IPC분류정보
국가/구분 |
United States(US) Patent
등록
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국제특허분류(IPC7판) |
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출원번호 |
US-0832560
(2001-04-11)
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발명자
/ 주소 |
- Doan, Trung T.
- Blalock, Guy T.
- Durcan, Mark
- Meikle, Scott G.
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출원인 / 주소 |
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대리인 / 주소 |
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인용정보 |
피인용 횟수 :
4 인용 특허 :
55 |
초록
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A method of manufacturing semiconductor devices using an improved chemical mechanical planarization process for the planarization of the surfaces of the wafer on which the semiconductor devices are formed. The improved chemical mechanical planarization process includes the formation of a flat planar
A method of manufacturing semiconductor devices using an improved chemical mechanical planarization process for the planarization of the surfaces of the wafer on which the semiconductor devices are formed. The improved chemical mechanical planarization process includes the formation of a flat planar surface from a deformable coating on the surface of the wafer filling in between the surface irregularities prior to the planarization of the surface through a chemical mechanical planarization process.
대표청구항
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1. A planarization method for planarizing a surface of a wafer comprising: providing a wafer having a surface; coating the surface of the wafer using a deformable material; contacting the deformable material with an object; forming a substantially flat planar surface on the deformable mat
1. A planarization method for planarizing a surface of a wafer comprising: providing a wafer having a surface; coating the surface of the wafer using a deformable material; contacting the deformable material with an object; forming a substantially flat planar surface on the deformable material on the surface of the wafer; hardening the deformable material while the object contacts the deformable material; and planarizing the wafer using a chemical mechanical planarization process. 2. A planarization method for planarizing a surface of a wafer comprising: providing the wafer having a surface; coating the surface of the wafer using a deformable material; contacting the deformable material with an object; forming a substantially flat planar surface the deformable material on the surface of the wafer; solidifying the deformable material while the object contacts the deformable material; and planarizing the wafer using a chemical mechanical planarization process. 3. A planarization method for planarizing a surface of a wafer comprising: providing a wafer having a surface; coating the surface of the wafer using a deformable material; contacting the deformable material with an object; forming a substantially flat planar surface on the deformable material on the surface of the wafer; performing one of a group of curing, hardening, and solidifying the deformable material while the object is contacting the deformable material; and planarizing the wafer using a chemical mechanical planarization process. 4. The method of claim 3, further comprising: applying pressure to the object contacting the deformable material while the object contacts the deformable material. 5. The method of claim 3, further comprising: applying pressure to the deformable material on the surface of the wafer while the object contacts the deformable material. 6. The method of claim 3, wherein the object includes a substantially flat planar surface thereon contacting the deformable material.7. The method of claim 3, wherein the object comprises a substantially inflexible object having a flat surface thereon.8. The method of claim 3, further comprising: contacting the wafer with a flexible resilient member. 9. The method of claim 8, wherein a back of the wafer is contacted with the flexible resilient member.10. The method of claim 8, further comprising: applying pressure to the flexible resilient member to form a substantially flat planar surface on the deformable material. 11. The method of claim 10, further comprising: contacting the flexible resilient member with a substrate; and applying pressure to the substrate for applying pressure to the flexible resilient member. 12. The method of claim 10, further comprising: applying pressure to the wafer through the flexible resilient member for applying pressure to the object for deforming the deformable material on the wafer. 13. The method of claim 3, wherein the wafer comprises a wafer having electrical circuit components on a surface thereof.14. The method of claim 3, wherein the wafer comprises a wafer having a plurality of electrical circuit components on a surface thereof and a coating substantially covering the plurality of electrical circuit components.15. The method of claim 3, wherein the wafer comprises a wafer having a plurality of electrical components on a surface thereof and a coating substantially covering the plurality of electrical components and the wafer.16. The method of claim 3, further comprising: applying a substantially uniform pressure to the object while the object is in contact with the deformable material. 17. The method of claim 3 further comprising: applying a substantially uniform pressure to the deformable material on the surface of the wafer for forming a substantially flat planar surface on the deformable material. 18. A planarization method for planarizing a surface of a wafer comprising: providing a wafer havin g a surface; coating the surface of the wafer using a deformable material; contacting the deformable material with an object, the object including a shaped surface thereon contacting the deformable material, the shaped surface including a convex surface portion; forming a substantially flat planar surface on the surface of the wafer; and planarizing the wafer using a chemical mechanical planarization process. 19. A planarization method for planarizing a surface of a wafer comprising: providing a wafer having a surface; coating the surface of the wafer using a deformable material; contacting the deformable material with an object, the object including a shaped surface thereon contacting the deformable material, the shaped surface including a concave surface portion; forming a substantially flat planar surface on the surface of the wafer; and planarizing the wafer using a chemical mechanical planarization process. 20. A planarization method for planarizing a surface of a wafer comprising: providing the wafer having a surface; coating the surface of the wafer using a deformable material; contacting the deformable material with an object, the object including a shaped surface thereon contacting the deformable material, the shaped surface including a convex surface portion and a concave surface portion; forming a substantially flat planar surface on the shaped surface of the wafer; and planarizing the wafer using a chemical mechanical planarization process. 21. A planarization method for planarizing a surface of a wafer comprising: providing the wafer having a surface; coating the surface of the wafer using a deformable material; contacting the deformable material with an object, the object including a shaped surface thereon contacting the deformable material, the object including a flat optical glass object; forming a substantially flat planar surface on the surface of the wafer; and planarizing the wafer using a chemical mechanical planarization process. 22. A planarization method for planarizing a surface of a wafer comprising: providing the wafer having a surface; coating the surface of the wafer using a deformable material; contacting the deformable material with an object, the object including a shaped surface thereon contacting the deformable material; coating the object with a release agent prior to the contacting the deformable material; forming a substantially flat planar surface on the surface of the wafer; and planarizing the wafer using a chemical mechanical planarization process. 23. A planarization method for planarizing a surface of a wafer having at least one electrical circuit formed thereon comprising: providing the wafer having a surface thereon; coating the surface of the wafer using a deformable material; contacting the deformable material with an object; forming a substantially flat planar surface on the surface of the wafer; curing the deformable material while the object contacts the deformable material; and planarizing the substantially flat planar surface on the wafer using a chemical mechanical planarization process. 24. A planarization method for planarizing a surface of a wafer having at least one electrical circuit formed thereon comprising: providing the wafer having a surface; coating the surface of the wafer using a deformable material; contacting the deformable material with an object; forming a substantially flat planar surface on the surface of the wafer; hardening the deformable material while the object contacts the deformable material; and planarizing the substantially flat planar surface on the wafer using a chemical mechanical planarization process. 25. A planarization method for planarizing a surface of a wafer having at least one electrical circuit formed thereon comprising: providing said wafer having a surface; coating the surface of the wafer using a deformable material; contacting the deformable material with an object; forming a substantially flat planar surface on the surface of the wafer; solidifying the deformable material while the object contacts the deformable material; and planarizing the substantially flat planar surface on the wafer using a chemical mechanical planarization process. 26. The method of claim 25, further comprising: applying pressure to the object contacting the deformable material while the object contacts the deformable material. 27. The method of claim 25, further comprising: applying pressure to the deformable material on the surface of the wafer while the object contacts the deformable material. 28. The method of claim 25, wherein the object includes a substantially flat planar surface thereon for contacting the deformable material.29. The method of claim 25, wherein the object includes a shaped surface thereon for contacting the deformable material.30. A planarization method for planarizing a surface of a wafer having at least one electrical circuit formed thereon comprising: providing the wafer having a surface; coating the surface of the wafer using a deformable material; contacting the deformable material with an object, the object including a shaped surface thereon for contacting the deformable material, the shaped surface including a convex surface portion; forming a substantially flat planar surface on the surface of the wafer; and planarizing the substantially flat planar surface on the wafer using a chemical mechanical planarization process. 31. A planarization method for planarizing a surface of a wafer having at least one electrical circuit formed thereon comprising: providing the wafer having a surface; coating the surface of the wafer using a deformable material; contacting the deformable material with an object, the object including a shaped surface thereon contacting the deformable material, the shaped surface including a concave surface portion; forming a substantially flat planar surface on the surface of the wafer; and planarizing the substantially flat planar surface on the wafer using a chemical mechanical planarization process. 32. A planarization method for planarizing a surface of a wafer having at least one electrical circuit formed thereon comprising: providing the wafer having a surface; coating the surface of the wafer using a deformable material; contacting the deformable material with an object, the object including a shaped surface thereon contacting the deformable material, the shaped surface including a convex surface portion and a concave surface portion; forming a substantially flat planar surface on the surface of the wafer; and planarizing the substantially flat planar surface on the wafer using a chemical mechanical planarization process. 33. The method of claim 32, wherein the shaped surface comprises a desired shaped surface.34. A planarization method for planarizing a film on a surface of a wafer having at least one electrical circuit formed thereon comprising: providing the wafer having a surface; coating the surface of the wafer using a deformable material; contacting the deformable material with an object, the object including a flat optical glass object; forming a substantially flat planar surface on the surface of the wafer; and planarizing the substantially flat planar surface on the wafer using a chemical mechanical planarization process. 35. A planarization method for planarizing a surface of a wafer having at least one electrical circuit formed thereon comprising: providing the wafer having a surface; providing an object; coating the surface of the wafer with a deformable material; coating the object with a release agent; contacting the deformable material with the object; forming a substantially flat planar surface on the surface of the wafer; and planarizing the substantially flat planar surface on the wafer using a c hemical mechanical planarization process. 36. A planarization method for planarizing a nonplanar film surface of a wafer comprising: providing an object having a flat surface thereon; applying a deformable material to the nonplanar film surface of the wafer; contacting the deformable material with the object; forming a substantially flat planar surface on the deformable material on the surface of said wafer; and planarizing the wafer using a chemical mechanical planarization process. 37. A planarization method for planarizing a nonplanar film surface of a wafer, the method comprising: providing an object having a flat planar surface thereon; providing a flexible resilient member at a back of the wafer; applying a deformable material to the nonplanar film surface of the wafer; contacting the deformable material; forming a substantially flat planar surface on the deformable material on the nonplanar film surface of the wafer; and planarizing the wafer using a chemical mechanical planarization process. 38. The method of claim 37, wherein the deformable material is contacted by the object.39. A planarization method for planarizing a nonplanar surface of a wafer comprising: providing an object having a flat planar surface thereon; applying a deformable material to the nonplanar surface of the wafer; contacting the deformable material with the object; forming a substantially flat planar surface on the deformable material on the nonplanar surface of the wafer; and planarizing the wafer using a chemical mechanical planarization process. 40. A planarization method for planarizing a nonplanar surface of a wafer comprising: providing an object having a flat planar surface thereon; providing a flexible resilient member to at least a portion of the wafer; applying a deformable material to the nonplanar surface of the wafer; contacting the deformable material with the object; forming a substantially flat planar surface on the deformable material on the nonplanar surface of the wafer; and planarizing the wafer using a chemical mechanical planarization process. 41. A planarization method for planarizing a nonplanar surface of a wafer comprising: providing an object having a flat planar surface thereon; providing a flexible resilient member; applying a deformable material to the nonplanar surface of the wafer; contacting another surface of the wafer with the flexible resilient member; applying pressure to the deformable material with the object; forming a substantially flat planar surface on the deformable material on said nonplanar surface of the wafer; and planarizing the wafer using a chemical mechanical planarization process. 42. A planarization method for planarizing a nonplanar surface of a wafer comprising: providing an object having a flat planar surface thereon; providing a flexible resilient member on at least a portion of another surface of the wafer; applying a deformable material to the nonplanar surface of the wafer; contacting the deformable material; forming a substantially flat planar surface on the deformable material on the nonplanar surface of the wafer; and planarizing the substantially flat planar surface on the deformable material on the nonplanar surface of the wafer using a chemical mechanical planarization process. 43. A planarization method for planarizing a nonplanar surface of a wafer comprising: providing an object having a flat planar surface thereon; providing a flexible resilient member; applying a deformable material to the nonplanar surface of the wafer; contacting at least a portion of another surface of the wafer with the flexible resilient member; applying pressure to the deformable material; forming a substantially flat planar surface on the deformable material on the nonplanar surface of the wafer; and planarizing the substantially flat planar surface on the deformable material on the nonplanar surface of the wafer using a chemical mechanical planarization process. 44. A planarization method for planarizing a nonplanar film surface of a wafer comprising: coating the nonplanar film surface of the wafer using a deformable material; contacting the deformable material with an object; forming a substantially flat planar surface on the nonplanar film surface of the wafer; performing one of a group of curing, hardening, and solidifying the deformable material while the object is contacting the deformable material; and planarizing the wafer using a chemical mechanical planarization process. 45. A planarization method for planarizing a nonplanar surface of a wafer having at least one electrical circuit formed thereon comprising: coating the nonplanar surface of the wafer using a deformable material; contacting the deformable material with an object; forming a substantially flat planar surface on the nonplanar surface of the wafer by performing one of a group of curing, hardening, and solidifying the deformable material while the object contacts the deformable material; and planarizing the substantially flat planar surface on the wafer using a chemical mechanical planarization process.
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