초록 ▼

The present invention is directed to a process for forming a dual damascene structure and a capacitor. The process includes forming a stack including insulating layers and a stop layer. The stack is patterned so that the openings used to form the sidewall capacitors may be formed when the vias or gr

The present invention is directed to a process for forming a dual damascene structure and a capacitor. The process includes forming a stack including insulating layers and a stop layer. The stack is patterned so that the openings used to form the sidewall capacitors may be formed when the vias or grooves of the dual damascene structure is formed. In this way, the process for manufacturing the sidewall capacitors may be integrated with the dual damascene process without adding additional mask or etching steps.

대표청구항 ▼

1. A method for manufacturing an integrated circuit comprising:forming a layer having a stop layer,forming an opening for a dual damascene structure in the layer that includes at least a groove and a via where the via extends through the stop layer; andforming at least two openings in the layer for

1. A method for manufacturing an integrated circuit comprising:forming a layer having a stop layer,forming an opening for a dual damascene structure in the layer that includes at least a groove and a via where the via extends through the stop layer; andforming at least two openings in the layer for a capacitor having a first electrode and a second electrode, wherein the first and second electrodes are each defined by an opening that extends through the stop layer and the layer. 2. The method of claim 1 wherein forming an opening for a dual damascene structure and forming at least two openings in the layer for a capacitor occur at substantially the same time. 3. The method of claim 1 further comprising:filling the opening for a dual damascene structure with a conductive material; andfilling the at least two openings in the layer for a capacitor with a conductive material. 4. The method of claim 3 wherein filling the opening for a dual damascene structure and filling the at least two openings in the layer for a capacitor occur at substantially the same time. 5. The method of claim 1 wherein the layer comprises a plurality of layers. 6. A method of manufacturing an integrated circuit comprising:forming a plurality of layers;partially forming a dual damascene structure by forming a first opening in a least one of the plurality of layers; andpartially forming a capacitor by forming second and third openings in the at least one of the plurality of layers, wherein the second and third openings extend through the at least one of the plurality of layers. 7. The method of claim 6 wherein the first, second, and third openings have substantially the same width. 8. The method of claim 6 the second and third openings have a first width and the first opening has a second width different from the first width.