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Reactive diluent and curable resin composition 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • C08F-220/68
출원번호 US-0125604 (2002-04-19)
발명자 / 주소
  • Yurugi, Keiji
  • Fukada, Akihiko
  • Matsukawa, Kenji
출원인 / 주소
  • Nippon Shokubai Co., Ltd.
대리인 / 주소
    Sughrue Mion, PLLC
인용정보 피인용 횟수 : 32  인용 특허 : 6

초록

The present invention provides a reactive diluent composition which overcomes drawbacks of both the radical-cure and the cationic-cure reactive diluents and can be applied in a broad variety of uses such as paints, inks, adhesives, pressure sensitive adhesives, surface-modifiers, and molding materia

대표청구항

1. A reactive diluent composition comprisinga vinyl ether group-containing (meth) acrylic ester represented by the following general formula (1): 2 ═CR 1 —COO—R 2 —O—CH═CH—R 3   (1)wherein R 1 represents a hydrogen atom or a methyl

이 특허에 인용된 특허 (6)

  1. Sasabe Masazumi,JPX ; Fukada Akihiko,JPX ; Mizuta Keiichiro,JPX, (Meth)acryl syrup, method of manufacturing the same, and method of manufacturing molding material including the same.
  2. Nagano Hideaki,JPX ; Nakagawa Koichi,JPX ; Yurugi Keiji,JPX ; Makino Mitsuaki,JPX ; Hirata Tsuyoshi,JPX ; Nagare Koichiro,JPX ; Kita Yuichi,JPX, Acrylic acid derivatives, method for preparing the acrylic acid derivatives, and acrylic acid polymers.
  3. Yurugi Keiji,JPX ; Nakagawa Koichi,JPX ; Nagano Hideaki,JPX ; Kita Yuichi,JPX, Acrylic ester derivative and producing of the same and acrylic-ester-based polymer.
  4. Hayakawa Yoshihide (Tokyo JPX) Satomura Masato (Kanagawa JPX) Sato Kozo (Kanagawa JPX), Image forming method.
  5. Plotkin Jeffrey S. (Monsey NY) Dougherty James A. (Pequannock NJ) Vara Fulvio J. (Chester NJ) Taylor Paul D. (West Milford NJ), Radiation curable cross linkable compositions.
  6. Andrei Maria (Berceto ITX) Roggero Arnaldo (San Donato Milanese ITX) Soprani Massimo (Borgosesia ITX), Solid, polyether-bases polymeric electrolyte.

이 특허를 인용한 특허 (32)

  1. Kanagawa, Yoshinori; Higuchi, Daichi; Sakamoto, Tamotsu, Active-energy-ray-curable hot-melt urethane resin composition, member for electronic device, the member including the resin composition, and packing.
  2. Eckhardt, Gunther; Wanek, Erich; Kuppermann, Bernd, Catalyst constituent.
  3. Gao, Feng; Johnson, Lynda Kaye; Keusseyan, Roupen Leon; Keys, Dalen E.; Malajovich, Irina; Schiffino, Rinaldo S.; Zumsteg, Jr., Fredrick Claus, Composition and method for providing a patterned metal layer having high conductivity.
  4. Zech, Joachim W.; Grupp, Hendrik; Klettke, Thomas, Curable composition, process of production and use thereof.
  5. Claes, Roland; Loccufier, Johan, Curable liquids and inks for toys and food packaging applications.
  6. Claes, Roland; Loccufier, Johan, Curable liquids and inks for toys and food packaging applications.
  7. Chase, David M.; Dake, Kenneth; Hawkinson, Kelly A.; Kelly, Jack; Murphy, Edward J., Flame retardant UV cured buffered optical fibers and buffer composition.
  8. Chase,David M.; Dake,Kenneth; Hawkinson,Kelly A.; Kelly,Jack; Murphy,Edward J., Flame retardant UV cured buffered optical fibers and buffer composition.
  9. Miura, Satoru; Nakane, Hiroki, Ink composition for ultraviolet curable ink jets, ink jet recording apparatus using the same, ink jet recording method using the same, and ink set.
  10. Miura, Satoru; Nakane, Hiroki, Ink composition for ultraviolet curable ink jets, ink jet recording apparatus using the same, ink jet recording method using the same, and ink set.
  11. Toyoda,Eiji; Okada,Takeshi; Yoshikawa,Keisuke; Eto,Takuya; Ikemura,Kazuhiro; Akizuki,Shinya; Ishizaka,Tsuyoshi; Uchida,Takahiro; Toyota,Kei, Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby.
  12. López Muñoz, Antonio, Method for the production of a digital printing ink and product thus produced.
  13. Smelyansky, Pyotr; Burton, Jr., Kenneth W., Methods for providing radiation cured coatings on substrates.
  14. Markovitz,Mark; Newman,William Gene; Yung,Mabel Shang; Squillacioti,Leonard Paul; Foley,Peter John, One part, heat cured pressure sensitive adhesives.
  15. Kida, Hiroaki; Fukumoto, Hiroshi; Saito, Toru; Nakano, Keitaro; Nakane, Hiroki, Photocurable ink composition for ink jet recording and ink jet recording method.
  16. Kida, Hiroaki; Fukumoto, Hiroshi; Saito, Toru; Nakano, Keitaro; Nakane, Hiroki, Photocurable ink composition for ink jet recording and ink jet recording method.
  17. Nakano, Keitaro; Fukumoto, Hiroshi; Nakane, Hiroki; Kida, Hiroaki; Saito, Toru; Sato, Chigusa, Photocurable ink composition, recording method, recording apparatus, photocurable ink jet recording ink composition, and ink jet recording method.
  18. Yoda, Toshiyuki; Fukumoto, Hiroshi, Photocurable ink jet recording ink composition and ink jet recording method.
  19. Yoda, Toshiyuki; Fukumoto, Hiroshi, Photocurable ink jet recording ink composition and ink jet recording method.
  20. Kawamori, Takashi; Masuko, Takashi; Katogi, Shigeki; Yasuda, Masaaki, Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part.
  21. Kawamori, Takashi; Masuko, Takashi; Katogi, Shigeki; Yasuda, Masaaki, Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part.
  22. Kawamori, Takashi; Masuko, Takashi; Katogi, Shigeki; Yasuda, Masaaki, Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part.
  23. Kawamori, Takashi; Masuko, Takashi; Katogi, Shigeki; Yasuda, Masaaki, Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part.
  24. Kawamori, Takashi; Masuko, Takashi; Katogi, Shigeki; Yasuda, Masaaki, Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part.
  25. Kawamori, Takashi; Masuko, Takashi; Katogi, Shigeki; Yasuda, Masaaki, Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part.
  26. Smelyansky, Pyotr; Burton, Jr., Kenneth W., Radiation-curable coating compositions, composite and plastic materials coated with said compositions and methods for their preparation.
  27. Takahashi, Atsuya; Shigemoto, Takeo; Komiya, Zen; Ohara, Hiroki, Radiation-curable liquid resin composition.
  28. Satou, Hiroyuki; Itami, Setsuo; Ooizumi, Fumitaka; Takahashi, Toshiyuki, UV-curable ink-jet ink, electronic circuit board, electronic component and display device.
  29. Itoh,Yoshikatsu; Nishikawa,Tomoyuki, Ultraviolet ray curable ink, ink composition for ink jet and process for preparing ink jet printed matter using the same.
  30. Itoh,Yoshikatsu; Nishikawa,Tomoyuki, Ultraviolet ray curable ink, ink composition for ink jet and process for preparing ink jet printed matter using the same.
  31. Mizutaki, Yusuke; Nakane, Hiroki; Okamoto, Eiji, Ultraviolet ray-curable clear ink composition and recording method.
  32. Schwendeman,John E.; Perrine,M. Lisa, Vinyl ethers and compositions containing them.
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