IPC분류정보
국가/구분 |
United States(US) Patent
등록
|
국제특허분류(IPC7판) |
|
출원번호 |
US-0180097
(2002-06-27)
|
우선권정보 |
JP-0195110 (2001-06-27) |
발명자
/ 주소 |
|
출원인 / 주소 |
|
대리인 / 주소 |
|
인용정보 |
피인용 횟수 :
5 인용 특허 :
4 |
초록
▼
A method for manufacturing a wiring substrate1includes a conductor layer forming step for forming a second conductor layer29, through electroless copper plating and copper electroplating, on a first resin dielectric layer7, which is surface-roughened to a predetermined roughness and to which palladi
A method for manufacturing a wiring substrate1includes a conductor layer forming step for forming a second conductor layer29, through electroless copper plating and copper electroplating, on a first resin dielectric layer7, which is surface-roughened to a predetermined roughness and to which palladium adheres; a cyan treatment step for cleaning a substrate41on which the second conductor layer29is formed, using a cyanide-containing solution; and an upper resin dielectric layer forming step for forming a second resin dielectric layer9on the first resin dielectric layer7and the second conductor layer29of the cyan-treated substrate41.
대표청구항
▼
1. A method for manufacturing a wiring substrate including a resin dielectric layer, a conductor layer formed in a predetermined pattern on the resin dielectric layer, and an upper resin dielectric layer formed on the resin dielectric layer and on the conductor layer, comprising: a conductor layer
1. A method for manufacturing a wiring substrate including a resin dielectric layer, a conductor layer formed in a predetermined pattern on the resin dielectric layer, and an upper resin dielectric layer formed on the resin dielectric layer and on the conductor layer, comprising: a conductor layer forming step of forming the conductor layer, through electroless copper plating and copper electroplating, on the resin dielectric layer of the substrate, the resin dielectric layer having a surface which has been surface-roughened to a predetermined roughness and to which palladium adheres; a cyan treatment step of cleaning the substrate, on which the conductor layer has been formed, with a cyanide-containing solution; and an upper resin dielectric layer forming step of forming an upper resin dielectric layer on the resin dielectric layer and the conductor layer of the cyan-treated substrate. 2. The method for manufacturing a wiring substrate as claimed in claim 1, wherein, the cyan treatment step comprises cleaning the substrate a plurality of times with the cyanide-containing solution and drying the substrate between cleanings.3. The method for manufacturing a wiring substrate as claimed in claim 1, which comprises maintaining the substrate at a temperature not higher than about 85° C. in the course of working ranging from the conductor layer forming step to the cyan treatment step.4. The method for manufacturing a wiring substrate as claimed in claim 2, which comprises maintaining the substrate at a temperature not higher than about 85° C. in the course of working ranging from the conductor layer forming step to the cyan treatment step.5. The method for manufacturing a wiring substrate as claimed in claim 1, which further comprises conducting a heat treatment step after the cyan treatment step and before the upper resin dielectric layer forming step, for heating the cyan-treated substrate to a temperature higher than about 85° C.6. The method for manufacturing a wiring substrate as claimed in claim 5, which further comprises conducting a conductor roughening step after the heat treatment step and before the upper resin dielectric layer forming step, for roughening the surface of the conductor layer.7. A method for manufacturing a wiring substrate including a resin dielectric layer, a conductor layer of a predetermined pattern formed on the resin dielectric layer, and an upper resin dielectric layer formed on the resin dielectric layer and on the conductor layer, comprising: an electroless copper plating step of forming an electroless copper plating layer, through electroless copper plating, on the resin dielectric layer of the substrate, the resin dielectric layer having a surface which has been surface-roughened to a predetermined roughness and to which palladium adheres; a drying step of drying the substrate on which the electroless copper plating layer has been formed, at a temperature not higher than about 85° C.; a plating resist layer forming step of forming, after the drying step, a plating resist layer of a predetermined pattern on the electroless copper plating layer; a copper electroplating step of forming a copper electroplating layer, through copper electroplating, on the electroless copper plating layer exposed through the plating resist layer; a plating resist layer removing step of removing, after the copper electroplating step, the plating resist layer; an etching-away step of etching away the electroless copper plating layer except where the same is overlaid with the copper electroplating layer, thereby forming the conductor layer; a cyan treatment step of cleaning the substrate, on which the conductor layer has been formed, using a cyanide-containing solution; and an upper resin dielectric layer forming step of forming an upper resin dielectric layer on the resin dielectric layer and the conductor layer of the cyan-treated substrate. 8. The method for manufacturing a wiring s ubstrate as claimed in claim 7, wherein the cyan treatment step comprises cleaning the substrate a plurality of times using the cyanide-containing solution and drying the substrate between cleanings.9. The method for manufacturing a wiring substrate as claimed in claim 7, which further comprises conducting a heat treatment step after the cyan treatment step and before the upper resin dielectric layer forming step, for heating the cyan-treated substrate to a temperature higher than about 85° C.10. The method for manufacturing a wiring substrate as claimed in claim 8, which further comprises conducting a heat treatment step after the cyan treatment step and before the upper resin dielectric layer forming step, for heating the cyan-treated substrate to a temperature higher than about 85° C.11. The method for manufacturing a wiring substrate as claimed in claim 9, which further comprises conducting a roughening step after the heat treatment step and before the upper resin dielectric layer forming step, for roughening the surface of the conductor layer.
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