초록 ▼

An imaging system includes an image sensor that is attached to a circuit board via a mass reflow process. The image sensor captures image data and provides the image data at an output of the imaging system. In one embodiment, the image sensor uses a color filter array (CFA) material that is substant

An imaging system includes an image sensor that is attached to a circuit board via a mass reflow process. The image sensor captures image data and provides the image data at an output of the imaging system. In one embodiment, the image sensor uses a color filter array (CFA) material that is substantially stable through the mass reflow process.

대표청구항 ▼

1. A method of attaching an image sensor to a circuit board, the method comprising:applying a color filter array (CFA) material to a die;bonding the die to a package;attaching the package to a circuit board via a mass reflow process. 2. The method of claim 1, wherein the applying comprises:applying

1. A method of attaching an image sensor to a circuit board, the method comprising:applying a color filter array (CFA) material to a die;bonding the die to a package;attaching the package to a circuit board via a mass reflow process. 2. The method of claim 1, wherein the applying comprises:applying a pigmented CFA material to the die. 3. The method of claim 1, wherein the attaching comprises:heating the package to over 200 degrees C. 4. The method of claim 1, wherein the attaching comprises:heating the package to approximately 215 degrees C. 5. The method of claim 1 further comprising:baking the package for an extended time prior to the attaching. 6. The method of claim 5, wherein the baking is performed at over 125 degrees C. for over 24 hours. 7. The method of claim 6, where in the baking allows the package to meet IPC level 4 surface mount requirements.