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Substrate transfer shuttle 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B65G-049/07
출원번호 US-0881009 (2001-06-13)
발명자 / 주소
  • White, John M.
  • Turner, Norman L.
  • Tiner, Robin L.
  • Keller, Ernst
  • Kurita, Shinichi
  • Blonigan, Wendell T.
  • Berkstresser, David E.
출원인 / 주소
  • Applied Materials, Inc.
대리인 / 주소
    Moser, Patterson & Sheridan LLP
인용정보 피인용 횟수 : 16  인용 특허 : 81

초록

The present invention provides an apparatus and method for substrate transport. In systems according to the invention, at least a first and second chamber are provided. The first chamber may be a load lock and the second chamber a processing chamber. A substrate transfer shuttle is provided and is m

대표청구항

1. A substrate transfer shuttle for carrying a substrate in a processing system having at least two chambers, comprising: first and second longitudinal side rails each including a toothed rack mounted thereon; cross members proximate first and second ends of the first and second longitudinal si

이 특허에 인용된 특허 (81)

  1. Chu Jack Oon ; Ismail Khalid Ezzeldin, Advance integrated chemical vapor deposition (AICVD) for semiconductor devices.
  2. White John M. (Hayward CA) Berkstresser David E. (Los Gatos CA) Petersen Carl T. (Fremont CA), Alignment of a shadow frame and large flat substrates on a heated support.
  3. White John M. (2811 Colony View Pl. Hayward CA 94541) Berkstresser David E. (19311 Bear Creek Rd. Los Gatos CA 95030) Petersen Carl T. (1185 Gilbert Ct. Fremont CA 94536), Alignment of a shadow frame and large flat substrates on a support.
  4. Matsumura Yoshio (Shiga JPX) Matsui Hiroshi (Kyoto JPX), Apparatus and a method for carrying wafers.
  5. Prentakis Antonios E. (Cambridge MA), Apparatus and method for loading and unloading wafers.
  6. Hirasawa Shigeki (Ibaraki) Torii Takuji (Ushiku) Watanabe Tomoji (Ibaraki) Komatsu Toshihiro (Ibaraki) Honma Kazuo (Ibaraki) Sakai Akihiko (Ibaraki) Takagaki Tetsuya (Tokorozawa) Uchino Toshiyuki (To, Apparatus and method for performing heat treatment on semiconductor wafers.
  7. Stevens Craig L. (Felton CA), Apparatus for aligning substrates for loading and unloading using a robot mechanism.
  8. Ushijima Mitsuru (Tokyo JPX) Akimoto Masami (Kikuchi JPX), Apparatus for coating a photo-resist film and/or developing it after being exposed.
  9. Anderle Friedrich (Hanau DEX) Patz Ulrich (Linsengericht DEX), Apparatus for coating substrates, preferably flat, more or less plate-like substrates.
  10. Sugimoto Kenji (Kyoto JPX), Apparatus for treating the surfaces of wafers.
  11. Giammanco Rosario P. (Gloucester MA), Article delivery and transport apparatus for evacuated processing equipment.
  12. Beer Emanuel ; White John M., Automated substrate processing system.
  13. Wochinski Ronald F. (Palatine IL) Schubert John S. (Arlington Heights IL) Salmons Victor L. (Waukegan IL), Check protector with means for printing amount in bands of different colors.
  14. Tanaka Hirokuni (Ooiso JPX), Clean tunnel conveying structure.
  15. Tepman Avi ; Yin Gerald Zheyao ; Olgado Donald, Compartmentalized substrate processing chamber.
  16. Toriumi Kiyoshi (Tokyo) Kimura Kazumasa (Tokyo JPX), Conveying apparatus used in assembling semicondutors.
  17. Fukuwatari Ichiro (both c/o Hitachi Kiden Kogyo ; Ltd. ; 1-go 11-ban ; 3-chome Shimosakabe ; Amagasaki ; Hyogo JPX) Watanabe Seiji (both c/o Hitachi Kiden Kogyo ; Ltd. ; 1-go 11-ban ; 3-chome Shimosa, Conveyor means for wafers.
  18. Southworth Peter R. (Mission Viejo CA) Baxter Gregory R. (Orange CA), Conveyor system.
  19. Burney Roger D. (Sunnyvale CA), Distributed routing unit for fully-automated flexible manufacturing system.
  20. Fairbairn Kevin ; Lane Christopher ; Colborne Kelly ; Sundar Satish, Dual blade robot.
  21. Asakawa Teruo (Yamanashi JPX) Ohsawa Tetsu (Kofu JPX), Handling apparatus for transferring carriers and a method of transferring carriers.
  22. Chizinsky George (143 West St. Beverly Farms MA 01915), Heated plate rapid thermal processor.
  23. Chizinsky George (143 West St. Beverly Farms MA 01915), Heated plate rapid thermal processor.
  24. Flint Alan (Los Gatos CA) Miller Ken (Mt. View CA) Shah Sushil (Sunnyvale CA), In-line disk sputtering system.
  25. Aruga Yoshiki,JPX ; Kamikura Yo,JPX, In-line film deposition system.
  26. Kurita Shinichi ; White John M., In-situ substrate transfer shuttle.
  27. Mizuno Shigeru (Kawasaki JPX) Katsumata Yoshihiro (Fujiyoshida JPX) Takahashi Nobuyuki (Mitaka JPX), Integrated module multi-chamber CVD processing system and its method for processing substrates.
  28. Ettinger Gary C. ; White John M., Isolation valves.
  29. Tietz James V. ; Bierman Benjamin, Lift pin and support pin apparatus for a processing chamber.
  30. Brancher Carl D. (Abergavenny GBX), Loading mechanisms.
  31. Hasegawa Yoshiro,JPX ; Suzuki Naoyuki,JPX ; Abe Tomoaki,JPX, Magnetic transfer system, power transmission mechanism of the magnetic transfer system, and rotational driving member u.
  32. Shimoyashiro Sadao (Fujisawa JPX) Iwasaki Takemasa (Yokohama JPX) Kawaji Hiroyuki (Yokohama JPX) Hamada Toyohide (Yokohama JPX) Ikeda Minoru (Yokohama JPX) Kikuchi Hiroshi (Hiratsuka JPX) Nagatomo Hi, Method and apparatus for carrying a variety of products.
  33. Turner Norman (Mountain View CA) White John (Hayward CA) Mak Alfred (Union City CA), Method and apparatus for cooling rectangular substrates.
  34. White John M. ; Blonigan Wendell T. ; Tiner Robin L. ; Kurita Shinichi, Method and apparatus for substrate transfer and processing.
  35. Coleman John H. (Locust Valley NY), Method of forming semiconducting materials and barriers using a dual enclosure apparatus.
  36. Coleman John H. (Locust Valley NY), Method of forming semiconducting materials and barriers using a multiple chamber arrangement.
  37. Turner Norman L. (Mountain View CA) White John MacNeill (Los Gatos CA) Berkstresser David (Los Gatos CA), Method of heating and cooling large area glass substrates.
  38. Turner Norman L. (Mountain View CA) White John M. (Los Gatos CA) Berkstresser David (Los Gatos CA), Method of heating and cooling large area substrates and apparatus therefor.
  39. Yamabe Kikuo (Yokohama JPX) Okumura Katsuya (Yokohama JPX), Method of thermally processing semiconductor wafers and an apparatus therefor.
  40. Mahler Peter (Hainburg DEX), Modular vacuum system for the treatment of disk-shaped workpieces.
  41. Maydan Dan (Los Altos Hills CA) Somekh Sasson (Redwood City CA) Wang David N. (Cupertino CA) Cheng David (San Jose CA) Toshima Masato (San Jose CA) Harari Isaac (Mountain View CA) Hoppe Peter D. (Sun, Multi-chamber integrated process system.
  42. Namiki Minoru (Fuchu JPX) Takahashi Nobuyuki (Fuchu JPX), Multi-chamber integrated process system.
  43. White John M. ; Blonigan Wendell T. ; Richter Michael W., Multi-function chamber for a substrate processing system.
  44. Hartig Klaus (Brighton MI) Szczyrbowski Joachim (Goldbach DEX), Multichamber coating apparatus.
  45. Maydan Dan (Los Altos Hills CA) Somekh Sasson (Redwood City CA) Wang David N. (Cupertino CA) Cheng David (San Jose CA) Toshima Masato (San Jose CA) Harari Isaac (Mountain View CA) Hoppe Peter D. (Sun, Multichamber integrated process system.
  46. Kaneko Satoshi (Yokohama JPX) Fugita Taichi (Yamato JPX) Yoshida Yukimasa (Yokohama JPX) Okumura Katsuya (Yokohama JPX), Pressure-reduced chamber system having a filter means.
  47. Schmitt Jacques (La Ville Du Bois FRX), Process and means for producing films for use in electronics and/or optoelectronics using plasma.
  48. Kawamura Yoshio (Kokubunji JPX) Moriyama Shigeo (Tama JPX) Yamamoto Tatuharu (Higashi-Murayama JPX) Uchida Fumihiko (Hachioji JPX), Processing method and equipment for processing a semiconductor device having holder/carrier with flattened surface.
  49. Lee Chunghsin (Lynnfield MA), Rapid thermal furnace for semiconductor processing.
  50. Ozias Albert E. (Aumsville OR), Reaction chambers for CVD systems.
  51. Grunes Howard (Santa Cruz CA) Tepman Avi (Cupertino CA) Lowrance Robert (Los Gatos CA), Robot assembly.
  52. Stevens Craig L. (Felton CA), Self-calibration system for robot mechanisms.
  53. Hiroki Tsutomu,JPX, Semiconductor processing apparatus.
  54. Wu Hong-Jen,TWX ; Chen Taylor,TWX ; Lai Jack,TWX ; Chen I. I.,TWX, Single semiconductor wafer transfer method and manufacturing system.
  55. Deligi Mario (Newton NJ) Derbinsky Senia (River Edge NY), Spiral magnetic linear translating mechanism.
  56. Hughes John L. (Rodeo CA) Lawson Eric C. (Sunnyvale CA), Substrate handling and processing system.
  57. Hughes John L. (Rodeo CA) Lawson Eric C. (Sunnyvale CA), Substrate handling and processing system.
  58. Matsumura Yoshio (Hikone JPX) Shimaji Katsumi (Hikone JPX), Substrate processing apparatus.
  59. Matsumura Yoshio,JPX, Substrate processing device and method for substrate from the substrate processing device.
  60. Harada Junji (Kumamoto JPX) Harada Ichiro (Kumamoto JPX) Nakamura Koji (Kumamoto JPX), Substrate processing method and substrate processing apparatus.
  61. White, John M.; Turner, Norman L.; Tiner, Robin L.; Keller, Ernst; Kurita, Shinichi; Blonigan, Wendell T.; Berkstresser, David E., Substrate transfer shuttle.
  62. Blonigan Wendell T. ; White John M., Substrate transfer shuttle having a magnetic drive.
  63. Ueyama Tsutomu (Kyoto JPX) Adachi Hideki (Kyoto JPX) Matsumura Yoshio (Hikone JPX) Tanaka Yasuhide (Kyoto JPX), Subtrate processing apparatus and device for and method of exchanging substrate in substrate processing apparatus.
  64. Moslehi Mehrdad M. (Palo Alto CA) Saraswat Krishna C. (Santa Clara County CA), Thermal/microwave remote plasma multiprocessing reactor and method of use.
  65. Kroeker Tony R., Three chamber load lock apparatus.
  66. Peyraud Dominique (Bienne CHX) Voumard Martial (Bienne CHX), Transfer machine for sealing electronic or like components under vacuum.
  67. Norman Arthur E. (Northridge CA), Transport system for inline vacuum processing.
  68. Babinski John Paul (Essex Junction VT) Bertelsen Bruce Irving (Essex Junction VT) Raacke Karl Heinz (Essex Junction VT) Sirgo Valdeko Harry (Colchester VT) Townsend Clarence Jay (Essex Junction VT), Transport system for semiconductor wafer multiprocessing station system.
  69. Lowrance Robert B. (Los Gatos CA), Two-axis magnetically coupled robot.
  70. Lowrance Robert B. (Los Gatos CA), Two-axis magnetically coupled robot.
  71. Lowrance Robert B. (Los Gatos CA), Two-axis magnetically coupled robot.
  72. Maydan Dan ; Somekh Sasson ; Sinha Ashok ; Fairbairn Kevin ; Lane Christopher ; Colborne Kelly ; Ponnekanti Hari K. ; Taylor W. N.(Nick), Ultra high throughput wafer vacuum processing system.
  73. Kato Susumu (Isawa-Cho JPX) Yamaguchi Hirofumi (Sudama-Cho JPX), Vacuum process apparaus.
  74. Katagiri Yoshitaka (Yokohama JPX), Vacuum processing apparatus and transportation system thereof.
  75. Katagiri Yoshitaka (Yokohama JPX), Vacuum processing apparatus and transportation system thereof.
  76. Turner Norman L. (Mountain View CA) White John M. (Hayward CA), Vacuum processing apparatus having improved throughput.
  77. Garrett, Charles B., Wafer lifting and holding apparatus.
  78. Hertel Richard J. (Bradford MA) MacIntosh Edward D. (Gloucester MA), Wafer transfer system.
  79. Miller Kenneth C. (280 Easy St. ; #117 Mountain View CA 94043), Wafer transport device.
  80. Inaba Hajimu (Hino JPX) Torii Nobutoshi (Hachioji JPX), Workpiece feeder.
  81. Dorenbos Frederick William (El Cerrito CA), Workpiece handling system for vacuum processing.

이 특허를 인용한 특허 (16)

  1. Blonigan, Wendell Thomas; Toshima, Masato; Law, Kam S.; Berkstresser, David Eric; Kleinke, Steve; Stevens, Craig Lyle, Auto-sequencing inline processing apparatus.
  2. Blonigan, Wendell Thomas; Toshima, Masato; Law, Kam S.; Berkstresser, David Eric; Kleinke, Steve; Stevens, Craig Lyle, Auto-sequencing multi-directional inline processing apparatus.
  3. Blonigan, Wendell Thomas; Toshima, Masato; Law, Kam S.; Berkstresser, David Eric; Kleinke, Steve; Stevens, Craig Lyle, Auto-sequencing multi-directional inline processing method.
  4. Tuffs, Monte R.; Koff, Garry A.; Redmann, Jr., Jerry L., Automatic load transfer device and method for automated material handling systems.
  5. Stevens, Craig Lyle; Berkstresser, David Eric; Blonigan, Wendell Thomas, Broken wafer recovery system.
  6. Inagawa, Makoto; Kurita, Shinichi, Heater plate and heater element assembly.
  7. Inagawa, Makoto; Kurita, Shinichi, Heater plate and heater element assembly.
  8. Fukuoka, Tetsuo; Akimoto, Masami; Kitano, Takahiro; Kimura, Yoshio; Hayashi, Shinichi; Ito, Hikaru, Heating apparatus, and coating and developing apparatus.
  9. Tanaka,Shuji; Kobayashi,Yoshitake; Fujimura,Hisashi; Aoki,Yasutsugu, Intermediate product carrying apparatus, and intermediate product carrying method.
  10. Uchimaki, Yoichi; Egawa, Yuko; Kaji, Tetsunori, Method and apparatus for transferring substrate.
  11. Bachrach, Robert Z., Method of achieving high productivity fault tolerant photovoltaic factory with batch array transfer robots.
  12. Bachrach,Robert Z., Method of achieving high productivity fault tolerant photovoltaic factory with batch array transfer robots.
  13. Toshima, Masato; Can, Linh, Processing apparatus and processing method.
  14. Kim, Kyung-Tae, Shadow frame.
  15. Blonigan,Wendell T.; White,John M., Substrate conveyor system.
  16. Yao, Jiangbo; Lee, Chunliang, Substrate storage rack.
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