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Method of forming socket contacts

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01R-043/00
출원번호 US-0652923 (2000-08-31)
발명자 / 주소
  • Farnworth, Warren M.
출원인 / 주소
  • Micron Technology, Inc.
대리인 / 주소
    TraskBritt
인용정보 피인용 횟수 : 5  인용 특허 : 39

초록

In a socket used to house semiconductor die during testing, a recessed socket contact and methods of making the same are provided that would avoid pinching the die's contacts. Semiconductor fabrication techniques are used to construct a dense array of contacts by forming a plurality of interconnecte

대표청구항

1. A method of forming socket contacts, comprising:forming a plurality of interconnected silicon electric contacts which are connected to a portion of structural material, said plurality of interconnected silicon electric contacts being structurally interconnected by said portion of structural mater

이 특허에 인용된 특허 (39)

  1. Grabbe Dimitry G. (Middletown PA), Area array connector.
  2. Grabbe Dimitry (2160 Rosedale Ave. Middletown PA 17057), Ball grid array socket.
  3. Seidler Jack (Flushing NY), Compliant connector.
  4. Affolter Hugo,CHX ; Haffter Christoph,CHX, Connection base.
  5. Chang Pierce,TWX, Connector with high-densely arranged terminals for connecting to working element and printed circuit board through LGA type connection.
  6. Scholz James P. (New Cumberland PA), Contact for stackable electrical connector.
  7. Masami Fukunaga (Kawaguchi JPX), Contact pin device for IC sockets.
  8. Kazama Toshio,JPX, Electric contact unit.
  9. David R. Hembree, Electrical connector.
  10. Honn ; James J. ; Stuby ; Kenneth P., Electrical package for LSI devices and assembly process therefor.
  11. Foley William F. (New Cumberland PA) Griffith Gregory G. (Carlisle PA) Gutter David H. (Elizabethtown PA) McClusky William E. (Harrisburg PA) Robbins Steve (Greensburg PA) Shoemaker Bruce W. (Dillsbu, Electrical terminal with compliant pin section.
  12. Distefano Thomas H. ; Fjelstad Joseph, Flexible contact post and post socket and associated methods therefor.
  13. Sato Kazumasa (Yokohama JPX) Kokubu Akihiko (Yokohama JPX), IC socket.
  14. Farnworth Warren M. ; Gochnour Derek ; Akram Salman, Interconnect having recessed contact members with penetrating blades for testing semiconductor dice and packages with co.
  15. Werther William E. (Glen Cove NY), Interconnection package suitable for electronic devices and methods for producing same.
  16. Fredrickson Toby Alan, Interface structure for an integrated circuit device tester.
  17. Johnson Timothy L. ; Knapp James H. ; Laninga Albert J., Material transfer apparatus and method of using the same.
  18. Akram Salman ; Farnworth Warren M. ; Wood Alan G., Method for fabricating a semiconductor interconnect with laser machined electrical paths through substrate.
  19. Frank Steven N. ; Belcher James F. ; Stanford Charles E. ; Owen Robert A. ; Kyle Robert J. S., Method for forming electrical contact to the optical coating of an infrared detector.
  20. Tseng Horng-Huei,TWX, Method for making planar metal interconnections and metal plugs on semiconductor substrates.
  21. Cheng Hing-Liang (Taipei TWX), Method for manufacturing a circuit board with a plurality of conductive terminal pins.
  22. Knodler Dieter,DEX, Method for manufacturing electrically conductive lead-throughs in metallized plastic housings.
  23. Solomon Allen L. (Fullerton CA), Method of forming an integrated circuit module.
  24. Atkins Glen G. ; Cohen Michael S. ; Mauritz Karl H. ; Shaffer James M., Method of forming electrically conductive pillars.
  25. Guran Orest D. ; Wood Donald E. ; Middlehurst Richard J., Method of manufacturing an array of surface mount contacts.
  26. Roberts Joseph A., Method of manufacturing printed circuits.
  27. Otto James C. (Indian Harbour Beach FL) Jones Herman A. (Melbourne FL), Multilayer circuit prototyping board.
  28. Brown Candice H. (San Jose CA), Process of making a semiconductor device having parallel leads directly connected perpendicular to integrated circuit la.
  29. Butler Douglas (Colorado Springs CO), Sealed self aligned contacts using two nitrides process.
  30. McKenzie ; Jr. Joseph A. (6330 Laura La. Pleasanton CA 94566), Self-masking socket pin carrier for printed circuit boards.
  31. Hirano Hirokazu (Oomiya JPX) Yamaki Bunshiro (Fujisawa JPX), Semiconductor sensor including an aperture having a funnel shaped section intersecting a second section.
  32. Noble Wendell P., Silicon-on-insulator islands.
  33. Mosquera Rene A. (Laguna Niquel CA), Socket contact for mounting in a hole of a device.
  34. Matsumura Shigeru,JPX, Socket for measuring a ball grid array semiconductor.
  35. Jones Robert E. (Saint Peters MO), Surface mounted component adaptor for interconnecting of surface mounted circuit components.
  36. Martucci Roberto (Montegrotto T. Padova ITX) Zuin Gianni (Mestrino-Padova ITX), Terminal socket assembly.
  37. Hembree David R., Test carrier for packaging semiconductor components having contact balls and calibration carrier for calibrating semiconductor test systems.
  38. Swart Mark A. ; Johnston Charles J. ; Vinther Gordon A. ; Sargeant Steve B., Test socket.
  39. Sinclair William Y., Universal production ball grid array socket.

이 특허를 인용한 특허 (5)

  1. Podpora, Zenon A., Interchangeable multi-form factor module socket.
  2. Matsunaga,Noriaki; Shibata,Hideki; Hayasaka,Nobuo, Method for fabricating a probe pin for testing electrical characteristics of an apparatus.
  3. Farnworth,Warren M., Method of forming socket contacts.
  4. Marion, Francois; Saint-Patrice, Damien, Method of making a connection component with hollow inserts.
  5. Caldwell,John L.; Tverdy,Mark A.; Slaughter,Michael R., Test sockets, test systems, and methods for testing microfeature devices.
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