Two-stage transfer molding method to encapsulate MMC module
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-021/44
H01L-021/48
H01L-021/50
출원번호
US-0213029
(2002-08-05)
발명자
/ 주소
Bolken, Todd O.
출원인 / 주소
Micron Technology, Inc.
대리인 / 주소
TraskBritt
인용정보
피인용 횟수 :
4인용 특허 :
56
초록▼
A semiconductor card includes a printed circuit substrate upon which is mounted a card circuit including one or more semiconductor components such as dice or packages. External contacts link the card circuit to the circuit of another apparatus by removable insertion therein. The substrate is defined
A semiconductor card includes a printed circuit substrate upon which is mounted a card circuit including one or more semiconductor components such as dice or packages. External contacts link the card circuit to the circuit of another apparatus by removable insertion therein. The substrate is defined by a peripheral opening in a surrounding frame, which may be part of a multiframe strip. The substrate is connected to the frame by connecting segments. The card includes a first plastic casting molded to the substrate and encapsulating the semiconductor components while leaving a peripheral portion of the substrate uncovered. A second plastic casting is molded to the peripheral portion to abut the first plastic casting and form the card periphery. A method for fabricating the semiconductor card is also included.
대표청구항▼
1. A method for fabricating a card in a first molding assembly having a first plate and a second plate forming a first mold cavity and a second molding assembly having a first plate and a second plate forming a second mold cavity, the card having a substrate having a circuit side and a back side, th
1. A method for fabricating a card in a first molding assembly having a first plate and a second plate forming a first mold cavity and a second molding assembly having a first plate and a second plate forming a second mold cavity, the card having a substrate having a circuit side and a back side, the substrate generally separated from a surrounding frame by a peripheral opening spanned by at least one connecting segment between the substrate and the frame, the substrate having at least one electrical circuit and at least one connector for communicating between the at least one electrical circuit and an external circuit, comprising:placing the substrate and the frame between the first plate and the second plate of the first molding assembly;engaging at least portions of the first plate and at least portions of the second plate of the first molding assembly with at least portions of the substrate and the frame;injecting a first material into the first mold cavity for molding a first plastic casting onto the circuit side of the substrate and encapsulating the at least one electrical circuit while leaving a peripheral portion of the circuit side free of the first material, the first plastic casting having an exposed surface;removing the frame, substrate and first plastic casting from the first molding assembly;clamping the frame, substrate and first plastic casting between the first plate and the second plate of the second molding assembly, at least a portion of the exposed surface of the first plastic casting compressed for sealingly engaging a portion of the back side of the substrate against the first plate of the second molding assembly;injecting a second material into the second mold cavity for molding a second plastic casting surrounding the first plastic casting and enclosing the peripheral portion of circuit side and an edge of the substrate, the second plastic casting having a peripheral outer edge;removing the frame and the substrate from the second molding assembly; andsingulating the substrate from the frame. 2. The method of claim 1, wherein the second molding assembly leaves the back side of the substrate substantially free of the second material. 3. The method of claim 1, further comprising:applying antiflash material to the back side of the substrate prior to clamping in the second molding assembly. 4. The method of claim 3, wherein the antiflash material comprises a film. 5. The method of claim 1, wherein the substrate has peripheral edges thereabout, and the at least one connecting segment comprises at least one connecting segment on each of two opposed peripheral edges of the substrate. 6. The method of claim 1, wherein the at least one electrical circuit includes at least one semiconductor component mounted on the circuit side of the substrate. 7. The method of claim 1, wherein the first plastic casting and the second plastic casting each comprise an epoxy resin. 8. The method of claim 1, wherein the first material and the second material each comprise a different resin. 9. The method of claim 1, wherein the substrate comprises a reinforced organic polymer resin. 10. The method of claim 1, further comprising:subjecting the first plastic casting to a curing step prior to clamping in the second molding assembly. 11. The method of claim 1, further comprising:subjecting the second plastic casting to a curing step after removal from the second molding assembly. 12. The method of claim 1, wherein the first molding assembly and the second molding assembly each comprise transfer molds. 13. The method of claim 1, wherein the at least one connector is mounted on the back side of the substrate. 14. The method of claim 1, wherein the second molding assembly is configured to form the second plastic casting to have an inner peripheral portion contiguous with the exposed surface of the first plastic casting and an outer peripheral portion displaced from the exposed surface for attachment of a label covering an interface betw een the first plastic casting and the second plastic casting. 15. The method of claim 1, comprising:forming a notch in the second plastic casting during the molding thereof configured to enclose an exposed end of a connecting segment following singulation thereof. 16. The method of claim 15, wherein the molding of the second plastic casting is performed by placing a pin in contact with the at least one connecting segment to form the notch. 17. The method of claim 15, wherein singulating comprises cutting the connecting segment within the notch. 18. The method of claim 17, wherein singulating further comprises cutting the connecting segment with a cutter die. 19. The method of claim 1, wherein the second plastic casting is formed by compressing the frame and the substrate in the second molding assembly with the first plastic casting compressed for sealingly depressing the substrate to a displaced position relative to the frame. 20. The method of claim 19, wherein the second mold cavity provides for molding of laterally extending wings from a central portion of the peripheral outer edge of the second plastic casting, the wings extending outwardly beyond the peripheral outer edge. 21. The method of claim 19, wherein the displaced position provides encapsulation of the at least one connecting segment within the second plastic casting. 22. The method of claim 20, wherein singulating comprises cutting the wings and the at least one connecting segment from the second plastic casting along the peripheral outer edge thereof. 23. The method of claim 22, wherein the wings and the at least one connecting segment are cut from the second plastic casting with a saw. 24. The method of claim 22, wherein the wings and the at least one connecting segment are cut from the second plastic casting by stamping with a cutter die. 25. The method of claim 1, further comprising:removing extraneous hardened plastic attached to the first plastic casting. 26. The method of claim 1, further comprising:removing extraneous hardened plastic attached to the second plastic casting. 27. A method for fabricating a plurality of semiconductor cards using a plurality of substrates in strip form comprising:providing a strip comprising a plurality of spaced-apart substrates, the strip comprising a plurality of peripheral openings defining the substrates and a plurality of connecting segments attaching the substrates to the strip, each substrate of the plurality having at least one circuit thereon and at least one connector;mounting a card circuit on each substrate of the plurality, each card circuit comprising at least one semiconductor component and apparatus for communication between each the card circuit and an external circuit;providing a first molding assembly comprising a plurality of mold cavities for forming a first plastic casting over each card circuit while leaving a peripheral portion of each substrate uncovered;placing at least a portion of the strip in the first molding assembly;molding the first plastic castings to the substrates using the first molding assembly;removing the strip from the first molding assembly;providing a second molding assembly comprising a plurality of mold cavities for forming a second plastic casting encapsulating the peripheral portions of the substrates;placing at least a portion of the strip in the second molding assembly;molding the second plastic castings to the substrates using the second molding assembly;removing the strip from the second molding assembly; andsevering the connecting segments to singulate individual semiconductor cards from the strip. 28. The method of claim 27, wherein each of the substrates has first and second planar sides, the card circuit mounted on the first side and including conductors connected to the communication means mounted on the second side. 29. The method of claim 27, wherein the communication means comprises conductive contacts. 30. The method of claim 28, wherein the first plastic casting is configured to be compressed by a first mold plate to force the second side of each substrate against a second mold plate during molding of the second plastic casting. 31. A method of fabricating a card in a first molding assembly and a second molding assembly, the card having a circuit side, a back side, and a substrate generally separated from a surrounding frame by a peripheral opening spanned by at least one connecting segment between the substrate and the frame, the substrate having an electrical circuit and at least one external connector for communicating between the electrical circuit and an external circuit, the method comprising:placing the substrate and frame between first and second plates of the first molding assembly;engaging at least portions of the substrate and frame with at least portions of the first molding assembly;injecting a first material into a first mold cavity formed by the first and second plates to mold a first plastic casting onto a circuit side of the substrate and encapsulate the electrical circuit while leaving a peripheral portion of the circuit side uncovered, the first plastic casting having an exposed surface;removing the frame, substrate and first plastic casting from the first molding assembly;clamping the frame, substrate and first plastic casting between first and second plates of the second molding assembly, the exposed surface of the first plastic casting compressed for sealingly engaging a back side of the substrate against one of the first plate and the second plate of the second molding assembly;injecting a second material into a second mold cavity of the second molding assembly to mold a second plastic casting surrounding the first plastic casting and enclosing the uncovered peripheral portion and an edge of the substrate, the second plastic casting having a peripheral outer edge; andremoving the frame, substrate and first and second plastic castings from the second molding assembly. 32. The method of claim 31, further comprising:singulating the substrate with attached first and second plastic castings from the frame. 33. The method of claim 31, wherein the molding leaves the back side of the substrate substantially uncovered. 34. The method of claim 31, further comprising applying antiflash material to the back side of the substrate prior to clamping in the second molding assembly. 35. The method of claim 34, wherein the antiflash material comprises a film. 36. The method of claim 31, wherein the substrate has peripheral edges thereabout, and the at least one connecting segment comprises at least one connecting segment on each of two opposed peripheral edges of the substrate. 37. The method of claim 31, wherein the electrical circuit includes at least one semiconductor component mounted on the circuit side of the substrate. 38. The method of claim 31, wherein the first and second plastic castings comprise epoxy resins. 39. The method of claim 31, wherein the first material and the second material comprise different resins. 40. The method of claim 31, wherein the substrate comprises a reinforced organic polymer resin. 41. The method of claim 31, further comprising subjecting the first plastic casting to a curing step prior to clamping in the second molding assembly. 42. The method of claim 31, further comprising subjecting the second plastic casting to a curing process after removal from the second molding assembly. 43. The method of claim 31, wherein the first molding assembly and the second molding assembly each comprise transfer molds. 44. The method of claim 31, wherein the at least one external connector is mounted on the back side of the substrate. 45. The method of claim 31, wherein the second molding assembly is configured to form the second plastic casting with an inner peripheral portion contiguous with the exposed surface of the first plastic casting and an outer peripheral portion displaced from the exposed surface for attachment of a label covering an interface betwee n the first plastic casting and the second plastic casting. 46. The method of claim 32, further comprising:forming a notch in the second plastic casting during the molding thereof configured to enclose an exposed end of a connecting segment following singulation. 47. The method of claim 46, wherein the molding of the second plastic casting is performed by placing a pin in contact with the connecting segment to form the notch. 48. The method of claim 46, wherein singulating comprises cutting the connecting segment within the notch. 49. The method of claim 32, wherein singulating comprises cutting the at least one connecting segment with a cutter die. 50. The method of claim 31, wherein the second plastic casting is formed by compressing the frame, substrate and first plastic casting in the second molding assembly with the second mold cavity wherein the first plastic casting is compressed for sealingly depressing the substrate to a displaced position relative to the frame. 51. The method of claim 50, wherein the mold cavity of the second molding assembly provides for molding of laterally extending wings from a central portion of the peripheral outer edge of the second plastic casting, the wings extending outwardly beyond the peripheral outer edge. 52. The method of claim 51, wherein the displaced position provides encapsulation of the at least one connecting segment within the second plastic casting. 53. The method of claim 50, wherein singulating comprises cutting the wings and the at least one connecting segment from the second plastic casting along the peripheral outer edge thereof. 54. The method of claim 53, wherein the wings and the at least one connecting segment are cut from the second plastic casting with a saw. 55. The method of claim 51, wherein the wings and the at least one connecting segment are cut from the second plastic casting by stamping with a cutter die. 56. The method of claim 31, further comprising removing extraneous hardened plastic attached to the first plastic casting before the molding of the second plastic casting. 57. The method of claim 31 further comprising removing extraneous hardened plastic attached to the second plastic casting following the molding thereof. 58. A method for fabricating a card in a first molding assembly and a second molding assembly comprising:providing a substrate having a circuit side and a back side, the substrate having a first portion thereof having a peripheral edge separated from a second portion of the substrate by a peripheral opening spanned by at least one connecting segment between the first portion of the substrate and the second portion of the substrate;placing the substrate between a first plate and a second plate of the first molding assembly, the first plate and the second plate forming a first mold cavity;engaging at least a portion of the substrate by portions of the first plate and portions of the second plate;injecting a first material into the first mold cavity for molding a first plastic casting onto at least a portion of the circuit side of the substrate and leaving a peripheral portion of the circuit side free of the first material, the first plastic casting having an exposed surface;placing the second portion of the substrate and the first plastic casting between a first plate and a second plate of the second molding assembly with at least a portion of the back side of the substrate engaging a portion of the first plate of the second molding assembly, the first plate and the second plate of the second molding assembly forming a second mold cavity; andinjecting a second material into the second mold cavity for molding a second plastic casting surrounding the first plastic casting and enclosing the peripheral edge of the first portion of the substrate, the second plastic casting having a peripheral outer edge. 59. The method of claim 58, further comprising:removing the substrate from the second molding assembly; and singulating the substrate. 60. The m ethod of claim 58, wherein the molding of the second plastic casting leaves the back side of the substrate substantially free of the second material. 61. The method of claim 58, further comprising:applying antiflash material to the back side of the substrate prior to clamping in the second molding assembly. 62. The method of claim 61, wherein the antiflash material comprises a film. 63. The method of claim 58, wherein the substrate includes at least one circuit and at least one connector. 64. The method of claim 58, wherein the first plastic casting and the second plastic casting each comprise an epoxy resin. 65. The method of claim 58, wherein the first material and the second material each comprise a different resin. 66. The method of claim 58, wherein the substrate comprises a reinforced organic polymer resin. 67. The method of claim 58, further comprising:subjecting the first plastic casting to curing. 68. The method of claim 58, further comprising:subjecting the second plastic casting to curing. 69. The method of claim 58, wherein the first molding assembly and the second molding assembly each comprise transfer molds. 70. The method of claim 58, wherein the second molding assembly is configured to form a second plastic casting having an inner peripheral portion contiguous with the exposed surface of the first plastic casting and an outer peripheral portion displaced from the exposed surface for attachment of a label covering an interface between the first plastic casting and the second plastic casting. 71. The method of claim 58, comprising:forming a notch in the second plastic casting to enclose an exposed end of a connecting segment. 72. The method of claim 58, further comprising:placing a pin in contact with the at least one connecting segment for forming a notch. 73. The method of claim 59, wherein singulating comprises cutting the at least one connecting segment. 74. The method of claim 59, wherein singulating comprises cutting the at least one connecting segment with a cutter die. 75. The method of claim 58, wherein the second plastic casting is formed by compressing the substrate in the second molding assembly with the first plastic casting compressed for sealingly depressing the substrate to a displaced position relative to the second portion of the substrate. 76. The method of claim 75, wherein the second mold cavity provides for molding of laterally extending wings from a central portion of the peripheral outer edge of the second plastic casting, the wings extending outwardly beyond the peripheral outer edge. 77. The method of claim 75, wherein the displaced position provides encapsulation of the at least one connecting segment within the second plastic casting. 78. The method of claim 59, wherein singulating comprises cutting the wings and the at least one connecting segment from the second plastic casting along the peripheral outer edge thereof.
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