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Spiral copper tube and aluminum fin thermosyphon heat exchanger 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-013/12
출원번호 US-0866370 (2001-05-25)
발명자 / 주소
  • DiPaolo, Frank E.
출원인 / 주소
  • Liebert Corporation
대리인 / 주소
    Howrey Simon Arnold & White LLP
인용정보 피인용 횟수 : 29  인용 특허 : 20

초록

The present invention is directed to a thermosyphon heat exchanger. The thermosyphon system eliminates the need for costly and inefficient moving parts in the cooling system. The system also minimizes failures rendering the system inoperable by eliminating mechanical components subject to breakdowns

대표청구항

1. A thermosyphon using a working fluid therein, comprising:a) an evaporator having a front face, a back face, a top and a bottom, the evaporator comprising a plurality of cooling fins and at least one working fluid flow path having an inlet adjacent the bottom and an outlet adjacent the top, the at

이 특허에 인용된 특허 (20)

  1. Bull George B. (Grenada MS) Carpenter James E. (Grenada MS), A-coil heat exchanger.
  2. Furukawa Masahiro,JPX ; Iramina Kazuyasu,JPX ; Takahashi Hiroyuki,JPX ; Saeki Chikara,JPX, Absorption chiller and heat exchanger tube used the same.
  3. Okazaki Takashi,JPX ; Sumida Yoshihiro,JPX ; Matsushita Akihiro,JPX ; Akiyama Itsutarou,JPX ; Shida Yasunori,JPX ; Fukushima Akio,JPX, Air conditioner.
  4. Flores Aaron G. (Sugar Land TX), Apparatus and method for actively cooling instrumentation in a high temperature environment.
  5. Yoshiyuki Okamoto JP, Boiling cooling system that exchanges heat between higher-temperature fluid and lower-temperature fluid.
  6. Terao Tadayoshi,JPX ; Kobayashi Kazuo,JPX ; Tanaka Hiroshi,JPX ; Kawaguchi Kiyoshi,JPX, Cooling apparatus for high-temperature medium by boiling and condensing refrigerant.
  7. Kadota Shigeru,JPX ; Furukawa Takashi,JPX ; Kawaguchi Kiyoshi,JPX ; Suzuki Masahiko,JPX ; Yamada Kenji,JPX, Cooling apparatus using boiling and condensing refrigerant.
  8. Kadota Shigeru,JPX ; Kawaguchi Kiyoshi,JPX ; Takeuti Tetsuya,JPX ; Kobayashi Kazuo,JPX ; Ohara Takahide,JPX ; Suzuki Masahiko,JPX ; Sugito Hajime,JPX ; Semura Junichi,JPX, Cooling apparatus using boiling and condensing refrigerant.
  9. Hiroyuki Osakabe JP; Yoshiyuki Okamoto JP; Kiyoshi Kawaguchi JP, Cooling device boiling and condensing refrigerant.
  10. Suzuki Yukinori,JPX ; Takeuchi Tetsuya,JPX ; Kishita Kouji,JPX, Cooling system for cooling hot object in container.
  11. Suzuki Masahiko,JPX ; Kawaguchi Kiyoshi,JPX ; Kadota Shigeru,JPX, Easily manufactured cooling apparatus using boiling and condensing refrigerant and method of manufacturing the same.
  12. Chu Richard C. ; Chrysler Gregory M., Evaporator for use in an extended air cooling system for electronic components.
  13. Chu Richard C. ; Chrysler Gregory M., Extended air cooling with heat loop for dense or compact configurations of electronic components.
  14. Mauterer David (Atlanta GA), Heat exchanger.
  15. Oplatka Georg (Zurich CH), Heat exchanger for two vapor media.
  16. Salyer Ival O., Heat storage system utilizing phase change materials government rights.
  17. Mei Viung C. (Oak Ridge TN) Chen Fang C. (Knoxville TN), Liquid over-feeding refrigeration system and method with integrated accumulator-expander-heat exchanger.
  18. Baba Norimasa (Nagoya JPX) Yamamoto Michiyasu (Chiryu JPX), Refrigerant condenser with integral receiver.
  19. Niggemann Richard E. (Rockford IL), Spiral heat exchanger.
  20. Grunes Howard E. (Santa Cruz CA) Morrison Dennis J. (Santa Cruz CA), Two-phase thermosyphon heater.

이 특허를 인용한 특허 (29)

  1. Doll, Wade J.; Kelley, Douglas P., Air conditioning systems for computer systems and associated methods.
  2. VanGilder, James William; Healey, Christopher M.; Zhang, Xuanhang, Analysis of effect of transient events on temperature in a data center.
  3. Rockenfeller,Uwe, Apparatus and method for cooling electronics and computer components with managed and prioritized directional air flow heat rejection.
  4. Doll, Wade J., Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use.
  5. Doll, Wade J., Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use.
  6. Kadota, Shigeru; Nishizawa, Kazutoshi; Takeuchi, Tetsuya; Ito, Akira; Nakamura, Satoru, Cooling device and method of manufacturing the same.
  7. Rasmussen, Neil; Bean, John H.; Uhrhan, Greg R.; Buell, Scott D., Cooling system and method.
  8. Rasmussen, Neil; Bean, Jr., John H.; Uhrhan, Greg R.; Buell, Scott D., Cooling system and method.
  9. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  10. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  11. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  12. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  13. Bilski, W. John, Electronics cabinet and rack cooling system and method.
  14. Wexler, Peter, In-row air containment and cooling system and method.
  15. Tutunoglu, Ozan, Method and apparatus for cooling.
  16. Tutunoglu, Ozan; Bean, Jr., John H., Method and apparatus for cooling.
  17. Tutunoglu, Ozan; Lingrey, David James, Method and apparatus for cooling.
  18. Spearing, Ian, Method and apparatus for equalizing a pumped refrigerant system.
  19. Tutunoglu, Ozan; Bean, Jr., John H., Method of operating a cooling system having one or more cooling units.
  20. Cook, Jason; Gossard, Tim; Custer, James K., Modular frequency based fiber transport and radio transport repeater platform for diverse radio frequency configurable deployments.
  21. Bean, Jr., John H., Modular ice storage for uninterruptible chilled water.
  22. Bean, Jr., John H., Modular ice storage for uninterruptible chilled water.
  23. Doll, Wade J., Multi-stage air movers for cooling computer systems and for other uses.
  24. Frank,Michael; van Hasselt,Peter, Refrigeration plant for parts of installation, which are to be chilled.
  25. Shrivastava, Saurabh K.; VanGilder, James W., System and method for arranging equipment in a data center.
  26. VanGilder, James William, System and method for prediction of temperature values in an electronics system.
  27. Healey, Christopher M.; Zhang, Xuanhang, System and method for sequential placement of cooling resources within data center layouts.
  28. Kelley, Douglas P.; Doll, Wade J.; Yatskov, Alexander I., Systems and associated methods for controllably cooling computer components.
  29. Kelley, Douglas P.; Doll, Wade J.; Yatskov, Alexander I., Systems and associated methods for controllably cooling computer components.
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