초록 ▼

The present invention provides a method of producing a spacer provided between a first substrate and a second substrate on which an electron emitting device is arranged, the method including the step of forming a film on at least a portion of at least one surface of the spacer. The film forming step

The present invention provides a method of producing a spacer provided between a first substrate and a second substrate on which an electron emitting device is arranged, the method including the step of forming a film on at least a portion of at least one surface of the spacer. The film forming step includes the step of preparing a bundle of a plurality of spacer base members, and the step of coating a film material on the bundle, and wherein the bundle on which the film material is coated has a mask layer for covering at least a film non-formation portion near the film formation portion of each of the plurality of spacer base members of the bundle.

대표청구항 ▼

1. A method of producing a spacer provided between a first substrate and a second substrate on which an electron emitting device is arranged, the method comprising:a step of forming a film on at least a portion of at least one surface of the spacer;wherein the step of forming the film comprises a st

1. A method of producing a spacer provided between a first substrate and a second substrate on which an electron emitting device is arranged, the method comprising:a step of forming a film on at least a portion of at least one surface of the spacer;wherein the step of forming the film comprises a step of preparing a bundle of a plurality of spacer base members, and a step of providing a film material on the bundle, andwherein the bundle on which the film material is provided has a mask for covering at least a film non-formation portion near a film formation portion of each of the plurality of spacer base members of the bundle. 2. A method of producing a spacer according to claim 1, wherein the mask is provided on a surface of the spacer base member, wherein the surface of the spacer base member will be supposed to face a surface of an adjacent spacer base member when the plurality of the spacer base members are bundled. 3. A method of producing a spacer according to claim 1, wherein the film formation portion is located in a contact surface of the spacer in contact with the first substrate or a contact member provided nearer to the first substrate than the spacer, or in contact with the second substrate or a contact member provided nearer to the second substrate than the spacer. 4. A method of producing a spacer according to claim 1, wherein the film is a low-resistance film. 5. A method of producing a spacer according to claim 1, wherein the film has a sheet resistance value of 1×10 7 Ω/□ or less. 6. A method of producing a spacer according to claim 1, further comprising the step of removing the mask after the step of providing the film material. 7. A method of producing a spacer according to claim 1, further comprising a step of forming the mask on at least one spacer base member before the step of providing the film material. 8. A method of producing a spacer according to claim 1, further comprising a step of removing the mask formed in the film formation portion before the step of providing the film material, wherein the mask is formed on the film formation portion of the spacer base member before the step of removing the mask. 9. A method of producing a spacer according to claim 8, wherein the step of removing the mask before the step of providing the film material is performed for each of the plurality of the spacer base members before bundling. 10. A method of producing a spacer according to claim 1, wherein the step of removing the mask before the step of providing the film material is performed after the step of preparing a bundle of a plurality of spacer base members. 11. A method of producing a spacer according to claim 1, further comprising a step of removing the mask formed in the film formation portion before the step of providing the film material, wherein the step of removing the mask before the step of providing the film material is performed by physical removal. 12. A method of producing a spacer according to claim 11, wherein the step of removing the mask before the step of providing the film material is performed by filing or blasting. 13. A method of producing a spacer according to claim 1, wherein the step of preparing the bundle is performed so that film formation portions of the plurality of the spacer base members of the bundle are positioned in substantially the same plane. 14. A method of producing a spacer according to claim 1, further comprising a step of heating the film material provided in the providing. 15. A method of producing a spacer according to claim 1, wherein the film material is provided in a liquid state. 16. A method of producing a spacer according to claim 15, wherein the film material is provided by a dipping process. 17. A method of producing a spacer according to claim 1, wherein at least one spacer base member has an uneven surface. 18. A method of producing a spacer according to claim 1, wherein at least one spacer base member has a columnar structure. 19. A method of manufacturing an image forming apparatus comprising a first substrate on which an image forming member for forming an image by electron irradiation is provided, a second substrate on which an electron emitting device is provided, and a spacer provided between the first and second substrates;wherein the spacer is produced by a method of producing a spacer according to claim 1. 20. A method of producing a spacer according to claim 1, wherein the mask is a mask layer.