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Component having a filter 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01D-011/24
  • G01L-019/14
출원번호 US-0901366 (2001-07-09)
발명자 / 주소
  • McDonald, William G.
  • Monk, David J.
  • Hannibal, Jr., James E.
  • Petrovic, Slobodan
출원인 / 주소
  • Freescale Semiconductor, Inc.
인용정보 피인용 횟수 : 16  인용 특허 : 39

초록

A component includes a housing ( 110, 1110 ) at least partially defining a cavity ( 125, 1125 ), a sensor element ( 105 ) located in the cavity, and a support member ( 340, 1140 ) located over the cavity, located over at least a portion of the housing, and having a hole ( 341, 1141 ) over the cavity

대표청구항

1. A component comprising:a housing at least partially defining a cavity;a sensor element in the cavity;a support member over the cavity, over at least a portion of the housing, and having a hole over the cavity; anda filter over the support member and over the hole in the support member;wherein the

이 특허에 인용된 특허 (39)

  1. Godin Richard ; Corbett Steven James ; Gilleo Kenneth Burton ; Johnson Alden, Applying encapsulating material to substrates.
  2. Bell Robert L. (Chatsworth CA) Willing Robert (Anaheim CA) Kavli Fred (Woodland Hills CA), Capacitive pressure transducer.
  3. Adams Victor J. (Tempe AZ), Cast membrane protected pressure sensor.
  4. La Balme Maurice (Saint Cloud FR), Device for measuring pressure.
  5. Fuller David L. (1110 Mountain Creek Trail Atlanta GA 30328), Digital sensing device.
  6. Moden Walter L. ; Jacobson John O., Encapsulant dam standoff for shell-enclosed die assemblies.
  7. Tuttle Mark E. (Boise ID) Mousseau Joseph P. (Boise ID) Cirino Clay L. (Boise ID), Encapsulated electronic component and method for encapsulating an electronic component.
  8. Carlsson Per-Olov,SEX, Insert for a pressure transducer within a medical treatment apparatus.
  9. Rapp Christoph (Griesheim DEX) Mikulecki Karl (Darmstadt DEX), Liquid filled pressure transducer.
  10. Lam Man K. (Colorado Springs CO) Mathias Milton W. (Colorado Springs CO), Low cost wet-to-wet pressure sensor package.
  11. Sengupta Kabul S. ; Sklenicka Carl E. ; Thompson Deborah L. ; Arellano Raul A. ; Nagai Naoyuki,JPX ; Takehashi Nobuyuki,JPX ; Nomoto Kouichiro,JPX, Mass reflowable windowed package.
  12. Maudie Theresa A. ; Monk David J. ; Savage Timothy S., Media compatible microsensor structure and methods of manufacturing and using the same.
  13. Adams Victor J. (Tempe AZ) Derrington Carl E. (East Greenbush NY), Membrane protected pressure sensor.
  14. Jacobs Richard L., Method for encapsulated integrated circuits.
  15. Kobori Shigeyuki (Hitachi JPX) Yamada Kazuji (Hitachi JPX) Kobayashi Ryoichi (Toukai JPX) Miyazaki Atsushi (Katsuta JPX) Suzuki Seikou (Hitachioota JPX), Method for manufacturing semiconductor absolute pressure sensor units.
  16. Letterman ; Jr. James P. ; Asher ; Sr. Reginald K. ; Asher ; II Reginald K. ; Sanduja Mohan Lal ; Dragnea Felicia B., Method of manufacturing semiconductor component.
  17. David J. Monk ; Song Woon Kim KR; Kyujin Jung KR; Bishnu Gogoi ; Gordon Bitko ; Bill McDonald ; Theresa A. Maudie ; Dave Mahadevan, Micro electro-mechanical system sensor with selective encapsulation and method therefor.
  18. Smith Jeffery B. (11 Milford St. East Victoria Park ; Western Austrailia AUX), Moisture sensor.
  19. Glenn Thomas P. ; Hollaway Roy D.,PHX ; Panczak Anthony E., Near chip size integrated circuit package.
  20. Slobodan Petrovic ; Holly Jean Miller, Physical sensor component.
  21. Sasaki Keiji (Zama JPX), Pressure equalizing mechanism for a pressure switch.
  22. Baba Horonobu,JPX ; Mizuno Tiaki,JPX ; Imai Masahito,JPX ; Yokoyama Yuichi,JPX ; Takakuwa Masaki,JPX ; Shimoyama Yasuki,JPX, Pressure sensor.
  23. Sawada Kenichi,JPX ; Mitani Tateki,JPX, Pressure sensor.
  24. Auburger Albert,DEX ; Winterer Jurgen,DEX, Pressure sensor component for mounting on the component-mounting surface of a printed circuit board.
  25. Hase Yuji (Amagasaki JPX) Bessho Mikio (Amagasaki JPX), Pressure sensor for high temperature vibration intense environment.
  26. Yajima Yasuhito (Nagoya JPX) Watanabe Yasushi (Nagoya JPX) Shibata Kazuyoshi (Nagoya JPX), Pressure sensor having baffling means.
  27. Shulze John E., Pressure transducer apparatus with disposable dome.
  28. Shulze John E., Pressure transducer apparatus with disposable dome.
  29. Koen Edward F. (Pleasanton CA) Tasker Richard (San Jose CA), Protected pressure sensor and method of making.
  30. Wilson Howard P. (Austin TX) Martin Fonzell D. J. (Austin TX), Self-opening vent hole in an overmolded semiconductor device.
  31. Takahashi Yoshiharu (Itami JPX) Hirose Tetsuya (Itami JPX) Ichiyama Hideyuki (Itami JPX), Semiconductor pressure sensor.
  32. Takahashi Yoshiharu (Itami JPX) Hirose Tetsuya (Itami JPX) Otani Hiroshi (Itami JPX) Takemura Seiji (Itami JPX), Semiconductor pressure sensor for use at high temperature and pressure and method of manufacturing same.
  33. Yamaguchi Yasuo (Itami JPX), Silicone oil-filled semiconductor pressure sensor.
  34. Mertol Atila, Stiffener with slots for clip-on heat sink attachment.
  35. Fukaya Kenji,JPX ; Yamauchi Masanobu,JPX ; Watanabe Isao,JPX ; Yamada Hirokazu,JPX ; Kojima Takashi,JPX, Structure of gas sensor.
  36. Knighton David R. (San Francisco CA), System for removing gas bubbles from liquids.
  37. Higgins ; III Leo M. (Austin TX) Gentile John C. (Austin TX), Tab semiconductor device having die edge protection and method for making the same.
  38. Thomas Perry W. (Grandview MO) Bare Rex O. (Irvine CA) Robinson Earl F. (El Toro CA) Hayob Wayne (Lenexa KS), Tire pressure warning system.
  39. Sooriakumar K. (Scottsdale AZ) Monk David J. (Mesa AZ) Chan Wendy K. (Scottsdale AZ) Goldman Kenneth G. (Chandler AZ), Vertically integrated sensor structure and method.

이 특허를 인용한 특허 (16)

  1. Ohta,Tameharu, Angular velocity mount arrangement.
  2. Hooper, Stephen R.; Daniels, Dwight L.; MacDonald, James D.; McDonald, William G.; Xia, Chunlin C., Methods for fabricating sensor device package using a sealing structure.
  3. DeNatale,Jeffrey F.; Borwick, III,Robert L.; Stupar,Philip A., Microelectromechanical (MEM) viscosity sensor and method.
  4. Hooper, Stephen R.; MacDonald, James D.; McDonald, William G., Molded differential PRT pressure sensor.
  5. Tola,Jeffrey, Non-contacting sensor multichip module with integral heat-sinks.
  6. Tola,Jeffrey, Non-contacting sensor multichip module with integral heat-sinks.
  7. Okuda,Yasuyuki; Yoshida,Takahiko; Endo,Noboru, Optical gas sensing apparatus.
  8. Bradley, Alistair D.; Ricks, Lamar F., Packaging for chip-on-board pressure sensor.
  9. Wanami,Shingo; Murai,Toshiyuki, Pressure detection device.
  10. Lamb,Wayne A.; Ricks,Lamar F.; Bradley,Alistair D., Pressure sensor method and apparatus.
  11. Roth,Stephen Frederick; Crano,Richard Nicholas, Rim mounted tire pressure monitoring system.
  12. Sasaki, Makoto, Semiconductor device with acceleration sensor.
  13. Lin, Yizhen, Sensor device and related fabrication methods.
  14. Takano, Takamasa, Sensor device manufacturing method and sensor device.
  15. Hooper, Stephen R.; Daniels, Dwight L.; MacDonald, James D.; McDonald, William G.; Xia, Chunlin C., Sensor device with sealing structure.
  16. Murakami, Hideki, Wheel condition detector and wheel condition monitor.
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