초록 ▼

The composite molding apparatus includes a rigid base member and a complementary semi-rigid mold member or “black bag” caul plate having a sieve member formed therein. The sieve member layer of the semi-rigid mold member engages pins which extend from the sandwich core to limit penetration into the

The composite molding apparatus includes a rigid base member and a complementary semi-rigid mold member or “black bag” caul plate having a sieve member formed therein. The sieve member layer of the semi-rigid mold member engages pins which extend from the sandwich core to limit penetration into the semi-rigid mold member to a predetermined depth. The semi-rigid mold member is supported relative to the rigid mold member by the pins to provide uniform pressure transfer to the composite article during a high pressure co-cure molding process without crushing the sandwich core.

대표청구항 ▼

The composite molding apparatus includes a rigid base member and a complementary semi-rigid mold member or “black bag” caul plate having a sieve member formed therein. The sieve member layer of the semi-rigid mold member engages pins which extend from the sandwich core to limit penetration into the

The composite molding apparatus includes a rigid base member and a complementary semi-rigid mold member or “black bag” caul plate having a sieve member formed therein. The sieve member layer of the semi-rigid mold member engages pins which extend from the sandwich core to limit penetration into the semi-rigid mold member to a predetermined depth. The semi-rigid mold member is supported relative to the rigid mold member by the pins to provide uniform pressure transfer to the composite article during a high pressure co-cure molding process without crushing the sandwich core. l work in process product units, electrical work in process product units and electro-mechanical work in process product units.11. The method of claim 7 wherein the work in process product unit is a microelectronic work in process product unit selected from the group consisting of integrated circuit microelectronic fabrication work in process product units, ceramic substrate microelectronic fabrication work in process product units, solar cell optoelectronic microelectronic fabrication work in process product units, sensor image array optoelectronic microelectronic fabrication work in process product units and display image array optoelectronic microelectronic fabrication work in process product units.12. The method of claim 7 wherein the stocker apparatus further comprises a minimum of one door each within the series of rigid exterior surface plates for accessing each of the minimum of six input/output ports.