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Cooling system for hinged portable computing device

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G06F-001/20
출원번호 US-0280726 (2002-10-25)
발명자 / 주소
  • Wang, Hwai-Ming
  • Chiang, Wei-Chieh
  • Liu, Hsien-Tsang
출원인 / 주소
  • Thermal Corp.
대리인 / 주소
    Duane Morris LLP
인용정보 피인용 횟수 : 21  인용 특허 : 27

초록

A cooling system for a hinged portable computing device is provided having a first passive heat transfer device is carried within a first housing portion of the computer and a second passive heat transfer device that is carried within a second housing portion of the portable computer. A hinge struct

대표청구항

1. An electronic apparatus comprising:a housing having first end second portions;a heat generating component carried in said first housing portion;a first passive heat transfer device carried within said first housing portion and having a first end thermally coupled to said heat generating component

이 특허에 인용된 특허 (27)

  1. Haley Kevin (San Jose CA) Aghazadeh Mostafa (Chandler AZ) Xie Hong (Chandler AZ), Apparatus for dissipating heat in a hinged computing device.
  2. Ernst Donald M. (Leola PA) Copenhaver Richard L. (Rothsville PA), Articulated heat pipes.
  3. Cipolla Thomas Mario ; Holung Joseph Anthony ; Kamath Vinod ; Mansuria Mohanlal Savji ; Mok Lawrence Shungwei ; Wong Tin-Lup, Computer incorporating heat dissipator with hinged heat pipe arrangement for enhanced cooling capacity.
  4. Chu, Richard C.; Ellsworth, Jr., Michael J.; Simons, Robert E., Cooling system for portable electronic and computer devices.
  5. Shibasaki, Kazuya, Cooling unit for cooling heat generating component and electronic apparatus equipped with the cooling unit.
  6. Ohashi, Shigeo; Ashiwake, Noriyuki; Naganawa, Takashi; Kitano, Makoto; Minamitani, Rintaro; Kondo, Yoshihiro; Nakagawa, Tsuyoshi, Electronic apparatus.
  7. Cipolla, Thomas Mario; Mok, Lawrence Shungwei, Formed hinges with heat pipes.
  8. Mecredy ; III Henry E., Heat dissipating lid hinge structure with laterally offset heat pipe end portions.
  9. Hsu Richard T., Heat dissipation system for a laptop computer using a heat pipe.
  10. Bhatia Rakesh, Heat exchanger system for cooling a hinged computing device.
  11. Bhatia Rakesh (Sunnyvale CA) Haley Kevin (San Jose CA), Heat pipe exchanger system for cooling a hinged computing device.
  12. Chiyoshi Sasaki JP; Hiroaki Maekawa JP; Junji Sotani JP; Masaru Ohmi JP; Isao Tsukada JP; Toru Arimoto JP, Heat pipe hinge structure for electronic device.
  13. Garner Scott D. ; Meyer ; IV George A. ; Toth Jerome E. ; Longsderff Richard W., Heat pipes inserted into first and second parallel holes in a block for transferring heat between hinged devices.
  14. Ishida Yoshio (Osaka JPX), Heat radiating apparatus.
  15. Shou Yong Kung,TWX ; Chiang Feng-Yu,TWX, Heat transfer device.
  16. Gold Philip, Heat transfer from base to display portion of a portable computer.
  17. Cullimore Brent A. (49 Dawn Heath Cir. Littleton CO 80127), Heat transfer system having a flexible deployable condenser tube.
  18. Donahoe Daniel N. ; Gill Michael T., Liquid cooled computer apparatus and associated methods.
  19. Mochizuki Masataka,JPX ; Saito Yuji,JPX ; Hasegawa Masashi,JPX ; Ono Motoyuki,JPX, Personal computer cooling device having hinged heat pipe.
  20. Cipolla Thomas Mario ; Mok Lawrence Shungwei, Portable computer rotational heat pipe heat transfer.
  21. Lowry David A. ; Novin Eugene, Rotatable heat transfer coupling.
  22. Mok Lawrence Shungwei, Rotational joint for hinged heat pipe cooling of a computer.
  23. Progl Curtis L. ; Tracy Mark S. ; Moore David A., System and method for transferring heat between movable portions of a computer.
  24. Janak G. Patel, Thermal transfer hinge for hinged mobile computing device and method of heat transfer.
  25. Kobayashi Takashi,JPX, Thermo-siphon and manufacturing method of thermo-siphon and information processing apparatus.
  26. Larson Ralph I. (Bolton MA) Phillips Richard L. (Alachua FL) Beane Alan F. (Gilford NH), Two-phase cooling system for laptop computers.
  27. Tao Chian,TWX ; Chang Eric,TWX ; Lin Chia-Jui,TWX, Winding chain dissipating unit suitable for electronic device.

이 특허를 인용한 특허 (21)

  1. Degner, Brett William; Brock, John M.; Hamel, Bradley Joseph, Computer hinge having a hollow clutch.
  2. Reber, David, Computer with door-mounted electronics.
  3. Reber, David; Garel, Michael, Computer with high intensity screen.
  4. Reber, David; Garel, Michael, Computer with high intensity screen.
  5. Reber, David; Garel, Michael, Computer with removable cartridge.
  6. Tomioka, Kentaro; Hisano, Katsumi; Takamatsu, Tomonao; Tanimoto, Mitsuyoshi; Kusaka, Hiroyuki; Kinoshita, Teruo, Electronic apparatus having a circulation path of liquid coolant to cool a heat-generating component.
  7. MacDonald, Mark; Nishi, Yoshifumi Yoshi, Electronic device having a passive heat exchange device.
  8. Nishi, Yoshifumi; MacDonald, Mark; Heymann, Douglas, Electronic device having passive cooling.
  9. Lin, Yun-Jeng, Electronic device with heat-dissipation structure.
  10. Moore, David A.; Tracy, Mark S., Hinge connector with liquid coolant path.
  11. Lin, Kuo-Len; Lin, Chen-Hsiang; Hsu, Ken; Cheng, Chih-Hung, Integrated heat-dissipating device for portable electronic product.
  12. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Parallel thermoelectric heat exchange systems.
  13. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Physically separated hot side and cold side heat sinks in a thermoelectric refrigeration system.
  14. Patel, Chandrakant; Bash, Cullen E.; Sharma, Ratnesh K., System and method for cooling an electronic device.
  15. Reber, David, System for mounting a display to a computer.
  16. Stanley, Marshall; Barus, Daniel, Systems and methods for operating a thermoelectric module to increase efficiency.
  17. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Systems and methods to mitigate heat leak back in a thermoelectric refrigeration system.
  18. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Thermoelectric heat exchange system comprising cascaded cold side heat sinks.
  19. June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek; Edwards, Jesse W., Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance.
  20. Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Thermoelectric refrigeration system control scheme for high efficiency performance.
  21. Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Two-phase heat exchanger mounting.
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