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A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion or electroless silver plate prior to soldering, after which immersion silver plate is treated with an alkaline polymer coating comprising aqueous vinyl polymers, aqueous

A method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion or electroless silver plate prior to soldering, after which immersion silver plate is treated with an alkaline polymer coating comprising aqueous vinyl polymers, aqueous acrylic polymers, anti-fungal agents and a benzotriazole or benzimidazole compound to produce a deposit that is resistant to electromigration and that provides an anti-tarnish and anti-corrosion coating on the surface.

대표청구항 ▼

1. A process for improving the resistance of a metal surface to electromigrate, while maintaining the solderability of the metal surface, comprising the steps ofa) contacting the metal surface with an immersion or electroless silver plating solution thereby producing silver plate upon the metal surf

1. A process for improving the resistance of a metal surface to electromigrate, while maintaining the solderability of the metal surface, comprising the steps ofa) contacting the metal surface with an immersion or electroless silver plating solution thereby producing silver plate upon the metal surface; andb) thereafter contacting the silver plated surface with a polymer coating solution comprising a material selected from the group consisting of vinyl copolymers, acrylic copolymers, vinyl polymers, acrylic polymers, and mixtures of the foregoing;wherein the silver plate has a lower tendency to electromigrate than the same silver plate without the treatment of step (b). 2. A process according to claim 1, wherein the metal surface comprises copper. 3. A process according to claim 1, wherein the vinyl copolymer or vinyl polymers are present in the solution in an aggregate amount of 20-50 percent by weight. 4. A process according to claim 1, wherein the vinyl copolymer or vinyl polymers are present in the solution in an aggregate amount of 30-45 percent by weight. 5. A process according to claim 1, wherein the acrylic copolymer or acrylic polymers are present in the solution in an aggregate amount of 5-30 percent by weight. 6. A process according to claim 1, wherein the acrylic copolymer or acrylic polymers are present in the solution in an aggregate amount of 30-45 percent by weight. 7. A process according to claim 1, wherein the coating solution also comprises a compound selected from the group consisting of triazoles, imidazoles and combinations of the foregoing. 8. A process according to claim 7, wherein the triazole or imidazole compound is selected from the group consisting of benzotriazole, benzimidazole, imidazole, histadine and combinations of the foregoing. 9. A process according to claim 7, wherein the triazole or imidazole compound is present in the solution in an amount of 0.5-5 percent by weight. 10. A process according to claim 1, wherein the polymer coating solution further comprises ammonia.