said via resistance has a magnitude that is at least twice a magnitude of said output resistive component. 5. The circuit package as recited in claim 4 wherein said substrate comprises a printed circuit board. 6. The circuit package as recited in claim 4 wherein said driving circuit is selected from a set of driving circuits consisting of, a buffer, an inverter and an amplifier. 7. The circuit package as recited in claim 4 wherein said output communicates with said first conductor said first conductor including a conductive bump.8. The package as recit