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Carrier head with a vibration reduction feature for a chemical mechanical polishing system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-029/00
출원번호 US-0102083 (2002-03-19)
발명자 / 주소
  • Chao, Sandy Shih-Hsun
  • Nagengast, Andrew
출원인 / 주소
  • Applied Materials Inc.
대리인 / 주소
    Moser, Patterson & Sheridan
인용정보 피인용 횟수 : 4  인용 특허 : 47

초록

Embodiments of the present invention are directed to a carrier head for positioning a substrate on a polishing surface. The carrier head includes a housing connectable to a drive shaft to rotate therewith; a base; a detachable plate removably mounted on top of the housing; a gimbal mechanism connect

대표청구항

Embodiments of the present invention are directed to a carrier head for positioning a substrate on a polishing surface. The carrier head includes a housing connectable to a drive shaft to rotate therewith; a base; a detachable plate removably mounted on top of the housing; a gimbal mechanism connect

이 특허에 인용된 특허 (47)

  1. Nakashiba Masamichi,JPX ; Kimura Norio,JPX ; Watanabe Isamu,JPX ; Hasegawa Yoko,JPX, Apparatus for and method of polishing workpiece.
  2. Cesna Joseph V. ; Grosslight Gordon J. ; Karlsrud Chris, Bearing assembly for wafer planarization carrier.
  3. Chen Hung ; Zuniga Steven M., Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus.
  4. Chen Hung ; Zuniga Steven M., Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus.
  5. Steven M. Zuniga ; Manoocher Birang ; Hung Chen ; Sen-Hou Ko, Carrier head with a flexible membrane for a chemical mechanical polishing system.
  6. Zuniga Steven M. ; Birang Manoocher ; Chen Hung ; Ko Sen-Hou, Carrier head with a flexible membrane for a chemical mechanical polishing system.
  7. Chen Hung ; Zuniga Steven, Carrier head with a flexible membrane for chemical mechanical polishing.
  8. Chen Hung ; Zuniga Steven M., Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus.
  9. Govzman Boris ; Zuniga Steven M. ; Chen Hung ; Somekh Sasson, Carrier head with a substrate detection mechanism for a chemical mechanical polishing system.
  10. Tolles Robert D. ; Cheng Tsungan ; Prince John, Carrier head with layer of conformable material for a chemical mechanical polishing system.
  11. Shendon Norman (San Carlos CA), Chemical mechanical polishing apparatus with improved carrier and method of use.
  12. Tolles Robert D. ; Shendon Norm ; Somekh Sasson ; Perlov Ilya ; Gantvarg Eugene ; Lee Harry Q., Continuous processing system for chemical mechanical polishing.
  13. Bukhman Yefim (Scottsdale AZ), Distributed polishing head.
  14. Jurjevic Robert A. ; Lebel Richard J. ; Miller Matthew K., Flexible tilted wafer carrier.
  15. Duescher Wayne O. ; Luedtke Mark J. ; Staus Gary A., Lapping apparatus and method for high speed lapping with a rotatable abrasive platen.
  16. Cesna Joseph V. (Niles IL), Liquid waxless fixturing of microsize wafers.
  17. Trojan Daniel R. ; Lee Lawrence L., Low profile, low hysteresis force feedback gimbal system for chemical mechanical polishing.
  18. Breivogel Joseph R. (Aloha OR) Prince Matthew J. (Portland OR) Barns Christopher E. (Portland OR), Method and apparatus for chemical-mechanical polishing using pneumatic pressure applied to the backside of a substrate.
  19. Guthrie William L. ; Cheng Tsungnan ; Ko Sen-Hou ; Lee Harry Q. ; Sherwood Michael T. ; Shendon Norm, Method and apparatus for using a retaining ring to control the edge effect.
  20. Hoshizaki Jon A. ; Williams Roger O. ; Buhler James D. ; Reichel Charles A. ; Hollywood William K. ; de Geus Richard ; Lee Lawrence L., Method for chemical mechanical polishing.
  21. Carr Jeffrey W. (Fishkill NY) David Lawrence D. (Wappingers Falls NY) Guthrie William L. (Hopewell Junction NY) Kaufman Frank B. (Amawalk NY) Patrick William J. (Newburgh NY) Rodbell Kenneth P. (Poug, Method of chemical-mechanical polishing an electronic component substrate and polishing slurry therefor.
  22. Tanaka Kouichi (Nishigo-mura JPX) Hashimoto Hiromasa (Nishigo-mura JPX) Suzuki Fumio (Taishin-mura JPX), Method of polishing semiconductor wafers and apparatus therefor.
  23. Banks Edward L. (Willingboro Township ; Burlington County NJ), Methods and apparatus for polishing a semiconductor wafer.
  24. Jackson Paul David (Scottsdale AZ) Schultz Stephen Charles (Gilbert AZ), Pneumatic polishing head for CMP apparatus.
  25. Kimura Norio,JPX ; Kikuta Ritsuo,JPX ; Ishii You,JPX ; Hirose Masayoshi,JPX, Polishing apparatus.
  26. Matsuo Hisanori,JPX ; Hiyama Hirokuni,JPX ; Wada Yutaka,JPX ; Hirokawa Kazuto,JPX, Polishing apparatus.
  27. Tanaka Kouichi (Takasaki JPX) Uchiyama Isao (Nishigo JPX), Polishing apparatus.
  28. Isobe Akira,JPX ; Morita Tomotake,JPX, Polishing apparatus having retainer ring rounded along outer periphery of lower surface and method of regulating retain.
  29. Nishi Toyomi (Yokohama JPX) Takahashi Tamami (Yamato JPX) Togawa Tetsuji (Fujisawa JPX), Polishing apparatus including detachable cloth cartridge.
  30. Ohashi Hiroyuki (Kamakura JPX) Miyashita Naoto (Yokohama JPX) Katakabe Ichiro (Yokohama JPX) Tsukihara Tetsuya (Kitakyushu JPX), Polishing apparatus of semiconductor wafer.
  31. Kim Inki (Tempe AZ), Polishing device with improved handling of fluid polishing media.
  32. Volodarsky Konstantin, Polishing head with removable subcarrier.
  33. Nakajima Makoto (Nagano JPX), Polishing machine.
  34. Tanaka Koichi,JPX ; Morita Koji,JPX ; Takaku Tsutomu,JPX, Polishing pad, method and apparatus for treating polishing pad and polishing method.
  35. Volodarsky Konstantine (San Francisco CA) Kajiwara Jiro (Foster City CA) Owens ; Jr. Herbert W. (San Jose CA) King Jan H. (Sunnyvale CA), Rotary union for coupling fluids in a wafer polishing apparatus.
  36. Koeth Joe E. (Mesa AZ) Hoffman Melvin J. (Scottsdale AZ) Jackson Paul D. (Scottsdale AZ), Semiconductor wafer carrier and method.
  37. Barns Chris E. ; Charif Malek ; Lefton Kenneth D. ; Mitchel Fred E., Semiconductor wafer polishing apparatus with a flexible carrier plate.
  38. Suckow David S. (Decatur IL), Shaft vibration damper.
  39. Thelen Dieter,DEX ; Stork Michael,DEX, Support structure with a vibration damper for rotatably holding a rotatable body.
  40. Muramatsu Tomoaki,JPX ; Yoshida Takashi,JPX, Ultra flat polishing.
  41. Decuir Julian A., Vibration dampener for internal combustion engines.
  42. Strasbaugh Alan (825 Buckley Rd. San Luis Obispo CA 93401), Wafer carrier for film planarization.
  43. Natalicio John, Wafer carrier for semiconductor wafer polishing machine.
  44. Shendon Norm (San Carlos CA) Struven Kenneth C. (San Carlos CA) Kolenkow Robert J. (Berkeley CA), Wafer polisher head having floating retainer ring.
  45. Kobayashi Hiroyuki (Omiya JPX) Miyairi Hiroo (Omiya JPX) Endo Osamu (Omiya JPX), Wafer polishing apparatus.
  46. Tobin Jim, Wafer transfer station for a chemical mechanical polisher.
  47. Strasbaugh Alan (825 Buckley Rd. San Luis Obispo CA 93401), Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied.

이 특허를 인용한 특허 (4)

  1. Fukushima, Makoto; Yasuda, Hozumi; Nabeya, Osamu; Watanabe, Katsuhide; Namiki, Keisuke, Elastic membrane for semiconductor wafer polishing.
  2. Fukushima, Makoto; Yasuda, Hozumi; Nabeya, Osamu; Watanabe, Katsuhide; Namiki, Keisuke, Elastic membrane for semiconductor wafer polishing.
  3. Masumura, Hisashi; Kitagawa, Koji; Morita, Kouji; Kishida, Hiromi; Arakawa, Satoru, Polishing head and polishing apparatus.
  4. Virmani, Manish; Panchal, Paritosh Chandrakant; Fisher, James; Russell, Keefe Michael; Bhattacharya, Sandeepan, Protective layer on gimbal for scratch mitigation.
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