초록 ▼

The increase of temperature in heat sensitive devices during heat generating conditions is prevented through the absorption of heat, by providing Aldehyde in an amount sufficient to effect the required heat absorption. Where the heat generating conditions are generated by a heat generator, separate

The increase of temperature in heat sensitive devices during heat generating conditions is prevented through the absorption of heat, by providing Aldehyde in an amount sufficient to effect the required heat absorption. Where the heat generating conditions are generated by a heat generator, separate and distinct from the heat sensitive device, the Aldehyde is supported in a position between the heat sensitive device and the heat generator. Where the heat sensitive device is itself the heat generator, the Aldehyde is contacted to the heat sensitive device either directly or indirectly.

대표청구항 ▼

1. A heat absorbing control device, comprising:(a) aldehyde in an amount sufficient to effect a level of heat absorption;(b) support means for supporting said aldehyde, said aldehyde being supportable in relation to a heat sensitive device by said support means;wherein said aldehyde effects said lev

1. A heat absorbing control device, comprising:(a) aldehyde in an amount sufficient to effect a level of heat absorption;(b) support means for supporting said aldehyde, said aldehyde being supportable in relation to a heat sensitive device by said support means;wherein said aldehyde effects said level of heat absorption at least in part based on an irreversible decomposition of said aldehyde. 2. A heat absorbing control device according to claim 1, wherein the aldehyde is selected from the group consisting of formaldehyde (methanal), acetaldehyde (ethanal), propionaldehyde (proponal), n-butyraldehyde (butanal), benzaldehyde, p-Nitrobenzaldehyde, p-tolualdehyde, salicylaldehyde (ortho-hydroxybenzaldehyde), phenylacetaldehyde (alpha-toluic aldehyde), alpha-methylvaleraldehyde (a-methyl pentanal), 4-methylpentanol, paraformaldehyde (trioxane), paraldehyde and mixtures thereof. 3. A heat absorbing control device according to claim 1, wherein the means for supporting said aldehyde comprises a retaining matrix, packaging, encapsulation, microencapsulation, enclosure or structure. 4. A heat absorbing control device according to claim 1, wherein a heat sensitive device is embedded within the aldehyde. 5. A heat absorbing control device according to claim 1, wherein the aldehyde is surrounded by a heat sensitive device. 6. A heat absorbing control device according to claim 1, wherein the means for supporting said aldehyde is a closed container, within which said aldehyde is located. 7. A heat absorbing control device according to claim 6, wherein said aldehyde lines an inner wall of the closed container. 8. A heat absorbing control device according to claim 4, wherein said heat sensitive device is located within and spaced from said aldehyde. 9. A heat absorbing control device according to claim 1, wherein said aldehyde is adhered to a flexible substrate, said flexible substrate being adaptable to the size and shape of a heat sensitive device in thermal communication with said aldehyde. 10. A heat absorbing control device according to claim 1, wherein the means for supporting said aldehyde is configured based on factors selected from the group consisting of the type of heat sensitive device to be utilized with said aldehyde, spatial limitations associated with said heat sensitive device, the physical environment of said heat sensitive device, heat generating conditions to which said heat sensitive device will be subjected, and combinations thereof. 11. A heat absorbing control device according to claim 1, further comprising at least one layer of insulation placed between said heat sensitive device and said support means. 12. A heat absorbing control device according to claim 1, further comprising at least one layer of insulation placed between said support means and a source of heat. 13. A heat absorbing control device according to claim 1, further comprising a hermetic seal surrounding said support means. 14. A heat absorbing control device according to claim 1, wherein said hermetic seal includes a vent. 15. A heat absorbing control device according to claim 1, wherein said aldehyde is formaldehyde (methanal). 16. A heat absorbing control device according to claim 1, wherein said aldehyde is acetaldehyde (ethanal). 17. A heat absorbing control device according to claim 1, wherein said aldehyde is propionaldehyde (propanal). 18. A heat absorbing control device according to claim 1, wherein said aldehyde is n-butyraldehyde (butanal). 19. A heat absorbing control device according to claim 1, wherein said aldehyde is benzaldehyde. 20. A heat absorbing control device according to claim 1, wherein said aldehyde is p-nitrobenzaldehyde. 21. A heat absorbing control device according to claim 1, wherein said aldehyde is p-tolualdehyde. 22. A heat absorbing control device according to claim 1, wherein said aldehyde is salicylaldehyde (ortho-hydroxybenzaldehyde). 23. A heat absorbing control device according to claim 1, wherein said aldehyde is phenylacetaldehyde (alpha-toluic aldehyde). 24. A heat absorbing control device according to claim 1, wherein said aldehyde is alpha-methylvaleraldehyde (methyl pentanal). 25. A heat absorbing control device according to claim 1, wherein said aldehyde is paraformaldehyde (trioxane). 26. A heat absorbing control device according to claim 1, wherein said aldehyde is paraldehyde. 27. A heat absorbing control device, comprising:aldehyde in an amount sufficient to effect a level of heat absorption, said aldehyde being formed into an endothermic structure that is effective to absorb said level of heat absorption at least in part based on an irreversible decomposition of said aldehyde. 28. A heat absorbing control device according to claim 27, wherein the aldehyde is selected from the group consisting of formaldehyde (methanal), acetaldehyde (ethanal), propionaldehyde (proponal), n-butyraldehyde (butanal), benzaldehyde, p-Nitrobenzaldehyde, p-tolualdehyde, salicylaldehyde (ortho-hydroxybenzaldehyde), phenylacetaldehyde (alpha-toluic aldehyde), alpha-methylvaleraldehyde (a-methyl pentanal), 4-methylpentanol, paraformaldehyde (trioxane), paraldehyde and mixtures thereof. 29. A heat absorbing control device according to claim 27, further comprising a heat sensitive device in thermal communication with said aldehyde, and wherein the heat sensitive device is embedded within said endothermic structure. 30. A heat absorbing control device according to claim 27, wherein said aldehyde is formaldehyde (methanal). 31. A heat absorbing control device according to claim 27, wherein said aldehyde is acetaldehyde (ethanal). 32. A heat absorbing control device according to claim 27, wherein said aldehyde is propionaldehyde (propanal). 33. A heat absorbing control device according to claim 27, wherein said aldehyde is n-butyraldehyde (butanal). 34. A heat absorbing control device according to claim 27, wherein said aldehyde is benzaldehyde. 35. A heat absorbing control device according to claim 27, wherein said at dehyde is p-nitrobenzaldehyde. 36. A heat absorbing control device according to claim 27, wherein said aldehyde is p-tolualdehyde. 37. A heat absorbing control device according to claim 27, wherein said aldehyde is salicylaldehyde (ortho-hydroxybenzaldehyde). 38. A heat absorbing control device according to claim 27, wherein said aldehyde is phenylacetaldehyde (alpha-toluic aldehyde). 39. A heat absorbing control device according to claim 27, wherein said aldehyde is alpha-methylvaleraldehyde (methyl pentanal). 40. A heat absorbing control device according to claim 27, wherein said aldehyde is paraformaldehyde (trioxane). 41. A heat absorbing control device according to claim 27, wherein said aldehyde is paraldehyde. 42. In combination:(a) a heat absorbing control device that includes aldehyde in an amount sufficient to effect a level of heat absorption; and(b) a beat sensitive device in thermal communication with said heat absorbing control device;wherein said aldehyde is supported in relation to said heat sensitive device, and wherein said aldehyde effects said level of heat absorption at least in part based on an irreversible decomposition of said aldehyde. 43. A combination according to claim 42, wherein said heat sensitive device is selected from the group consisting of a flight recorder, a metal structure, a plastic structure, an electronic device, an oven sensor, a missile skin, an exhaust pipe, a race car component, a fire wall, a nuclear reactor component, a gun, a munitions box, a battery and body protective structure. 44. A combination according to claim 42, wherein said heat absorbing control device includes a support means for supporting said aldehyde in relation to said heat sensitive device.