초록 ▼

A heat dissipation apparatus has an elongated heat conduit (such as a heat pipe) in thermal communication with a heat spreader for thermally contacting a heat-generating device. The heat spreader has a phase-change mechanism to spread heat within the heat spreader. In one implementation, the phase-c

A heat dissipation apparatus has an elongated heat conduit (such as a heat pipe) in thermal communication with a heat spreader for thermally contacting a heat-generating device. The heat spreader has a phase-change mechanism to spread heat within the heat spreader. In one implementation, the phase-change mechanism includes paths for heated vapor flow and cooled liquid flow.

대표청구항 ▼

1. A system comprising:a device that generates heat during operation the device having a surface;a heat spreader thermally contacted to the surface, the heat spreader having a phase-change mechanism adapted to spread heat; anda heat conduit in thermal communication with the heat spreader to transfer

1. A system comprising:a device that generates heat during operation the device having a surface;a heat spreader thermally contacted to the surface, the heat spreader having a phase-change mechanism adapted to spread heat; anda heat conduit in thermal communication with the heat spreader to transfer heat from the heat spreader to another location in the system,wherein the heat spreader has a first housing, and the heat conduit has a second housing, each of the first and second housings defining an inner space in the corresponding heat spreader or heat conduit,the housings being connected to provide fluid communication between the inner spaces of the heat spreader and heat conduit,wherein the heat spreader has a first wick structure with fluid flow paths for liquid flow, and the heat conduit has a second wick structure with fluid flow paths for liquid flow,wherein the first and second wick structures are connected so that the fluid flow paths of the first wick structure are in communication with the fluid flow paths of the second wick structure. 2. The system of claim 1, wherein the heat conduit is adapted to transfer heat using a phase-change mechanism. 3. The system of claim 2, wherein the heat conduit comprises a heat pipe. 4. The system of claim 2, wherein the phase-change mechanism of the heat spreader is adapted to transfer heated vapor and cooled liquid within the heat spreader. 5. The system of claim 4, wherein the phase-change mechanism of the heat conduit is adapted to transfer heated vapor and cooled liquid within the heat conduit. 6. The system of claim 5, wherein the heat spreader and heat conduit are in fluid communication with each other to enable heated vapor to flow from the heat spreader into the heat conduit and to enable cooled liquid to flow from the heat conduit back into the heat spreader. 7. The system of claim 6, wherein the heat conduit includes a vapor flow channel. 8. The system of claim 7, wherein the heat spreader includes a vapor chamber. 9. The system of claim 1, wherein an outer surface of the heat conduit is thermally contacted to an outer surface of the heat spreader. 10. The system of claim 1, further comprising a chassis containing the device, heat spreader, and heat conduit. 11. The system of claim 10, further comprising an airflow generator. 12. The system of claim 1, further comprising:a second device that generates heat during operation;a second heat spreader thermally contacted to the second device, the second heat spreader having a phase-change mechanism adapted to spread heat; anda second heat conduit in thermal communication with the second heat spreader to transfer heat from the second heat spreader to another location in the system,wherein the second heat spreader has a third wick structure, and the second heat conduit has a fourth wick structure, the third wick structure connected to the fourth wick structure to enable fluid communication between the third and fourth wick structures. 13. A heat dissipation apparatus, comprising:a heat pipe having a first housing and a vapor flow channel; anda heat spreader structured to be thermally contacted to a heat-generating device,the heat spreader having a second housing and a chamber,the first and second housings being connected so that the chamber of the heat spreader is in fluid communication with the vapor flow channel of the heat pine,wherein the heat pipe has a first wick structure with a liquid flow path, and the heat spreader has a second wick structure with a liquid flow path,the first and second wick structures being connected so that the liquid flow paths are in fluid communication. 14. The apparatus of claim 13, wherein the vapor flow channel of the heat pipe is adapted to receive heated vapor flow from the chamber of the heat spreader. 15. The apparatus of claim 14, wherein the second wick structure of the heat spreader is adapted to receive liquid flow from the first wick structure of the heat pipe to return cooled liquid to the heat spreader. 16. The apparatus of claim 13, wherein the heat pipe has a first end portion and a second end portion, the first end portion proximate the heat spreader,the apparatus further including a heat sink,wherein the second end portion of the heat pipe is proximate the heat sink. 17. The apparatus of claim 16, further comprising an airflow generator to direct air flow to the heat sink. 18. A heat dissipation apparatus, comprising:a heat sink;an elongated heat conduit having a first end portion and a second end portion, the second end portion proximate and in thermal contact with the heat sink; anda heat spreader adapted to thermally contact a heat-generating device,the first end portion of the elongated heat conduit proximate and in thermal contact with the heat spreader,wherein the heat spreader has a vapor chamber to receive heated vapor flow,wherein the heat spreader has a first wick structure, and the elongated heat conduit has a second wick structure, the first wick structure connected to the second wick structure to enable liquid communication between the first and second wick structures. 19. The apparatus of claim 18, wherein the elongated heat conduit has a vapor flow channel,the vapor flow channel adapted to be in fluid communication with the vapor chamber of the heat spreader. 20. The apparatus of claim 18, wherein the elongated heat conduit comprises a heat pipe. 21. The heat dissipation apparatus of claim 13, further comprising:a second heat pipe having a vapor flow channel; anda second heat spreader structured to be thermally contacted to a second heat-generating device,the second heat spreader having a second chamber,the second heat spreader and the second heat pipe being connected so that the second chamber of the second heat spreader is in fluid communication with the vapor flow channel of the second heat pipe,wherein the second heat pipe has a third wick structure with a liquid flow path, and the second heat spreader has a fourth wick structure with a liquid flow path,the third and fourth wick structures being connected so that the liquid flow paths of the third and fourth wick structures are in fluid communication.