IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0282921
(2002-10-28)
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발명자
/ 주소 |
- Kawaji, Hideki Ted
- White, Mark R.
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출원인 / 주소 |
- Melexis NV Miroelectronics Integrated Systems
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
4 인용 특허 :
5 |
초록
▼
A local oscillator and logic circuit pulses the open winding of a brushless DC motor at start up and the back EMF is used to generate a voltage to boost the voltage available to the control circuit for optimizing performance when starting with low supply voltage. As the rotor of a motor rotates and
A local oscillator and logic circuit pulses the open winding of a brushless DC motor at start up and the back EMF is used to generate a voltage to boost the voltage available to the control circuit for optimizing performance when starting with low supply voltage. As the rotor of a motor rotates and the windings are commutated by the drive electronics there is generated in each winding a voltage caused by the collapse of the current and the inherent inductance of the winding. These voltages exceed the normal operating voltage of the motor. The energy in these voltages is used to generate a regulated power feed to the analogue circuitry of the control circuit at a suitable voltage level. During steady state conditions, when the motor is running, the commutation of the windings is continual and there is ample energy available to power analogue electronics, and, if required, associated digital electronics as well. At start up, however, when the motor is stationary, there is no commutation and thus no additional voltage pulses from which to generate a supply for the analogue circuitry. Accordingly, additional circuitry is included to drive one of the motor windings with short voltage pulses such as to create inductive voltages that can be used to create the desired regulated power feed for the analogue circuitry. This feed, once established, enables the analogue circuitry to accurately determine the state and position of the rotor and cause the correct winding to be driven. The motor will then start and usual steady state conditions will become established.
대표청구항
▼
A local oscillator and logic circuit pulses the open winding of a brushless DC motor at start up and the back EMF is used to generate a voltage to boost the voltage available to the control circuit for optimizing performance when starting with low supply voltage. As the rotor of a motor rotates and
A local oscillator and logic circuit pulses the open winding of a brushless DC motor at start up and the back EMF is used to generate a voltage to boost the voltage available to the control circuit for optimizing performance when starting with low supply voltage. As the rotor of a motor rotates and the windings are commutated by the drive electronics there is generated in each winding a voltage caused by the collapse of the current and the inherent inductance of the winding. These voltages exceed the normal operating voltage of the motor. The energy in these voltages is used to generate a regulated power feed to the analogue circuitry of the control circuit at a suitable voltage level. During steady state conditions, when the motor is running, the commutation of the windings is continual and there is ample energy available to power analogue electronics, and, if required, associated digital electronics as well. At start up, however, when the motor is stationary, there is no commutation and thus no additional voltage pulses from which to generate a supply for the analogue circuitry. Accordingly, additional circuitry is included to drive one of the motor windings with short voltage pulses such as to create inductive voltages that can be used to create the desired regulated power feed for the analogue circuitry. This feed, once established, enables the analogue circuitry to accurately determine the state and position of the rotor and cause the correct winding to be driven. The motor will then start and usual steady state conditions will become established. od of claim 1, said creating a base of said torch bump comprising the steps of: depositing a first layer of dry film over said layer of UBM; patterning said first layer of dry film, creating an opening through said first layer of dry film that aligns with said contact pad, creating a first mask of dry film, exposing said layer of UBM; and depositing said first successive layers of metal over the exposed surface of said layer of UBM in accordance with the opening created through said first mask of dry film. 3. The method of claim 1, said first layer of copper being deposited to a thickness of about 90 &mgr;m.4. The method of claim 1, said second layer of nickel being deposited to a thickness of about 5 &mgr;m.5. The method of claim 1, said third layer of gold being deposited to a thickness of about 5 &mgr;m.6. The method of claim 1, said creating a layer of solder comprising the steps of: depositing a second layer of dry film over said first layer of dry film, thereby including said base of said torch bump; patterning said second layer of dry film, creating an opening through said second layer of dry film that aligns with said base of said torch bump, creating a second mask of dry film, exposing said base of said torch bump; and depositing a layer of solder in accordance with the opening created through said second mask of dry film. 7. The method of claim 1, said layer of UBM comprising nickel.8. The method of claim 7, said nickel being deposited to a thickness between about 1 and 10 &mgr;m.9. The method of claim 1, with an additional step of etching said layer of UBM using said created base of said torch bump and said created layer of solder as a mask.10. The method of claim 9, said etching said layer of UBM comprising a wet etch process.11. The method of claim 1, parameters of first and second dry film thickness in combination with parameters of said first layer of dry film as a mask and said second layer of dry film as a mask being selected such that the diameter of the base of said torch bump is larger than the largest diameter of the reflowed layer of solder of said torch bump which is larger than the diameter of the contact surface between the reflowed layer of solder and the base of the torch bump.12. The method of claim 1, parameters of first and second dry film thickness in combination with parameters of said first layer of dry film as a mask and said second layer of dry film as a mask being selected such that the diameter of the base of the torch bump is equal to the largest diameter of the reflowed layer of solder which is larger than the diameter of the contact surface between the reflowed layer of solder and the base of the torch bump.13. The method of claim 1, parameters of first and second dry film thickness in combination with parameters of said first layer of dry film as a mask and said second layer of dry film as a mask being selected such that the diameter of the base of the torch bump is smaller than the largest diameter of the reflowed layer of solder of the torch bump.14. A method for the creation of a torch bump, comprising the steps of: providing a substrate, said substrate having been provided with a contact pad, a patterned layer of passivation having been deposited over the substrate, a surface of said contact pad being exposed through said patterned layer of passivation, a layer of UBM (Under-Bump-Metallurgy) having been blanket deposited over the layer of passivation including the exposed surface of the contact pad; creating a base of said torch bump of successive second layers of metal overlying said contact pad using a patterned first layer of dry film as a mask, said successive second layers of metal comprising: (i) a first layer of solder deposited over the exposed surface of said layer of UBM; and(ii) a second layer of eutectic solder paste deposited over said first layer of solder then; creating a layer of solder of said torch bump overlying said base using a patterned s
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