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특허 상세정보

MyON담기
내보내기 페이스북 공유 카카오톡 공유

Method of manufacturing a molded heating element assembly

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H01C-017/02    H01C-017/28    H05B-003/00   
미국특허분류(USC) 029/613; 029/611; 029/619; 029/621; 219/438
출원번호 US-0080047 (2002-02-21)
발명자 / 주소
출원인 / 주소
대리인 / 주소
    Morris LLP, Duane
인용정보 피인용 횟수 : 21  인용 특허 : 187
초록
▼

A heated element assembly and method of manufacturing heated element assemblies is provided. The heated element assembly including a first and second molded sections shaped to mate with each other is provided. A resistance heating element is secured between the first and second molded sections by an interference fit. The resistance heating element includes a piercable supporting substrate and a resistance wire sewn thereon. The resistance wire is disposed in a predetermined circuit path which is substantially encompassed by the first and second molded se...

대표
청구항
▼

1. A method of manufacturing a heated element assembly, comprising the steps of: (a) providing a first molded polymeric section; (b) providing a second molded polymeric section shaped to mate with said first molded section; (c) providing a resistance heating element, comprising: (i) a first heat resistant supporting substrate having a first surface thereon;(ii) an electrical resistance heating material sewn with a thread to said first heat resistant supporting substrate, said electrical resistance heating material forming a predetermined circuit...

이 특허에 인용된 특허 (187)

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