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특허 상세정보

Hermetically sealed micro-device package with window

국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) H05K-005/06   
미국특허분류(USC) 174/052.3; 174/052.4; 257/680; 257/704; 029/592.1
출원번호 US-0630291 (2003-07-30)
발명자 / 주소
대리인 / 주소
    Howson & Arnott, L.L.P.
인용정보 피인용 횟수 : 15  인용 특허 : 13
초록

A method for manufacturing a cover assembly including a transparent window portion and a frame of gas-impervious material that can be hermetically attached to a micro-device package base to form a hermetically sealed micro-device package. First, a frame of gas-impervious material is provided, the frame having a continuous sidewall defining a frame aperture there through. The sidewall includes a frame seal-ring area circumscribing the frame aperture. A sheet of a transparent material is also provided, the sheet having a window portion defined thereupon. T...

대표
청구항

1. A method for manufacturing a cover assembly that can be hermetically attached to a micro-device package base to form a hermetically sealed micro-device package, the cover assembly including a transparent window portion and a frame, the method comprising the following steps:providing a frame of gas-impervious material having a continuous sidewall defining a frame aperture therethrough, the sidewall including a frame seal-ring area circumscribing the frame aperture;providing a sheet of a transparent material having a window portion defined thereupon, th...

이 특허에 인용된 특허 (13)

  1. Tatoh Nobuyoshi,JPX. Air-tightly sealed container for photosemiconductor, and photosemiconductor module. USP1999085945721.
  2. Kock Hendrikus G. (Eindhoven NLX). Coupler comprising a light source and lens. USP1982104355323.
  3. Alkhimov Anatoly P. (ulitsa Vyazemskogo 2 ; kv. 72 Novosibirsk SUX) Papyrin Anatoly N. (ulitsa Vyazemskogo 2 ; kv. 72 Novosibirsk SUX) Kosarev Vladimir F. (Novosibirsk SUX) Nesterovich Nikolai I. (No. Gas-dynamic spraying method for applying a coating. USP1994045302414.
  4. Stark, David H.. Hermetically sealed micro-device package with window. USP2003096627814.
  5. Van Steenkiste Thomas H. ; Smith John R. ; Teets Richard E. ; Moleski Jerome J. ; Gorkiewicz Daniel W.. Kinetic spray coating method and apparatus. USP2000106139913.
  6. Sengupta Kabul S. ; Sklenicka Carl E. ; Thompson Deborah L. ; Arellano Raul A. ; Nagai Naoyuki,JPX ; Takehashi Nobuyuki,JPX ; Nomoto Kouichiro,JPX. Mass reflowable windowed package. USP2001026191359.
  7. Yang Thomas (Hsin-Chu TWX). Method for manufacturing a hybrid circuit charge-coupled device image sensor. USP1995065423119.
  8. Glenn Thomas P.. Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device. USP1999095949655.
  9. Tower Steven A. ; Mravic Brian. Optical component package with a hermetic seal. USP2000026020628.
  10. Benavides, Gilbert L.; Galambos, Paul C.; Emerson, John A.; Peterson, Kenneth A.; Giunta, Rachel K.; Zamora, David Lee; Watson, Robert D.. Packaging of electro-microfluidic devices. USP2003046548895.
  11. Baret, Guy. Process for the manufacture of components on glass substrates that have to be sealed, such as flat display screens of the plasma-panel type. USP2003036537121.
  12. Yoneda Yoshiyuki (Kawasaki JPX) Tsuji Kazuto (Kawasaki JPX). Semiconductor device in a resin package housed in a frame having high thermal conductivity. USP1997045625222.
  13. Mehra Madhav (Rochester NY) Jackson Todd (Pittsford NY). Static control overlayers on opto-electronic devices. USP1992065118924.

이 특허를 인용한 특허 피인용횟수: 15

  1. Mott, Lawrence; Bettger, Kenneth; Brown, Elliot. Asymmetrical flexible edge seal for vacuum insulating glass. USP2012108283023.
  2. Kim, Yong Wook. Ceramic package sealing structure and ceramic package having said sealing structure. USP2005056888239.
  3. Hashi, Yukihiro. Electronic device, electronic apparatus, method of manufacturing base substrate, and method of manufacturing electronic device. USP2017049635769.
  4. Bettger, Kenneth J.; Stark, David H.. Filament-strung stand-off elements for maintaining pane separation in vacuum insulating glazing units. USP2013088512830.
  5. Bettger, Kenneth J.; Stark, David H.. Flexible edge seal for vacuum insulating glazing units. USP2012128329267.
  6. Tanaka, Tsuyoshi; Yamamoto, Masaharu. Hermetic sealing cap, electronic component accommodation package, and method for producing hermetic sealing cap. USP2010097790988.
  7. Stark,David H.. Hermetically sealed micro-device package with window. USP2007077238546.
  8. Myhre, Douglas C.; Michel, Joseph R.. High temperature seal assembly for optical sensor. USP2011087987712.
  9. Stark, David H. Insulated glazing units. USP2010117832177.
  10. Stark, David H.. Insulating glass unit having multi-height internal standoffs and visible decoration. USP2011087989040.
  11. Francis, IV, William H.; Freebury, Gregg E.; Beidleman, Neal J.; Hulse, Michael. Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unit. USP2016059328512.
  12. Kim,Yong Wook. Method of manufacturing ceramic package sealing structure and ceramic package having said sealing structure. USP2006026998002.
  13. Yamanouchi,Haruhiko. Moistureproof optical device. USP2007077244033.
  14. Miller, Seth A.; Stark, David H.; Francis, IV, William H.; Puligandla, Viswanadham; Boulos, Edward N.; Pernicka, John. Multi-pane glass unit having seal with adhesive and hermetic coating layer. USP2015028950162.
  15. Stark, David H.. Wafer-level hermetic micro-device packages. USP2009047517712.