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Desiccants and desiccant packages for highly moisture-sensitive electronic devices 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B01D-053/04
출원번호 US-0924778 (2001-08-08)
발명자 / 주소
  • Boroson, Michael L.
  • Serbicki, Jeffrey P.
  • Bessey, Peter G.
  • Irvin, Glen C.
  • Rowley, Lawrence A.
  • Kaminsky, Cheryl J.
출원인 / 주소
  • Eastman Kodak Company
대리인 / 주소
    Owens, Raymond L.
인용정보 피인용 횟수 : 27  인용 특허 : 16

초록

An effective desiccant for use in a package which has a material including at least in part solid particles of one or more materials, at least one of such materials having an average particle size range 0.001 to 0.1 micrometers to provide a high rate of water absorption and to provide an equilibrium

대표청구항

An effective desiccant for use in a package which has a material including at least in part solid particles of one or more materials, at least one of such materials having an average particle size range 0.001 to 0.1 micrometers to provide a high rate of water absorption and to provide an equilibrium

이 특허에 인용된 특허 (16)

  1. Bulow Martin ; Fitch Frank R. ; Ojo Adeola Florence, Adsorbents and adsorptive separation process.
  2. Booe ; James M., Desiccant for electrical and electronic devices.
  3. Boroson Michael L. ; Serbicki Jeffrey P. ; Bessey Peter G., Desiccation of moisture-sensitive electronic devices.
  4. Allan Barry D. (Huntsville AL), Dry water.
  5. Taylor R. Daniel (North Ridgeville OH), Flexible desiccant body.
  6. Shtarkman Emil M. (Southfield MI), Fluid responsive to a magnetic field.
  7. Belding William A. (Danville CA) Delmas Marc P. F. (Baton Rouge LA) Holeman William D. (Baton Rouge LA) McDonald David A. (Kenner LA), High strength, low pressure drop adsorbent wheel.
  8. Michael L. Boroson ; John Schmittendorf ; Peter G. Bessey ; Jeffrey P. Serbicki, Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps.
  9. Levinson Lionel M. (Schenectady NY) Schultz William N. (Niskayuna NY) Lewis Larry N. (Scotia NY) Sumpter Chris A. (Scotia NY) Zumbrum Michael A. (Clifton Park NY), Infrared radiation curable organopolysiloxane compositions.
  10. Shores A. Andrew (212 Carroll Canal Venice CA 90291), Method of providing moisture-free enclosure for electronic device.
  11. Shores A. Andrew (212 Carroll Canal Venice CA 90291), Moisture and particle getter for enclosures.
  12. Shores A. Andrew (Venice CA), Moisture getting composition for hermetic microelectronic devices.
  13. VanSlyke Steven A. (Rochester NY), Organic electroluminescent device with stabilized cathode.
  14. Deffeyes Robert J. (Arlington TX), Package having dessicant composition.
  15. Kyricos Christopher J. (8 Short St. Cohasset MA 02025), Vapor exchange medium.
  16. Miksic Boris A. (21 Evergreen Rd. North Oaks MN 55110) Tzou Tsi-Zong (8826 Summer Wind Cir. Woodbury MN 55125) Foley Joseph M. (1959 Whtie Bear Ave. Maplewood MN 55109), Vapor phase corrosion inhibitor-desiccant material.

이 특허를 인용한 특허 (27)

  1. Yoo, Hyun Jee; Cho, Yoon Gyung; Chang, Suk Ky; Shim, Jung Sup; Lee, Suk Chin; Jeong, Kwang Jin, Adhesive and method of encapsulating organic electronic device using the same.
  2. Bonucci, Antonio; Rondena, Sergio; Cattaneo, Lorena, Composite H2O absorber for sealed medical devices.
  3. Lopatin, Sergej; Uehlin, Thomas; Gugenberger, Alexander; Hugel, Michael; Roβberg, Andreas, Composite material, molded body, electronic device with molded body, and method for fabricating a molded body.
  4. Natarajan, Bangalore R.; Gousev, Evgeni; Lavery, Kristopher A., Display device with desiccant.
  5. Döring, Stefan, Filter module packaging unit.
  6. Incorvia, Samuel A.; Powers, Thomas; Solovyov, Stanislav E., Lamp assembly.
  7. Chui, Clarence, Method and system for maintaining partial vacuum in display device.
  8. Rondena, Sergio; Cattaneo, Lorena; Mio Bertolo, Johnny; Collina, Tania; Giannantonio, Roberto, Method for manufacturing a composite sorber for the removal of H2O consisting of hygroscopic inorganic salts dissolved in a polymeric matrix.
  9. Lee, Chung J.; Kumar, Atul; Chen, Chieh; Tzeng, George, Method of encapsulating an organic light emitting device.
  10. Lee, Chung J.; Kumar, Atul; Chen, Chieh, Method of encapsulating an organic light-emitting device.
  11. Chen,Chien Hua; Craig,David M.; Haluzak,Charles C., Micro-optoelectromechanical system packages for a light modulator and methods of making the same.
  12. Kothari,Manish; Chui,Clarence; Palmateer,Lauren, Modifying the electro-mechanical behavior of devices.
  13. Lim, SiongLee; Chan, CheeYin, Mounting configuration for a filtration canister.
  14. Bonekamp, Jeffrey E.; Boven, Michelle L.; Gaston, Ryan S., Optoelectronic device.
  15. Cho, Yoon-Hyeung; Lee, Jong-Hyuk; Lee, Hae-Seung; Kim, Won-Jong; Choi, Jin-Baek, Organic electroluminescent device and method for manufacturing the same.
  16. Lee,Chung J.; Chen,Chieh; Kumar,Atul, Organic light emitting device having a protective barrier.
  17. Kim, Won-Jong; Lee, Jong-Hyuk; Cho, Yoon-Hyeung; Oh, Min-Ho; Choi, Jin-Baek; Lee, Byoung-Duk, Organic light emitting display device and method of manufacturing the same.
  18. Choi, Jin-Baek; Kim, Won-Jong; Lee, Jong-Hyuk; Cho, Yoon-Hyeung; Oh, Min-Ho; Lee, Byoung-Duk, Organic light-emitting device and method of manufacturing the same.
  19. Chen, Kuang-Jung; Wu, Jian-Lin; Yeh, Shu-Tang, Package of environmental sensitive electronic element.
  20. Chen, Kuang-Jung, Package of environmental sensitive element and encapsulation method of the same.
  21. Chen,Chien Hua; Craid,David M.; Schwinabart,Troy D., Placement of absorbing material in a semiconductor device.
  22. Chen,Chien Hua; Crald,David M.; Schwinabart,Troy D., Placement of absorbing material in a semiconductor device.
  23. Incorvia, Samuel A.; Powers, Thomas, Resin bonded sorbent.
  24. Incorvia, Samuel A.; Solovyov, Stanislav E.; Powers, Thomas H.; Alabran, Michael W., Resin bonded sorbent.
  25. Fay,Jonathan; Nason,Kevin; Parikh,Bhairavi; Hammerman,John; Stone,James; Anvar,David, Sample conditioning and environmental control techniques for gas sensor.
  26. McKinnell,James; Diest,Kenneth; Chen,Chien Hua, Structure for containing desiccant.
  27. Davidson, Roderick Iain, Transport package.
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