초록

A cooling system for a processor-based system may include a housing that contains a heat exchanger, a tank, and an internal pump that pumps fluid through the heat exchanger and through a cooling plate coupled thermally to a processor to be cooled.

대표청구항 ▼

1. A method comprising: providing a housing with an opening; mounting a heat exchanger in housing, said heat exchanger comprising a core defined in part by opposed faces separated a given amount in a thickness direction; mounting a fan in said opening; providing a liquid coolant tank within

1. A method comprising: providing a housing with an opening; mounting a heat exchanger in housing, said heat exchanger comprising a core defined in part by opposed faces separated a given amount in a thickness direction; mounting a fan in said opening; providing a liquid coolant tank within said housing; providing a pump within said tank within said housing; providing a cooling plate and tubing to couple said pump to said cooling plate; and causing air flow from said fan across said heat exchanger in said thickness direction. 2. The method of claim 1 including attaching a fan to said housing.3. The method of claim 2 including attaching said fan over an opening in said housing.4. The method of claim 1 including coupling said cooling plate to a processor.5. The method of claim 1 including providing said heat exchanger with a shorter and a longer dimension.6. The method of claim 5, wherein causing air to flow from said fan through said heat exchanger including causing air to flow from said fan through said heat exchanger in the shorter dimension of said heat exchanger.7. A cooling system for a processor-based system comprising: a housing with an opening; a reservoir for cooling liquid in said housing; a heat exchanger in said housing, said heat exchanger comprising a core defined in part by opposed faces separated a given amount in a thickness direction; a pump in said reservoir to pump liquid through said heat exchanger; a cooling plate coupled to said pump to receive said liquid; and a fan secured in said opening in said housing over said heat exchanger to cause air flow from said fan across said heat exchanger in said thickness direction. 8. The system of claim 7 including an opening in said housing over said heat exchanger.9. The system of claim 8 wherein said fan secured to said housing to flow air over said heat exchanger.10. The system of claim 7, wherein said heat exchanger having a shorter and a longer dimension.11. The system of claim 10, wherein said fan is disposed across said heat exchanger for air to flow from said fan through said heat exchanger in the shorter dimension of said heat exchanger.12. A processor-based system comprising: a processor; an interface coupled to said processor; and a cooling system coupled to said interface to control the temperature of said processor, said cooling system including a housing with an opening, a reservoir for cooling liquid in said housing, a heat exchanger in said housing, said heat exchanger comprising a core defined in part by opposed faces separated a given amount in a thickness direction, a pump in said reservoir to pump liquid through said heat exchanger, a cooling plate coupled to said pump, and a fan secured in said opening in said housing over said heat exchanger to cause air flow from said fan across said heat exchanger in said thickness direction. 13. The system of claim 12 including an opening in said housing over said heat exchanger.14. The system of claim 13 including a fan secured to said housing to flow air over said heat exchanger.15. The system of claim 12 including a bus coupled to said interface.16. The system of claim 12, wherein said heat exchanger having a shorter and a longer dimension.17. The system of claim 16, wherein said fan is disposed across said heat exchanger for air to flow from said fan through said heat exchanger in the short dimension of said heat exchanger.