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Article and method for controlled debonding of elements using shape memory alloy actuators

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B32B-031/26
  • B32B-033/00
출원번호 US-0376629 (2003-03-03)
발명자 / 주소
  • Wetzel, Eric D.
출원인 / 주소
  • The United States of America as represented by the Secretary of the Army
대리인 / 주소
    Stolarun Edward
인용정보 피인용 횟수 : 35  인용 특허 : 3

초록

A separable bonding system including two opposed rigid adherends and a deformed shape memory alloy element disposed between and adhesively bonded to facing surfaces of the two rigid adherends. A method of adhesively bonding and selectively debonding and separating at least two rigid adherends includ

대표청구항

1. A separable bonding system comprising:two rigid adherends arranged in opposed, spaced relationship to each other; anda deformed shape memory alloy element disposed between and adhesively bonded to facing surfaces of the two rigid adherends. 2. The bonding system according to claim 1 wherein the f

이 특허에 인용된 특허 (3)

  1. Albrecht Joachim (Mlligen CA CHX) Duerig Thomas (Fremont CA), Composite material in rod, tube, strip, sheet or plate shape with reversible thermomechanical properties and process for.
  2. Jacobs Jack H. (St. Louis MO) Thomas Matthew M. (Madison IL) Grosskrueger Duane D. (Highlands Ranch CO) Carpenter Bernie F. (Littleton CO) Perry Alan R. (Morrison CO), Fabrication method for composite structure adapted for controlled structural deformation.
  3. DeLaurentis Stephen A. ; Interrante Mario J. ; Jackson Raymond A. ; Knickerbocker John U. ; Ray Sudipta K. ; Stalter Kathleen A., Process and apparatus to remove closely spaced chips on a multi-chip module.

이 특허를 인용한 특허 (35)

  1. Xie, Tao; Xiao, Xingcheng; Wang, Ruomiao, Attachment pad with thermal reversible adhesive and methods of making and using the same.
  2. Kline, Eric V.; Sinha, Arvind K., Ball grid array rework.
  3. Kline, Eric V.; Sinha, Arvind K., Ball grid array rework.
  4. Kline, Eric V.; Sinha, Arvind K., Ball grid array rework.
  5. Terasaki, Nobuyuki; Nagatomo, Yoshiyuki, Bonded body and power module substrate.
  6. Terasaki, Nobuyuki; Nagatomo, Yoshiyuki, Bonded body and power module substrate.
  7. Xie, Tao; Xiao, Xingcheng, Climbing devices based on thermo-reversible dry adhesives.
  8. Rule, Joseph D.; Behling, Ross E.; Lee, Nicholas A.; LeBow, Leslie M., Debondable adhesive article and methods of making and using the same.
  9. Browne, Alan L.; Johnson, Nancy L., Fit and finish methods.
  10. Rule, Joseph D.; Tapio, Scott M.; Sherman, Audrey S.; Schaffer, Kevin R.; Liu, Lan H.; Branigan, Margot A.; Behling, Ross E., Heat de-bondable optical articles.
  11. Xie, Tao; Wang, Ruomiao; Xiao, Xingcheng, High strength reversible noncovalent adhesion methods for a solid polymer-polymer interface.
  12. Xie, Tao; Schreck, Richard Michael; Xiao, Xingcheng, Method for robotic handling using thermo-reversible dry adhesives.
  13. Xie, Tao; Xiao, Xingcheng; Wang, Ruomiao, Method of minimizing residue adhesion for thermo-reversible dry adhesives.
  14. Chichery, Emmanuel, Method of sticking together and un-sticking two parts by means of a filled adhesive.
  15. Rotter, Daniel M.; Nelson, Paul E., Methods and tools for forming contoured composite structures with shape memory alloy.
  16. Rotter, Daniel M.; Nelson, Paul E., Methods and tools for forming contoured composite structures with shape memory alloy.
  17. Xie, Tao; Xiao, Xingcheng; Wang, Ruomiao; Kia, Hamid G.; Schroeder, Jessica A.; Durocher, Todd E., Multilayer adhesive for thermal reversible joining of substrates.
  18. Xie, Tao; Xiao, Xingcheng; Wang, Ruomiao; Kia, Hamid G.; Schroeder, Jessica A.; Durocher, Todd E., Multilayer adhesive for thermal reversible joining of substrates.
  19. Xie, Tao; Xiao, Xingcheng, Multilayer thermo-reversible dry adhesives.
  20. Schneider, Andreas Simon; Kroner, Elmar; Kaiser, Jessica; Frensemeier, Mareike; Arzt, Eduard, Object with selectable adhesion.
  21. Xie, Tao, Polymer systems with multiple shape memory effect.
  22. Xie, Tao; Xiao, Xingcheng; Cheng, Yang T., Polymer systems with multiple shape memory effect.
  23. Grummon, David S., Prestrained thin-film shape memory actuator using polymeric substrates.
  24. Cheng, Yang T.; Xie, Tao; Xiao, Xingcheng; Ulicny, John C.; Kia, Hamid G., Remote activation of thermo-reversible dry adhesives.
  25. Xie, Tao; Xiao, Xingcheng, Reversible dry adhesives.
  26. Xie, Tao; Xiao, Xingcheng, Reversible dry adhesives for wet and dry conditions.
  27. Xie, Tao; Xiao, Xingcheng; Wang, Ruomiao, Reversible welding process for polymers.
  28. Xie, Tao; Wang, Ruomiao, Self-cleaning dry adhesives.
  29. Xiao, Xingcheng; Xie, Tao; Cheng, Yang T., Self-healing and scratch resistant shape memory polymer system.
  30. Xiao, Xingcheng; Xie, Tao; Cheng, Yang T., Self-healing and scratch resistant shape memory polymer system.
  31. Yang,Jihui; Snyder,Dexter D.; Cheng,Yang Tse, Shape memory alloy information storage device.
  32. Xie, Tao; Rodak, Daniel E.; Rodgers, William R., Shape memory epoxy polymers.
  33. Xie, Tao; Hulway, Joseph A.; Xiao, Xingcheng, Shape memory polymer and adhesive combination and methods of making and using the same.
  34. Xie, Tao, Shape memory polymers with surface having dangling adhesive polymeric chains and methods of making and using the same.
  35. Roszman,Eric John; Baron,Orit Dana, Temperature specific mechanism retaining brake pads in a caliper assembly during shipping.
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