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Refrigeration cooling assisted MEMS-based micro-channel cooling system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0360345 (2003-02-07)
발명자 / 주소
  • Monfarad, Ali Heydari
출원인 / 주소
  • Sun Microsystems, Inc.
대리인 / 주소
    Gunnison, McKay & Hodgson, L.L.P.
인용정보 피인용 횟수 : 16  인용 특허 : 25

초록

A refrigeration cooling assisted MEMS-based micro-channel cooling system that removes high heat densities generated by microelectronic components using a primary cooling system thermally coupled with a secondary chip embedded cooling system.

대표청구항

A refrigeration cooling assisted MEMS-based micro-channel cooling system that removes high heat densities generated by microelectronic components using a primary cooling system thermally coupled with a secondary chip embedded cooling system. it for modeling a flywheel mass assuring that a movement o

이 특허에 인용된 특허 (25)

  1. Numoto Hironao,JPX ; Haneda Kanji,JPX ; Fujitaka Akira,JPX ; Sato Shigehiro,JPX ; Watanabe Yukio,JPX ; Yakumaru Yuichi,JPX ; Kobayashi Yoshinori,JPX, Apparatus having refrigeration cycle.
  2. Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Combined air and refrigeration cooling for computer systems.
  3. Porter Warren W. (Escandido CA), Computer component cooling system with local evaporation of refrigerant.
  4. Cree Roger W. (Stillwater MN), Computer cooling system.
  5. Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Cooling computer systems.
  6. Lee Richard,TWX ; Lee Ken,TWX ; Chen Stanley,TWX, Cooling device for central processing unit module.
  7. Simon, Jonathan, Cooling of substrate-supported heat-generating components.
  8. Kobayashi Kyoji (Sagamihara JPX) Kosaka Takaichi (Hino JPX) Takahara Sigeki (Kawasaki JPX) Tamura Akira (Chiba JPX), Cooling system.
  9. Berry Robert L. (Rancho Palos Verdes CA) Siciliano Samuel G. (San Pedro CA), Cryogenic refrigerator having a regenerator with primary and secondary flow paths.
  10. Kawahara Sadao,JPX ; Akazawa Teruyuki,JPX, Linear compressor.
  11. Kyung Bum Hur KR; Hyuk Lee KR, Linear compressor.
  12. Park Jung Sik,KRX ; Lee Hysong Kook,KRX ; Kwon Byeong Ha,KRX, Linear compressor.
  13. Seo Kwang Ha,KRX, Linear compressor.
  14. Yatsuzuka Shinichi,JPX ; Hagiwara Yasumasa,JPX, Linear compressor for regenerative refrigerator.
  15. Funatsu Yoshinori,JPX ; Okumura Nobuo,JPX, Linear compressor with a coaxial piston arrangement.
  16. Wall Charles B. ; Peeples Johnston W. ; Craps Terry ; DiGiacomo Robert, Method and apparatus for cooling an integrated circuit device.
  17. Tuckerman David B. (Stanford CA) Pease Roger F. W. (Stanford CA), Method and means for improved heat removal in compact semiconductor integrated circuits.
  18. Hare Jeffrey J. ; Harris Willard S. ; Hickey Jody A. ; Schmidt Roger R. ; Seminaro Edward J. ; Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Modular refrigeration system.
  19. Hamilton Robin E. ; Kennedy Paul G. ; Vale Christopher R., Non-mechanical magnetic pump for liquid cooling.
  20. van der Walt Nicholas R. ; Unger Reuven Z., Refrigeration circuit having series evaporators and modulatable compressor.
  21. van der Walt Nicholas R. ; Unger Reuven Z., Refrigeration circuit having series evaporators and modulatable compressor.
  22. Davidson Howard L. ; Pfister Dennis M. ; Byrd Charles, Refrigeration system for electronic components having environmental isolation.
  23. Hiterer Misha (Jerusalem ILX) Kushnir Mark (Rehovot ILX), Synchronous twin reciprocating piston apparatus.
  24. Shyy, Wei; Francois, Marianne Monique; Chung, Jacob Nan-Chu, Thermal management device.
  25. Charles M. Newton ; Carol A. Gamlen ; Raymond C. Rumpf, Jr., Thermally enhanced microcircuit package and method of forming same.

이 특허를 인용한 특허 (16)

  1. Hamann, Hendrik F.; Iyengar, Madhusudan K.; van Kessel, Theodore G., Cooling infrastructure leveraging a combination of free and solar cooling.
  2. Heydari,Ali; Yang,Ji L., Direct contact cooling liquid embedded package for a central processor unit.
  3. Moghaddam, Saeed; Ohadi, Michael M., Electrohydrodynamic (EHD) thin film evaporator with splayed electrodes.
  4. Stepanov, Stanislav; Ruschin, Shlomo, Embedded channels, embedded waveguides and methods of manufacturing and using the same.
  5. Monfarad, Ali Heydari; Yang, Ji L., Embedded microchannel cooling package for a central processor unit.
  6. Heydari,Ali; Gektin,Vadim, Gasketed field-replaceable active integrated liquid pump heat sink module for thermal management of electronic components.
  7. Tang, Xian-Xiu, Heat dissipation system and rack-mount server using the same.
  8. Yao, Qizhou Matthew; Legge, Ryan J., Liquid cooling with parasitic phase-change pumps.
  9. Kirshberg, Jeffrey; Yerkes, Kirk L.; Liepmann, Dorian, MEMS microcapillary pumped loop for chip-level temperature control.
  10. Zhang, Ming; Nguyen, Ken, Microchannel suction line heat exchanger.
  11. Heydari,Ali, Multiple component field-replaceable active integrated liquid pump heat sink module for thermal management of electronic components.
  12. Shyy, Wei; Francois, Marianne Monique; Chung, Jacob Nan-Chu, Thermal management device.
  13. Prasher, Ravi; Mahajan, Ravi, Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink.
  14. Qu, Weilin, Two-phase cross-connected micro-channel heat sink.
  15. Chainer, Timothy Joseph; Parida, Pritish Ranjan; Schultz, Mark Delorman, Two-phase liquid cooled electronics.
  16. Heydari, Ali, Unitary field-replaceable active integrated liquid pump heat sink module for thermal management of electronic components.
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